Apparatus for liquid treatment of wafer shaped articles

US9972514B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9972514-B2
Application numberUS-201615063349-A
CountryUS
Kind codeB2
Filing dateMar 7, 2016
Priority dateMar 7, 2016
Publication dateMay 15, 2018
Grant dateMay 15, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment assembly is mounted above the upper surface of the spin chuck and underlying a wafer-shaped article when mounted on the spin chuck. The treatment assembly extends parallel to the upper surface from an axis of rotation of the spin chuck radially to a distance that is at least half the predetermined diameter. The spin chuck comprises upwardly projecting gripping pins configured to hold a wafer-shaped article in position, wherein the gripping pins do not pass through the treatment assembly.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for treating a wafer-shaped article, comprising: a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck; and a treatment assembly mounted above said upper surface of said spin chuck and underlying a the wafer-shaped article when mounted on the spin chuck, the treatment assembly extending parallel to said upper surface from an axis of rotation of said spin chuck radially to a distance that is at least half said predetermined diameter; said spin chuck comprising upwardly projecting gripping pins configured to hold a the wafer-shaped article in said position, wherein said gripping pins do not pass through said treatment assembly, wherein said gripping pins are mounted for pivotal movement relative to said spin chuck about respective vertical axes, at least one of said vertical axes intersecting said treatment assembly. 2. The apparatus according to claim 1 , wherein the treatment assembly is stationary in relation to rotation of said spin chuck. 3. The apparatus according to claim 1 , wherein said spin chuck comprises a stationary central post and a chuck body rotatably mounted on said stationary central post. 4. The apparatus according to claim 3 , wherein said treatment assembly is rigidly secured to an upper end of said stationary central post. 5. The apparatus according to claim 1 , wherein said gripping pins each comprise a lower portion underlying said treatment assembly, an intermediate portion positioned radially outside of said treatment assembly, and an upper portion including a gripping end that overlies said treatment assembly. 6. The apparatus according to claim 5 , wherein each of said gripping pins is mounted for pivotal movement relative to said spin chuck about a their respective vertical axis that passes through said upper and lower portions of said gripping pin but does not pass through said intermediate portion. 7. The apparatus according to claim 6 , wherein each of said gripping pins is configured for pivoting movement between a closed position in which said gripping end occupies a radially innermost position with respect to said treatment assembly and said intermediate portion occupies a radially outermost position with respect to said treatment assembly, and an open position in which said gripping end occupies a radially outermost position with respect to said treatment assembly and said intermediate portion occupies a radially innermost position with respect to said treatment assembly. 8. The apparatus according to claim 5 , wherein a peripheral region of said treatment assembly is positioned between said upper and lower portions of said gripping pins, and wherein an outer periphery of said treatment assembly is oriented parallel to said intermediate portions. 9. The apparatus according to claim 1 , wherein said treatment assembly extends parallel to said upper surface over a distance that is greater than or equal to said predetermined diameter. 10. The apparatus according to claim 1 , wherein said treatment assembly comprises LED heating elements. 11. The apparatus according to claim 1 , wherein said treatment assembly comprises one or more infrared heating elements. 12. The apparatus according to claim 4 , wherein said stationary central post comprises at least one conduit communicating with an interior of said treatment assembly. 13. The apparatus according to claim 1 , further comprising a ring gear in meshing engagement with all of said gripping pins, such that relative rotation between said spin chuck and said ring gear pivots said gripping pins in unison about their respective vertical axes.

Assignees

Inventors

Classifications

  • characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

  • using mainly spraying means, e.g. nozzles · CPC title

  • mainly by radiation · CPC title

  • Electricity · mapped topic

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US9972514B2 cover?
An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment assembly is mounted above the upper surface of the spin chuck and underlying a wafer-shaped article w…
Who is the assignee on this patent?
Lam Res Ag
What technology area does this patent fall under?
Primary CPC classification H10P72/0436. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 15 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).