Oxide superconductor wire and method of manufacturing oxide superconductor wire

Patent metadata

Field	Value
Publication number	US-9697930-B2
Application number	US-201414281249-A
Country	US
Kind code	B2
Filing date	May 19, 2014
Priority date	Nov 21, 2011
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An oxide superconductor wire includes: a tape-shaped oxide superconductor laminate that is formed by providing an intermediate layer on a front surface side of a metal tape-shaped substrate, providing an oxide superconductor layer on the intermediate layer, and providing a protective layer on the oxide superconductor layer; and a coating member that includes a metal tape and a low melting point metal layer, in which the metal tape has a wider width than that of the oxide superconductor laminate and covers the protective layer surface of the oxide superconductor laminate, both side surfaces of the oxide superconductor laminate, and both end portions of a substrate back surface side in a width direction thereof, and both end portions of the metal tape in a width direction thereof are provided to cover both the end portions of the substrate back surface.

First claim

What is claimed is:

1. An oxide superconductor wire comprising:
a tape-shaped oxide superconductor laminate including a metal tape-shaped substrate that has a substrate front surface and a substrate back surface, an intermediate layer that is provided on the substrate front surface, an oxide superconductor layer that is provided on the intermediate layer, and a protective layer that has a protective front surface and is provided on the oxide superconductor layer; and
a coating member that is formed of a metal tape and a low melting point metal layer,
wherein the metal tape has a wider width than that of the oxide superconductor laminate and covers the protective front surface, both side surfaces of the oxide superconductor laminate, and both end portions of the substrate back surface in a width direction thereof,
both end portions of the metal tape in a width direction thereof are provided to cover both the end portions of the substrate back surface, and a recessed portion is defined by the both end portions of the metal tape and the substrate back surface,
the low melting point metal layer fills gaps between the oxide superconductor laminate and the metal tape that is provided so as to surround the oxide superconductor laminate to join the metal tape and the oxide superconductor laminate to each other,
the low melting point metal layer covers tip portions of both end portions of the metal tape in the width direction, and a part of the low melting point metal layer extends from the tip portions of the both end portions of the metal tape toward the recessed portion, and
a total width of both end portions of the metal tape covering the end portions of the substrate back surface is 1.5 mm or greater.

2. The oxide superconductor wire according to claim 1 ,
wherein the part of the low melting metal layer extending to the recessed portion buries the recessed portion and thereby forms burying layer, and
the burying layer does not protrude outward from surface positions of both the end portions of the metal tape forming the recessed portion.

3. The oxide superconductor wire according to claim 2 ,
wherein a total width of both end portions of the metal tape covering the end portions of the substrate back surface is 1.5 mm or greater.

4. The oxide superconductor wire according to claim 1 ,
wherein a width of the recessed portion is 2.0 mm or less.

5. The oxide superconductor wire according to claim 2 ,
wherein a width of the recessed portion is 2.0 mm or less.

6. The oxide superconductor wire according to claim 1 ,
wherein the metal tape is a copper tape having a thickness of 15 μm or greater.

7. The oxide superconductor wire according to claim 2 ,
wherein the metal tape is a copper tape having a thickness of 15 μm or greater.

8. The oxide superconductor wire according to claim 2 ,
wherein the burying layer further includes another low melting point metal which is added from outside in addition to the part of the low melting point metal layer which fills the gaps between the oxide superconductor laminate and the metal tape.

9. The oxide superconductor wire according to claim 2 ,
wherein the burying layer is formed such that the surface of the burying layer is positioned further inside from the surface positions of both the end portions of the metal tape forming the recessed portion.

10. A superconducting coil comprising
the oxide superconductor wire according to claim 1 .

11. A superconducting cable comprising
the oxide superconductor wire according to claim 1 .

12. A method of manufacturing an oxide superconductor wire comprising:
preparing a tape-shaped oxide superconductor laminate that is formed by providing an intermediate layer on a front surface side of a metal tape-shaped substrate, providing an oxide superconductor layer on the intermediate layer, and providing a protective layer on the oxide superconductor layer, and preparing a metal tape that has a wider width than that of the oxide superconductor laminate and includes peripheral surfaces on which a low melting point metal plating layer is formed;
allowing the metal tape to cover the oxide superconductor laminate such that the protective layer surface of the oxide superconductor laminate, both side surfaces of the oxide superconductor laminate, and both end portions of a substrate back surface in a width direction thereof are covered with the metal tape, and thereby defining a recessed portion by both end portions of the metal tape and the substrate back surface; and
forming coating portions by heating the low melting point metal plating layer to a temperature to be in a melted state, pressing the low melting point metal layer with a roll such that gaps between the oxide superconductor laminate and the metal tape are buried with the low melting point metal layer, covering tip portions of both end portions of the metal tape in the width direction with the low melting point metal layer and allowing a part of the low melting point metal layer to extend from the tip portions of the both end portions of the metal tape toward the recessed portion,
wherein a total width of both end portions of the metal tape covering the end portions of the substrate back surface is 1.5 mm or greater.

13. The method of manufacturing an oxide superconductor wire according to claim 12 ,
wherein a recessed portion which is formed between both the end portions of the metal tape covering the end portions of the substrate back surface is covered with the part of the low melting point metal layer extending outward to form a burying layer, the burying layer does not protrude outward from an opening position of the recessed portion.

14. An oxide superconductor wire comprising:
a tape-shaped oxide superconductor laminate including a metal tape-shaped substrate that has a substrate front surface and a substrate back surface, an intermediate layer that is provided on the substrate front surface, an oxide superconductor layer that is provided on the intermediate layer, and a protective layer that has a protective front surface and is provided on the oxide superconductor layer; and
a coating member that is formed of a metal tape and a low melting point metal layer,
wherein the metal tape has a wider width than that of the oxide superconductor laminate and covers the protective front surface, both side surfaces of the oxide superconductor laminate, and both end portions of the substrate back surface in a width direction thereof,
both end portions of the metal tape in a width direction thereof are provided to cover both the end portions of the substrate back surface,
the low melting point metal layer fills gaps between the oxide superconductor laminate and the metal tape that is provided so as to surround the oxide superconductor laminate to join the metal tape and the oxide superconductor laminate to each other,
a part of the filled low melting point metal layer extends to a recessed portion that is formed between both the end portions of the metal tape in the width direction, and
an entire outer peripheral surface of the metal tape is covered with the low melting point metal layer.

Assignees

• Fujikura Ltd

Inventors

• Takemoto Tetsuo

Classifications

• H01B13/00

  Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title

• H01B12/06 Primary

  Films or wires on bases or cores · CPC title

• H01L39/143

  Electricity · mapped topic

• H01L39/248

  Electricity · mapped topic

• H10N60/203 Primary

  comprising high-Tc ceramic materials · CPC title