Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9974169-B2
Application number	US-201615501654-A
Country	US
Kind code	B2
Filing date	Jan 27, 2016
Priority date	Feb 3, 2015
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1):

wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

First claim

The invention claimed is:

1. A resin composition comprising:
a cyanate compound (A);
a maleimide compound (B); and
a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1):

wherein R is a hydrogen atom or a substituent selected from the group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

2. The resin composition according to claim 1 , wherein
the benzoguanamine compound (C) comprises a m-aminomethylbenzoguanamine and/or p-aminomethylbenzoguanamine.

3. The resin composition according to claim 1 , wherein
a content of the benzoguanamine compound (C) is 0.5 to 30 parts by mass based on 100 parts by mass of resin solid components.

4. The resin composition according to claim 1 , further comprising:
a filler (D).

5. The resin composition according to claim 1 , further comprising:
one or more components selected from the group consisting of an epoxy resin, a phenolic resin, an oxetane resin, a benzoxazine resin, and a compound having a polymerizable unsaturated group.

6. The resin composition according to claim 4 , wherein
a content of the filler (D) is 50 to 1600 parts by mass based on 100 parts by mass of the resin solid components.

7. A prepreg comprising:
a base material; and
the resin composition according to claim 1 with which the base material is impregnated or coated.

8. A metal foil-clad laminate comprising:
the prepreg according to claim 7 or a laminate of two or more of the prepregs; and
metal foil disposed on one surface or both surfaces of the prepreg or the laminate.

9. A resin composite sheet comprising:
a support; and
the resin composition according to claim 1 with which the support is coated and which is dried.

10. A printed wiring board comprising:
an insulating layer; and
a conductor layer formed on a surface of the insulating layer, wherein
the insulating layer comprises the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kobayashi Takashi
• Takano Kentaro
• Hiramatsu Sotaro

Classifications

• C08G8/28

  Chemically modified polycondensates · CPC title

• D06M15/564

  Polyureas, polyurethanes or other polymers having ureide or urethane links; Precondensation products forming them · CPC title

• C08J2375/12

  from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2260/046

  Synthetic resin · CPC title