Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods and apparatus

Patent metadata

Field	Value
Publication number	US-9977340-B2
Application number	US-201113101663-A
Country	US
Kind code	B2
Filing date	May 5, 2011
Priority date	Jun 4, 2010
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

Diffraction models and scatterometry are used to reconstruct a model of a microscopic structure on a substrate. A plurality of candidate structures are defined, each represented by a plurality of parameters (p 1 , p 2 , etc.)). A plurality of model diffraction signals are calculated by simulating illumination of each of the candidate structures. The structure is reconstructed by fitting one or more of the model diffraction signals to a signal detected from the structure. In the generation of the candidate structures, a model recipe is used in which parameters are designated as either fixed or variable. Among the variable parameters, certain parameters are constrained to vary together in accordance with certain constraints, such as linear constraints. An optimized set of constraints, and therefore an optimized model recipe, is determined by reference to a user input designating one or more parameters of interest for a measurement, and by simulating the reconstruction process reconstruction. The optimized model recipe can be determined automatically by a parameter advisor process that simulates reconstruction of a set of reference structures, using a plurality of candidate model recipes. In the generation of the reference structures, restrictions can be applied to exclude unrealistic parameter combinations.

First claim

What is claimed is:

1. A method of determining one or more geometric properties of a structure based on radiation received from the structure, the method comprising:
receiving a substrate having the structure patterned upon it;
generating a signal, at a detector, based on receiving a beam of radiation arising from interaction of radiation with the structure under illumination;
generating a reference collection of model structures using a reference model recipe, wherein the reference model recipe has more degrees of freedom than are desired for a model recipe;
calculating a reference collection of model signals, by modeling the interaction of the radiation with each of the model structures in the reference collection;
generating, using one or more processors, a plurality of different candidate model recipes, each candidate model recipe comprising a set of one or more constraints, each constraint reducing a number of degrees of freedom in the given candidate model recipe by defining a relationship among a subset of variable parameters of the given candidate model recipe, wherein each constraint is applied such that the associated subset of variable parameters are constrained to vary together in accordance with the associated constraint;
calculating one or more model signals using a model structure generated with each of the candidate model recipes and comparing the one or more model signals to the reference collection of model signals from the reference collection to identify a best matching model signal for each of the candidate model recipes;
determining, using the one or more processors, one or more measurement parameters for each combination of candidate model recipes and model signals from the reference collection based on the model structure corresponding to the best matching model signal for each of the candidate model recipes;
selecting, from the candidate model recipes, a best model recipe by comparing the one or more measurement parameters from each combination of candidate model recipes and model signals from the reference collection with known parameter values of the model structures in the reference collection;
calculating one or more additional model signals using a model structure generated with the best model recipe;
comparing the one or more additional model signals to the signal generating by the detector to identify a best matching model signal for the structure under illumination;
determining one or more measurement parameters of the structure under illumination corresponding to the best matching model signal for the structure under illumination;
reporting, using the one or more processors, the one or more measurement parameters corresponding to the one or more geometric properties of the structure under illumination; and
adjusting one or more parameters of an exposure performed on a second substrate received by a lithographic apparatus based on the one or more measurement parameters.

2. The method of claim 1 , wherein the subset comprises more than two of the variable parameters.

3. The method of claim 1 , wherein the constraint defines a linear relationship between the variable parameters in the subset.

4. The method of claim 1 , wherein at least one parameter within the subset is designated a dependent parameter in accordance with the constraint and a dependency relation is defined between each dependent parameter and one or more of the other parameters in the subset, the dependency relation being used to calculate the dependent parameter from the other parameter or parameters, prior to calculation of the model signal.

5. The method of claim 1 , wherein a subset of one or more of the variable parameters are designated as parameters of interest for the method of measurement, and wherein in the selecting the measured parameter values compared are exclusively or predominantly those of the designated parameters of interest.

6. The method of claim 1 , wherein the providing a reference collection comprises providing a reference collection of model structures distributed in a parameter space defined by the variable parameters and the degrees of freedom of the mathematical model, and wherein the distribution of the candidate structures is restricted by reference to an inter-relationship between at least two of the degrees of freedom, by which certain combinations of values of the inter-related parameters are more likely than others to occur in a structure to be measured.

7. The method of claim 1 , wherein each candidate model recipe includes given dependencies between certain of the variable parameters, and wherein the set of one or more constraints are separate from the given dependencies.

8. The method of claim 1 , wherein the generating a reference collection of model structures and the calculating a reference collection of model signals are performed to create a library of pre-stored diffraction signals.

9. The method of claim 1 , wherein the generating a reference collection of model structures and the calculating a reference collection of model signals are performed in an iterative process.

10. The method of claim 1 , wherein the generating a reference collection of model structures and the calculating a reference collection of model signals are performed to create a library of pre-stored diffraction signals and subsequently the generating a reference collection of model structures and the calculating a reference collection of model signals are performed to generate further model structures and model signals as part of an iterative process.

11. The method of claim 1 , wherein at least one of the candidate model recipes generated has a further subset of parameters designated as fixed parameters.

12. The method of claim 11 , wherein different candidate model recipes have different subsets of parameters designated as fixed parameters.

13. An inspection apparatus integrated into a lithographic apparatus or a lithocell, the inspection apparatus being configured to determine one or more geometric properties of a structure on a substrate based on radiation received from the structure, the inspection apparatus comprising:
an illumination system configured to illuminate the structure on the substrate with one or more beams of radiation;
a detection system configured to detect a signal arising from interaction between the radiation and the structure; and
a processor configured to:
generate a reference collection of model structures using a reference model recipe, wherein the reference model recipe has more degrees of freedom than are desired for a model recipe;
calculate a reference collection of model signals, by modeling the interaction of the radiation with each of the model structures in the reference collection;
generate a plurality of different candidate model recipes, each candidate model recipe comprising a set of one or more constraints, each constraint reducing a number of degrees of freedom in the given candidate model recipe by defining a relationship among a subset of variable parameters of the given candidate model recipe, wherein each constraint is applied such that the associated subset of variable parameters are constrained to vary together in accordance with the associated constraint,
calculate one or more model signals using a model structure generated with each of the candidate model recipes and comparing the one or more model signals to the reference collection of model signals from the reference collection to identify a best matching model signal for each of the candidate model recipes;
determine, using the one or more processors, one or more measurement parameters for each combination of candidate model recipes and m

Assignees

• Aben Maria Johanna Hendrika
• Cramer Hugo Augustinus Joseph
• Wright Noelle Martina
• Alvarez Sanchez Ruben
• Slob Martijn Jaap Daniel
• Asml Netherlands Bv

Inventors

• Aben Maria Johanna Hendrika
• Cramer Hugo Augustinus Joseph
• Wright Noelle Martina
• Alvarez Sanchez Ruben
• Slob Martijn Jaap Daniel

Classifications

• G03F7/70625

  Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title

• G03F7/70483

  Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring · CPC title

• G03F7/70491

  Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes · CPC title

• G03F7/70633 Primary

  Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title

• G03F7/705

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title