Method of manufacturing printed circuit board
US-2024414849-A1 · Dec 12, 2024 · US
Method of manufacturing a hybrid heat-radiating substrate
US9107313B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9107313-B2 |
| Application number | US-201314133157-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 18, 2013 |
| Priority date | Jun 15, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a hybrid heat-radiating substrate, comprising: providing a metal core member; forming an oxide insulating core layer by performing volume anodizing on the metal core member in a thickness direction; forming an oxide insulating layer by performing surface anodizing on one surface or both surfaces of the metal core member; and forming a circuit layer that is configured to include first circuit patterns positioned on the oxide in…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9107313B2 cover?
- Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit lay…
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H05K3/10. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).