Copper foil composite

Patent metadata

Field	Value
Publication number	US-9549471-B2
Application number	US-201113579073-A
Country	US
Kind code	B2
Filing date	Jun 16, 2011
Priority date	Jul 15, 2010
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1: (f 3 ×t 3 )/(f 2 ×t 2 )=>1 is satisfied when t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2: 1<=33f 1 /(F×T) is satisfied when f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F (MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite.

First claim

What is claimed is:

1. A copper foil composite comprising a rolled copper foil and a resin layer laminated thereon as a three-layer structure of the resin layer/the copper foil/the resin layer or the copper foil/the resin layer/the copper foil, wherein equation 1: (f 3 ×t 3 )/(f 2 ×t 2 )≧1 is satisfied when t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4% upon a tensile test in a direction parallel to the rolling direction of the copper foil in accordance with JIS-Z2241, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4% upon a tensile test in a machine direction (MD) in accordance with JIS-Z2241, and equation 2: 1≦33f 1 /(F×T) is satisfied when f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer in accordance with JIS-05016 except that a copper foil surface of the composite is fixed on a SUS plate, and the resin layer is peeled in a direction at an angle of 180° instead of the copper foil layer being peeled in accordance with JIS-05016, wherein a test specimen of the composite has a width of 12.7 mm, F (MPa) is a stress of the copper foil composite under tensile strain of 30% upon a tensile test in a machine direction (MD) in accordance with JIS-Z2241, and T (mm) is a thickness of the copper foil composite, wherein the equations 1 and 2 are true at a temperature of 25° C. or more and lower than the glass transition temperature of the resin layer.

2. The copper foil composite according to claim 1 , wherein the resin layer comprises a polyimide or a polyethylene terephthalate.

3. The copper foil composite according to claim 1 , wherein the resin layer comprises a polyimide.

4. A molded product which is shaped by forming the copper foil composite according to claim 1 .

5. The copper foil composite according to claim 1 , wherein a ratio I/L of tensile breaking strain I of the copper foil composite to tensile breaking strain L of the resin layer alone is 0.7 to 1, wherein I and L are each obtained by the tensile test.

6. A molded product which is shaped by forming the copper foil composite according to claim 5 .

7. A method for manufacturing a molded product comprising the step of forming the copper foil composite according to claim 1 .

8. A method for manufacturing a molded product comprising the step of forming the copper foil composite according to claim 5 .

Assignees

• Kammuri Kazuki
• Jx Nippon Mining & Metals Corp

Inventors

• Kammuri Kazuki

Classifications

• B32B15/09

  comprising polyesters · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B15/085

  comprising polyolefins · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title