Dual overmolded reconstructed camera module

Patent metadata

Field	Value
Publication number	US-9973669-B2
Application number	US-201514839759-A
Country	US
Kind code	B2
Filing date	Aug 28, 2015
Priority date	Aug 28, 2015
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

An apparatus and method of producing a dual overmolded camera module. The dual overmolded camera module including a dual overmolded image sensor module having a first image sensor device and a second image sensor device spaced from one another in an x-direction at a predetermined alignment distance, and wherein at least one of the first image sensor device and the second image sensor device have a conductive via formed therethrough and a redistribution layer along at least one side. The dual overmolded camera module further including a first lens assembly and a second lens assembly mounted over respective ones of the first image sensor device and the second image sensor device, and wherein both the first lens assembly and the second lens assembly are aligned with a common target.

First claim

What is claimed is:

1. A dual overmolded camera module comprising:
a dual overmolded image sensor module having an overmold casing molded to a first image sensor device and a second image sensor device, the first image sensor device and the second image sensor device spaced from one another in an x-direction at a predetermined alignment distance by the overmold casing positioned between the first image sensor device and the second image sensor device, and wherein at least one of the first image sensor device and the second image sensor device have a conductive via formed therethrough and a redistribution layer along at least one side; and
a first lens assembly and a second lens assembly are positioned on, and mounted to, the overmold casing molded to the first image sensor device and the second image sensor device, and wherein the first lens assembly and the second lens assembly are optically aligned with a common target.

2. The dual overmolded camera module of claim 1 wherein each of the first image sensor device and the second image sensor device comprise a microelectronic die through which the conductive via is formed, an image sensor positioned along a top side of the microelectronic die, and a transparent member positioned over a side of the image sensor opposite the microelectronic die, and wherein the overmold casing directly contacts the top side of the microelectronic die and a portion of the transparent member of the first image sensor device and the second image sensor device.

3. The dual overmolded camera module of claim 1 wherein each of the first image sensor device and the second image sensor device comprise a microelectronic die having a top side and a sidewall perpendicular to the top side, an image sensor positioned along the top side, and the sidewall of the microelectronic die of the first image sensor device faces the sidewall of the microelectronic die of the second image sensor device, and the overmold casing directly contacts the sidewalls such that the predetermined alignment distance between the first image sensor device and the second image sensor device is fixed.

4. The dual overmolded camera module of claim 1 wherein the first image sensor device and the second image sensor device are aligned with one another at a predetermined alignment distance in a y-direction.

5. The dual overmolded camera module of claim 1 wherein the first image sensor device and the second image sensor device are level with one another in a z-direction.

6. The dual overmolded camera module of claim 1 wherein the first lens assembly has a first fixed focal length and the second lens assembly has a second fixed focal length.

7. The dual overmolded camera module of claim 6 wherein the first fixed focal length is different than the second fixed focal length.

8. The dual overmolded camera module of claim 6 wherein the first fixed focal length is longer than the second fixed focal length.

9. A dual overmolded camera module comprising:
a first image sensor device and a second image sensor device molded within a mold material at a predetermined separation in an x-direction, and each of the first image sensor device and the second image sensor device comprising a microelectronic die through which a conductive via is formed, and an image sensor positioned along a top side of the microelectronic die, and wherein the mold material directly contacts, and forms a casing that conforms to, the top side and a sidewall of the microelectronic die of each of the first image sensor device and the second image sensor device; and
a first lens assembly and a second lens assembly are positioned over the first image sensor device and the second image sensor device, respectively, to form a dual overmolded camera module, and wherein an optical axis of each of the first lens assembly and the second lens assembly are aligned with a common alignment target.

10. The dual overmolded camera module of claim 9 wherein the dual overmolded camera module is one inseparable unit operable to be positioned as one inseparable unit within an electronic device.

11. The dual overmolded camera module of claim 9 wherein the first image sensor device and the second image sensor device are maintained at the predetermined separation in the x-direction within the dual overmolded camera module by the mold material.

12. The dual overmolded camera module of claim 9 wherein the sidewall of the first image sensor device faces the sidewall of the second image sensor device, and the casing occupies an entire space between the first image sensor device and the second image sensor device within the dual overmolded camera module.

13. The dual overmolded camera module of claim 9 wherein the first image sensor device and the second image sensor device are aligned with respect to one another in a y-direction within the dual overmolded camera module.

Assignees

• Apple Inc

Inventors

• Vittu Julien C

Classifications

• G02B13/16 Primary

  for use in conjunction with image converters or intensifiers {, or for use with projectors, e.g. objectives for projection TV} · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title