Device and method for determining the temperature of a heat sink

Patent metadata

Field	Value
Publication number	US-9967966-B2
Application number	US-201615063119-A
Country	US
Kind code	B2
Filing date	Mar 7, 2016
Priority date	Mar 22, 2005
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.

First claim

What is claimed is:

1. A device, comprising:
a printed-circuit board;
a sensor; and
a heat sink connected to the sensor in a heat-conducting manner;
wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner.

2. The device according to claim 1 , wherein the connection of the printed-circuit board and the heat sink includes a fastening device detachably connecting the heat sink to the printed-circuit board.

3. The device according to claim 2 , wherein the fastening device includes using a screw.

4. The device according to claim 1 , wherein the sensor includes connecting elements electrically connected by soldered connections on a surface facing the heat sink, the connecting elements of the sensor being connected to at least one of (a) printed-circuit traces of surfaces facing away from the heat sink and (b) inner traces of the printed-circuit board.

5. The device according to claim 4 , wherein the soldered connections are formed using an SMD technique.

6. The device according to claim 1 , wherein at least one of (a) the sensor is mounted on a side of the printed-circuit board facing away from the heat sink, (b) the sensor is mounted on the side of the printed-circuit board facing the heat sink, and (c) the heat sink includes recesses which enclose parts of the printed-circuit board connected to the sensor.

7. The device according to claim 1 , wherein the sensor is mounted in a region of the printed-circuit board having a spatial distance from a contact surface of the heat sink and the printed-circuit board that amounts to a multiple of a length of the sensor that exceeds one.

8. The device according to claim 1 , wherein at least one of (a) the heat sink is connected to cooling surfaces of power semiconductors in a heat-conducting manner and (b) the heat sink is connected in a heat-conducting manner to cooling surfaces of power semiconductors, one of (1) indirectly and (2) directly, via at least one of (i) a ceramic plate and (ii) a heat-conducting foil.

9. The device according to claim 1 , wherein the heat sink is at least one of (a) a part of a housing of an internal combustion engine, (b) a component part of a heating system, (c) a component part of a chemical plant for carrying out chemical reaction processes, and (d) a component part of a coolant circulation circuit.

10. The device according to claim 1 , wherein the device is arranged as at least one of (a) an electronic unit, (b) an inverter, (c) a cycloconverter, (d) a voltage-source converter, and (e) a converter for supplying an electric motor.

11. The device according to claim 1 , wherein the printed-circuit board is a multi-layer printed-circuit board.

12. The device comprising:
a printed-circuit board;
a sensor; and
a heat sink connected to the sensor in a heat-conducting manner;
wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner;
wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at the surface of the printed-circuit board facing the heat sink, and
wherein metallic regions of the printed-circuit board have a higher thermal conductivity than a substrate material of the printed- circuit board substrate material to attain a temperature level which is substantially the same as a temperature of the heat sink, of areas of the inner layers which are spatially close to the sensor having distances from points of contact of parts of the sensor to the printed-circuit board less than a thickness of the printed-circuit board.

13. The device according to claim 12 , wherein the electrical connections include through-contactings to produce a homogeneous temperature level In the inner layers of the printed-circuit board.

14. The device according to claim 12 , wherein the metallic areas include copper or are made of copper.

15. The device according to claim 12 , wherein the metallic areas are printed-circuit traces of the printed-circuit board.

Assignees

• Sew Eurodrive Gmbh & Co

Inventors

• Schaefer Harald

Classifications

• H10W40/611

  Bolts or screws · CPC title

• H10W42/80

  protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/00 Primary

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H05K1/0207

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title