Hot-melt adhesive composition

Patent metadata

Field	Value
Publication number	US-9969911-B2
Application number	US-201415031224-A
Country	US
Kind code	B2
Filing date	Oct 20, 2014
Priority date	Oct 25, 2013
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

Provided are an adhesive composition suitable for a hot-melt adhesive which has a low tack and which after adhering to an adherend and through heat treatment comes to have sufficient adhesive force; and an adhesive product using the adhesive composition. The hot-melt adhesive composition includes an acrylic block copolymer (I) having at least one polymer block (A) including methacrylic acid ester units and at least one polymer block (B) including acrylic acid ester units, wherein the acrylic acid ester units constituting the polymer block (B) contain an acrylic acid ester (1) represented by CH 2 ═CH—COOR 1 (1) (wherein R 1 is an organic group having 1 to 3 carbon atoms) and an acrylic acid ester (2) represented by CH 2 ═CH—COOR 2 (2) (wherein R 2 is an organic group having 4 to 12 carbon atoms), and a mass ratio (1)/(2) of the acrylic acid ester (1) to the acrylic acid ester (2) is 90/10 to 25/75.

First claim

The invention claimed is:

1. A hot-melt adhesive composition comprising an acrylic block copolymer (I) having at least one polymer block (A) comprising methacrylic acid ester units and at least one polymer block (B) comprising acrylic acid ester units,
wherein:
the acrylic acid ester units of the polymer block (B) are prepared from an acrylic acid ester (1) which is methyl acrylate and an acrylic acid ester (2) represented by formula CH 2 ═CH—COOR 2 , wherein R 2 is an organic group having 4 to 12 carbon atoms,
a mass ratio (1)/(2) of the acrylic acid ester (1) to the acrylic acid ester (2) is in a range of 90/10 to 25/75, and
the acrylic block copolymer (I) has a structure of a linear block copolymer, and has a ratio, Mw/Mn, of a weight-average molecular weight, Mw, to a number-average molecular weight, Mn, in a range of 1.0 to 1.5.

2. The hot-melt adhesive composition according to claim 1 , wherein the polymer block (B) in the acrylic block copolymer (I) has a glass transition temperature of −30 to 30° C., and the polymer block (A) in the acrylic block copolymer (I) has a glass transition temperature of 80 to 140° C.

3. The hot-melt adhesive composition according to claim 1 , wherein the acrylic block copolymer (I) has at least one peak temperature of tan δ, loss shear modulus/storage shear modulus, present in the range of from −20 to 40° C., the tan δ being determined from dynamic viscoelasticity in torsional vibration.

4. The hot-melt adhesive composition according to claim 1 , wherein the acrylic block copolymer (I) has a complex viscosity at 130° C. of not more than 15,000 Pa·s as measured with a torsion-type dynamic viscoelasticity measuring instrument.

5. The hot-melt adhesive composition according to claim 1 , wherein the acrylic block copolymer (I) has a weight-average molecular weight, Mw, of 30,000 to 300,000.

6. The hot-melt adhesive composition according to claim 1 , wherein the acrylic acid ester (2) is n-butyl acrylate or 2-ethylhexyl acrylate.

7. The hot-melt adhesive composition according to claim 1 , which is subjected to thermosensitive adhesion processing or hot-melt coating processing at a temperature not higher than 140° C.

8. The hot-melt adhesive composition according to claim 1 , wherein a content of the acrylic block copolymer (I) is not less than 40% by mass relative to a total amount of solid contents of the hot-melt adhesive composition.

9. A laminate obtained by laminating a layer comprising the hot-melt adhesive composition according to claim 1 with at least one base layer.

10. A label having the laminate according to claim 9 .

11. A thermosensitive adhesive sheet having a layer comprising the hot-melt adhesive composition according to claim 1 .

12. The hot-melt adhesive composition according to claim 1 , wherein the ratio, Mw/Mn, of the weight-average molecular weight, Mw, to the number-average molecular weight, Mn, in the acrylic block copolymer (I), is in a range of 1.0 to 1.4.

13. The hot-melt adhesive composition according to claim 1 , wherein the ratio, Mw/Mn, of the weight-average molecular weight, Mw, to the number-average molecular weight, Mn, in the acrylic block copolymer (I), is in a range of 1.0 to 1.3.

14. The hot-melt adhesive composition according to claim 1 , wherein the acrylic acid ester (2) is n-butyl acrylate.

15. The hot-melt adhesive composition according to claim 1 , wherein the acrylic acid ester (2) is 2-ethylhexyl acrylate.

Assignees

• Kuraray Co

Inventors

• Nakada Kanayo
• Kawahara Moe
• Morishita Yoshihiro

Classifications

• C09J7/35

  Heat-activated · CPC title

• C09J133/06 Primary

  of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical · CPC title

• C09J153/00 Primary

  Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers · CPC title

• G09F3/10

  by an adhesive layer · CPC title

• C08F297/026

  polymerising acrylic acid, methacrylic acid or derivatives thereof · CPC title