Circuit board and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-9974171-B2
Application number	US-201514943747-A
Country	US
Kind code	B2
Filing date	Nov 17, 2015
Priority date	May 23, 2013
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

First claim

What is claimed is:

1. A circuit board, comprising:
an aluminum-based substrate;
an alumina layer formed on at least one surface of the aluminum-based substrate, wherein the alumina layer includes a circuit pattern formed by irradiation of an energy beam; and
a circuit layer formed on the circuit pattern of the alumina,
wherein the alumina layer comprises alumina and at least one element selected from chromium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, thulium, ytterbium, lutetium, scandium, or a combination thereof.

2. The circuit board according to claim 1 , wherein a content of the element in the alumina layer ranges from 0.001 wt % to 20 wt %.

3. The circuit board according to claim 1 , wherein the content of the element in the alumina layer ranges from 0.01 wt % to 1 wt %.

4. The circuit board according to claim 1 , wherein a thickness of the alumina layer ranges from 10 μm to 300 μm.

5. The circuit board according to claim 1 , wherein the thickness of the alumina layer ranges from 50 μm to 100 μm.

6. The circuit board according to claim 1 , wherein the alumina layer is sealed with a sealing agent.

7. The circuit board according to claim 6 , wherein the sealing agent is selected from one or more dichromate, one or more nickel salt, one or more rare earth metal salt, or a combination thereof.

8. The circuit board according to claim 6 , wherein the sealing agent is selected from potassium dichromate, sodium dichromate, nickel fluoride, nickel acetate, nickel sulfate, or a combination thereof.

Assignees

• Byd Co Ltd

Inventors

• Xu Qiang
• Lin Xinping

Classifications

• H05K2201/0116

  Porous, e.g. foam · CPC title

• C23C18/1612

  through irradiation means · CPC title

• H05K1/053 Primary

  the metal substrate being covered by an inorganic insulating layer · CPC title

• C23C18/40

  using reducing agents · CPC title

• H05K2203/1147

  Sealing or impregnating, e.g. of pores · CPC title