Actively Tunable Polar-Dielectric Optical Devices
US-2016103341-A1 · Apr 14, 2016 · US
US9971071B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9971071-B2 |
| Application number | US-201715794207-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 26, 2017 |
| Priority date | Jan 29, 2016 |
| Publication date | May 15, 2018 |
| Grant date | May 15, 2018 |
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IR emission devices comprising an array of polaritonic IR emitters arranged on a substrate, where the emitters are coupled to a heater configured to provide heat to one or more of the emitters. When the emitters are heated, they produce an infrared emission that can be polarized and whose spectral emission range, emission wavelength, and/or emission linewidth can be tuned by the polaritonic material used to form the elements of the array and/or by the size and/or shape of the emitters. The IR emission can be modulated by the induction of a strain into a ferroelectric, a change in the crystalline phase of a phase change material and/or by quickly applying and dissipating heat applied to the polaritonic nanostructure. The IR emission can be designed to be hidden in the thermal background so that it can be observed only under the appropriate filtering and/or demodulation conditions.
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What is claimed is: 1. An infrared (IR) emission device, comprising: a substrate; a plurality of fabricated nano-scale polaritonic material structures arranged on a first thermal dissipation layer disposed between the substrate and the polaritonic material structures, the polaritonic material structures comprising at least one ferroelectric material; an electrical power source configured to induce a strain in the ferroelectric material; and a heater configured to apply heat to at least one of the polaritonic material structures; wherein the heater comprises a layer of a doped semiconductor that is optically transparent in the IR; wherein heat from the heater causes the at least one polaritonic material structure to produce an IR emission; and wherein a predetermined wavelength, a predetermined linewidth, or a predetermined amplitude of the IR emission from the at least one polaritonic material structure can be obtained by an application of a predetermined electrical bias from the electrical power source to the ferroelectric material. 2. The IR emission device according to claim 1 , wherein the at least one polaritonic material structure comprises a polaritonic core having a ferroelectric material coating thereon. 3. The IR emission device according to claim 2 , wherein the polaritonic core is silicon carbide (SiC) and the ferroelectric material coating is aluminum nitride (AlN). 4. The IR emission device according to claim 1 , wherein the at least one polaritonic material structure comprises a polaritonic ferroelectric material. 5. The IR emission device according to claim 4 , wherein the polaritonic ferroelectric material is AlN or barium strontanate. 6. The IR emission device according to claim 4 , wherein at least some of the polaritonic material structures are coated with a second thermal dissipation layer. 7. The IR emission device according to claim 1 , wherein the array of fabricated nano-scale polaritonic material structures comprises an array of silicon carbide bowtie nanoantennas. 8. The IR emission device according to claim 1 , wherein the heater comprises GaN, InN, indium tin oxide (ITO), or ZnO. 9. An infrared (IR) emission device, comprising: a substrate; a plurality of fabricated nano-scale polaritonic material structures arranged on a first thermal dissipation layer disposed between the substrate and the polaritonic material structures, the polaritonic material structures comprising at least one phase change material; and a heater configured to apply heat to at least one of the polaritonic material structures; wherein the heater comprises a layer of a doped semiconductor that is optically transparent in the IR; wherein heat from the heater causes the at least one polaritonic material structure to produce an IR emission; and wherein a predetermined wavelength, a predetermined linewidth, or a predetermined amplitude of the IR emission from the at least one polaritonic material structure can be obtained by changing the local dielectric function of the phase change material in a predetermined manner. 10. The IR emission device according to claim 9 , wherein the local dielectric function of the phase change material is changed by a predetermined heating of at least one of the polaritonic material structures. 11. The IR emission device according to claim 9 , wherein the local dielectric function of the phase change material is changed by a predetermined laser excitation of at least one of the polaritonic material structures. 12. The IR emission device according to claim 9 , further comprising a voltage source configured to apply an electrical bias to the at least one of the phase change material structures; wherein the local dielectric function of the phase change material is changed by an application of a predetermined voltage bias to the phase change material. 13. The IR emission device according to claim 9 , wherein the at least one polaritonic material structure comprises a polaritonic core having a phase change material coating thereon. 14. The IR emission device according to claim 13 , wherein the polaritonic core is silicon carbide (SiC) and the phase change material is vanadium oxide (VO 2 ), vanadium pentoxide (V 2 O 5 ), germanium-antimony-tellurium (GeSbTe), or tungsten trioxide (WO 3 ). 15. The IR emission device according to claim 9 , wherein the at least one polaritonic material structure comprises a polaritonic phase change material. 16. The IR emission device according to claim 15 , wherein the polaritonic phase change material is vanadium dioxide (VO 2 ) or vanadium pentoxide (V 2 O 5 ). 17. The IR emission device according to claim 15 , wherein at least some of the polaritonic material structures are coated with a second thermal dissipation layer. 18. The IR emission device according to claim 9 , wherein the array of fabricated nano-scale polaritonic material structures comprises an array of silicon carbide bowtie nanoantennas. 19. The IR emission device according to claim 9 , wherein the heater comprises GaN, InN, indium tin oxide (ITO), or ZnO. 20. An infrared (IR) emission device, comprising: a substrate; a plurality of fabricated nano-scale polaritonic material structures arranged on a first thermal dissipation layer disposed between the substrate and the polaritonic material structures, at least some of the polaritonic material structures being coated with a second thermal dissipation layer; and a heater configured to apply heat to at least one of the polaritonic material structures; wherein the heater comprises a layer of a doped semiconductor that is optically transparent in the IR; wherein heat from the heater causes the at least one polaritonic material structure to produce an IR emission; and wherein a predetermined amplitude, a predetermined wavelength, or a predetermined linewidth of the IR emission from the at least one polaritonic material structure can be obtained by selectively applying heat to and removing heat from the at least one polaritonic material structure. 21. The IR emission device according to claim 20 , wherein the first or second thermal dissipation layer is nanodiamond or boron arsenide. 22. The IR emission device according to claim 20 , wherein the heater comprises GaN, InN, indium tin oxide (ITO), or ZnO. 23. An infrared (IR) emission device, comprising: a substrate; a plurality of fabricated polaritonic material structures arranged on a thermal dissipation layer disposed between the substrate and the polaritonic material structures; and a heater configured to apply heat to at least one of the polaritonic material structures; wherein the heater comprises a layer of a doped semiconductor that is optically transparent in the IR; wherein heat from the heater causes the at least one polaritonic material structure to produce an IR emission; and wherein at least one of a predetermined amplitude, a predetermined wavelength, and a predetermined linewidth of the IR emission can be obtained by selectively applying heat to and removing heat from the at least one polaritonic material structure. 24. The IR emission device according to claim 23 , wherein the thermal dissipation layer is nanodiamond or boron arsenide. 25. The IR emission device according to claim 23 , wherein the heater comprises GaN, InN, indium tin oxide (ITO), or ZnO. 26. An infrared (IR) emission device, comprising: a substrate; a first plurality of
Electricity · mapped topic
Electricity · mapped topic
Surface plasmon devices (diffractive gratings with a pitch less than or comparable to the wavelength G02B5/1809; surface plasmons in integrated optics G02B6/1226; optical analysis of materials by means of surface plasmons G01N21/553) · CPC title
comprising refractory metals, transition metals, noble metals, metal compounds or metal alloys, e.g. silicides · CPC title
for measurement in the infrared range · CPC title
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