Oxide superconducting thin film wire and method for producing same

Patent metadata

Field	Value
Publication number	US-9978481-B2
Application number	US-201515123729-A
Country	US
Kind code	B2
Filing date	Mar 4, 2015
Priority date	Mar 7, 2014
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

First claim

The invention claimed is:

1. An oxide superconducting thin film wire comprising a metal substrate, a laminate, and a Cu stabilizing layer,
wherein the metal substrate includes a supporting base material and a conductive layer located on the supporting base material,
the conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer,
the laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate,
the Cu stabilizing layer is formed so as to surround the laminate and the metal substrate, and
at least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

2. The oxide superconducting thin film wire according to claim 1 , wherein at least one through hole is formed so as to extend from a surface of the laminate to the conductive layer of the metal substrate, and the Cu stabilizing layer is formed so as to be in contact with the conductive layer of the metal substrate through the through hole and be electrically conductive with the conductive layer of the metal substrate.

3. The oxide superconducting thin film wire according to claim 2 , wherein a width or diameter of the through hole is 0.1 to 0.5 mm.

4. The oxide superconducting thin film wire according to claim 1 , wherein the Cu stabilizing layer is in contact with at least a portion of a side end face of the Cu layer of the metal substrate and is electrically conductive with the Cu layer of the metal substrate.

5. The oxide superconducting thin film wire according to claim 1 , wherein at least one through hole is formed so as to extend from a surface of the laminate to the conductive layer of the metal substrate, and the Ag stabilizing layer is formed so as to be in contact with the conductive layer of the metal substrate through the through hole and be electrically conductive with the conductive layer of the metal substrate.

6. The oxide superconducting thin film wire according to claim 3 , wherein a width or diameter of the through hole is 0.1 to 0.5 mm.

7. The oxide superconducting thin film wire according to claim 1 , wherein the Ag stabilizing layer is in contact with at least a portion of a side end face of the Cu layer of the metal substrate and is electrically conductive with the Cu layer of the metal substrate.

8. A method for producing an oxide superconducting thin film wire, the method comprising:
a laminate-forming step of forming a laminate by forming a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer on a wide metal substrate in this order from the metal substrate, the metal substrate including a supporting base material and a conductive layer that is located on the supporting base material and includes a Cu layer serving as an internal layer and a biaxially orientated surface layer;
a slitting step of cutting the metal substrate and the laminate into a predetermined width;
a conductive layer-exposing step of exposing a portion of the conductive layer of the metal substrate from the slit metal substrate and laminate; and
a Cu stabilizing layer-forming step of forming a Cu stabilizing layer so that the Cu stabilizing layer surrounds the laminate and the metal substrate,
wherein in the Cu stabilizing layer-forming step, the Cu stabilizing layer is formed so as to be in contact with the exposed portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer.

9. The method for producing an oxide superconducting thin film wire according to claim 8 , wherein the conductive layer-exposing step is a conductive layer-exposing step of forming at least one through hole that extends from a surface of the slit laminate to the conductive layer of the metal substrate, and
in the Cu stabilizing layer-forming step, the Cu stabilizing layer is formed so as to be in contact with the conductive layer of the metal substrate through the through hole and be electrically conductive with the conductive layer of the metal substrate.

10. The method for producing an oxide superconducting thin film wire according to claim 9 , wherein a width or diameter of the through hole is 0.1 to 0.5 mm.

11. The method for producing an oxide superconducting thin film wire according to claim 8 , wherein the conductive layer-exposing step is a conductive layer-exposing step of exposing at least a portion of the Cu layer of the metal substrate from side end faces of the slit laminate and metal substrate, and
the Cu stabilizing layer-forming step is a Cu stabilizing layer-forming step of forming the Cu stabilizing layer so that the Cu stabilizing layer surrounds the laminate and the metal substrate to achieve electrical conduction between the exposed portion of the Cu layer of the metal substrate and the Cu stabilizing layer.

12. The method for producing an oxide superconducting thin film wire according to claim 11 , wherein in the conductive layer-exposing step, side end faces of the slit laminate and metal substrate are polished to expose at least a portion of the Cu layer of the metal substrate.

13. A method for producing an oxide superconducting thin film wire, the method comprising:
a laminate-forming step of forming a laminate by forming a buffer layer and an oxide superconducting layer on a wide metal substrate in this order from the metal substrate, the metal substrate including a supporting base material and a conductive layer that is located on the supporting base material and includes a Cu layer serving as an internal layer and a biaxially orientated surface layer;
a slitting step of cutting the metal substrate and the laminate into a predetermined width;
a conductive layer-exposing step of forming at least one through hole that extends from a surface of the slit laminate to the conductive layer of the metal substrate;
a Ag stabilizing layer-forming step of forming a Ag stabilizing layer on the laminate; and
a Cu stabilizing layer-forming step of forming a Cu stabilizing layer so that the Cu stabilizing layer surrounds the metal substrate and the laminate on which the Ag stabilizing layer has been formed,
wherein in the Ag stabilizing layer-forming step, the Ag stabilizing layer is formed so as to be in contact with the conductive layer of the metal substrate through the through hole and be electrically conductive with the conductive layer of the metal substrate.

14. The method for producing an oxide superconducting thin film wire according to claim 13 , wherein a width or diameter of the through hole is 0.1 to 0.5 mm.

15. A method for producing an oxide superconducting thin film wire, the method comprising:
a laminate-forming step of forming a laminate by forming a buffer layer and an oxide superconducting layer on a wide metal substrate in this order from the metal substrate, the metal substrate including a supporting base material and a conductive layer that is located on the supporting base material and includes a Cu layer serving as an internal layer and a biaxially orientated surface layer;
a slitting step of cutting the metal substrate and the laminate into a predetermined width;
a conductive layer-exposing step of exposing at least a portion of the Cu layer of the metal substrate from side end faces of the slit laminate and metal substrate;
a Ag stabilizing layer-forming step of forming a Ag stabilizing layer on the laminate and the metal substrate; and
a Cu sta

Assignees

• Sumitomo Electric Industries

Inventors

• Yamaguchi Takashi
• Nagaishi Tatsuoki
• Konishi Masaya
• Ohki Kotaro
• Honda Genki

Classifications

• H01B13/0036

  Details · CPC title

• H01F6/06

  Coils, e.g. winding, insulating, terminating or casing arrangements therefor · CPC title

• H01B12/04 Primary

  Single wire · CPC title

• H01L39/143

  Electricity · mapped topic

• H01L39/2461

  Electricity · mapped topic