Integrated optical sub-assembly

Patent metadata

Field	Value
Publication number	US-9971088-B2
Application number	US-201214390587-A
Country	US
Kind code	B2
Filing date	Apr 16, 2012
Priority date	Apr 16, 2012
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

An optical subassembly includes a thru optical via ( 104 ) formed through a semiconductor substrate ( 102 ), an optoelectronic component ( 108 ) secured to the substrate ( 102 ) such that an active region ( 106 ) of the optoelectronic component is aligned with the thru optical via ( 104 ), and circuitry ( 110 ) formed into the substrate ( 102 ), the circuitry to connect to and operate in accordance with the optoelectronic component ( 108 ).

First claim

What is claimed is:

1. An optical assembly comprising:
a heat sink;
a printed circuit board disposed around the heat sink;
a semiconductor substrate;
a thru optical via formed completely through the semiconductor substrate;
an optoelectronic component supported by the heat sink and having an active region;
a securing mechanism including conductive pads formed on the semiconductor substrate, conductive pads formed on the optoelectronic component, and conductive material to secure said optoelectronic component to said substrate, the size, shape, and material of the conductive pads and conductive material to provide tension to align the active region of said optoelectronic component with said thru optical via;
circuitry formed within said substrate, said circuitry to electrically connect to said optoelectronic component through the securing mechanism and amplify electrical signals from said optoelectronic component;
a driver circuit disposed on an underside of the printed circuit board and conductively connected to the circuitry; and
optical transmission media optically coupled to the thru optical via.

2. The assembly of claim 1 , wherein said optoelectronic component comprises a light receiving device.

3. The assembly of claim 2 , wherein said circuitry comprises a trans-impedance amplifier to amplify the electrical signals from said light receiving device.

4. The assembly of claim 1 , wherein said optoelectronic component comprises a light emitting component.

5. The assembly of claim 4 , wherein said circuitry is to drive said light emitting component.

6. The assembly of claim 1 , wherein said circuitry is connected to digital circuitry not formed within said substrate through the securing mechanism.

7. A method of forming an optical assembly comprising:
providing a circuit board fitted around a heat sink;
mounting an optoelectronic component to the heat sink;
forming a thru optical via completely through a semiconductor substrate;
forming a circuitry block within said semiconductor substrate, said circuitry block to amplify electrical signals from the optoelectronic component;
forming conductive pads on the semiconductor substrate;
forming conductive pads on the optoelectronic component;
securing, with conductive material between corresponding conductive pads on the semiconductor substrate and on the optoelectronic component, said optoelectronic component to said semiconductor substrate;
aligning, via tension between the conductive pads and the conductive material, an active region of said optoelectronic component with said thru optical via, the tension controlled by the size, shape, and material of the conductive pads and conductive material;
electrically connecting, with the conductive pads and conductive material, said circuitry block to said optoelectronic component;
disposing a driver circuit on the printed circuit board;
conductively connecting the driver circuit to the circuitry block; and
optically coupling optical transmission media to the thru optical via.

8. The method of claim 7 , wherein said optoelectronic component comprises a light receiving device.

9. The method of claim 8 , wherein said circuitry block comprises a trans-impedance amplifier to amplify the electrical signals from said light receiving device.

10. The method of claim 7 , wherein said optoelectronic component comprises a light emitting component.

11. The method of claim 10 , wherein said circuitry block is to drive said light emitting component.

12. The method of claim 7 , wherein said circuitry block is connected to said optoelectronic component through a securing mechanism used to secure said optoelectronic component to said substrate.

13. The method of claim 7 , wherein said circuitry block is connected to digital circuitry not formed within said substrate through a securing mechanism.

14. An optical assembly comprising:
a heat sink;
a printed circuit board disposed around the heat sink;
a semiconductor substrate;
an array of thru optical vias formed completely through the semiconductor substrate;
an optoelectronic component supported by the heat sink and having an array of active regions corresponding with said array of thru optical vias;
a securing mechanism including conductive pads formed on the semiconductor substrate, conductive pads formed on the optoelectronic component, and conductive material to secure said optoelectronic component to said substrate, the size, shape, and material of the conductive pads and conductive material to provide tension to align said array of active regions with said array of thru optical vias;
an array of circuitry blocks formed within said substrate, one circuitry block for each of said active regions, said circuitry blocks to electrically connect to said optoelectronic component through the securing mechanism and amplify electrical signals from said optoelectronic component;
a driver circuit disposed on an underside of the printed circuit board and conductively connected to the circuitry blocks; and
optical transmission media optically coupled to the optical vias.

15. The optical assembly of claim 14 , wherein said optoelectronic component comprises light receiving devices.

16. The optical assembly of claim 14 , wherein said array of circuitry blocks comprises trans-impedance amplifiers to amplify electrical signals from said light receiving devices.

17. The optical assembly of claim 14 , wherein said optoelectronic component comprises light emitting components.

18. The optical assembly of claim 14 , wherein said array of circuitry blocks is to drive said light emitting components.

Assignees

• Rosenberg Paul Kessler
• Tan Michael Renne Ty
• Mathai Sagi Varghese
• Straznicky Joseph
• Hewlett Packard Entpr Dev Lp

Inventors

• Rosenberg Paul Kessler
• Tan Michael Renne Ty
• Mathai Sagi Varghese
• Straznicky Joseph

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• G02B6/4279

  Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations · CPC title

• Y10T29/41

  Cross-Sectional Technologies · mapped topic

• G02B6/424

  Mounting of the optical light guide · CPC title

• G02B6/4245

  Mounting of the opto-electronic elements · CPC title