Method for forming a semiconductor device and a semiconductor device

Patent metadata

Field	Value
Publication number	US-9972704-B2
Application number	US-201514935830-A
Country	US
Kind code	B2
Filing date	Nov 9, 2015
Priority date	Nov 14, 2014
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A method for forming a semiconductor device comprises implanting a defined dose of protons into a semiconductor substrate and tempering the semiconductor substrate according to a defined temperature profile. At least one of the defined dose of protons and the defined temperature profile is selected depending on a carbon-related parameter indicating information on a carbon concentration within at least a part of the semiconductor substrate.

First claim

What is claimed is:

1. A method for forming a semiconductor device, the method comprising:
providing a semiconductor substrate having a carbon concentration within at least a part of the semiconductor substrate;
determining a carbon-related parameter by performing a measurement indicating information on the carbon concentration within the at least a part of the semiconductor substrate;
implanting a defined dose of protons into a semiconductor substrate; and
tempering the semiconductor substrate according to a defined temperature profile
wherein at least one of the defined dose of protons and the defined temperature profile is dependent upon the carbon-related parameter.

2. The method according to claim 1 , wherein the carbon concentration within at least one part of the semiconductor substrate is higher than 1*10 15 cm −3 .

3. The method according to claim 1 , further comprising incorporating carbon into at least one part of the semiconductor substrate before implanting the defined dose of protons.

4. The method according to claim 3 , wherein incorporating the carbon comprises implanting carbon or diffusing carbon into at least one part of the semiconductor substrate.

5. The method according to claim 3 , wherein incorporating the carbon comprises diffusing carbon into at least one part of the semiconductor substrate, wherein more carbon than the solubility of carbon at room temperature in the semiconductor substrate is provided during the diffusion process.

6. The method according to claim 1 , further comprising diffusing carbon out of the semiconductor substrate by tempering the semiconductor substrate according to a defined diffusion temperature profile.

7. The method according to claim 1 , further comprising incorporating the carbon during crystal growth or during deposition of an epitaxial layer into the at least one part of the semiconductor substrate with a defined carbon distribution.

8. The method according to claim 1 , wherein the defined dose of protons is higher than 1*10 14 cm −2 .

9. The method according to claim 1 , wherein the defined temperature profile comprises a maximal temperature of less than 500° C.

10. The method according to claim 1 , wherein the subsequent manufacturing processes of the semiconductor device are performed at temperatures below 500° C. after the implant of the defined dose of protons.

11. The method according to claim 1 , wherein determining the carbon related parameter comprises measuring a carbon concentration of at least a part of the semiconductor substrate or a carbon concentration of at least a part of another semiconductor substrate manufactured together with the semiconductor substrate of the semiconductor device to be formed.

12. The method according to claim 1 , further comprising implanting electrons, alpha particles, helium or further protons into the semiconductor substrate with a defined energy distribution to generate interstitial semiconductor atoms with a defined depth distribution.

13. The method according to claim 1 , wherein the defined dose of protons is implanted into the semiconductor substrate to generate a defined concentration of interstitial carbon in the at least one part of the semiconductor substrate.

14. The method according to claim 1 , wherein implanting the defined dose of protons into the semiconductor substrate comprises implanting a defined dose of protons into a drift layer region of the semiconductor device to be formed.

15. The method according to claim 14 , further comprising implanting or diffusing carbon into a field stop layer region of the semiconductor device to be formed so that an average carbon concentration within the drift layer region is lower than an average carbon concentration within the field stop layer region.

16. The method according to claim 1 , wherein the carbon-related parameter is a CiOi concentration or an absorption constant, wherein the-CiOi concentration is determined by a deep-level transient spectroscopy measurement, and wherein the absorption constant is determined by an infrared measurement.

Assignees

• Infineon Technologies Ag

Inventors

• Jelinek Moriz
• Laven Johannes Georg
• Oefner Helmut
• Schulze Hans-Joachim
• Schustereder Werner

Classifications

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P34/40

  with high-energy radiation · CPC title