Integrated package containing mems acoustic sensor and environmental sensor and methodology for fabricating same

Patent metadata

Field	Value
Publication number	US-2017190571-A1
Application number	US-201715468066-A
Country	US
Kind code	A1
Filing date	Mar 23, 2017
Priority date	May 9, 2014
Publication date	Jul 6, 2017
Grant date	—

Abstract

An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

First claim

What is claimed is:

1 . A microelectromechanical systems (MEMS) device package comprising:
a package comprising a package substrate and a lid; an environmental sensor comprising a gas sensor configured to sense a composition parameter of a gas, wherein the environmental sensor is disposed on the package substrate; a MEMS acoustic sensing element comprising a diaphragm and disposed in the package; an integrated circuit (IC) disposed in the package and configured to process data generated by the MEMS acoustic sensing element and the environmental sensor; and a port disposed in the package configured to receive acoustic waves for the MEMS acoustic sensing element and air for the environmental sensor, wherein the package includes an acoustically sealed back cavity that encompasses the MEMS acoustic sensing element and the IC.

2 . The MEMS device package of claim 1 , wherein the composition parameter of the gas is associated with at least one of a humidity parameter, a chemical parameter, a biological parameter, a nanoparticle parameter, a spore parameter, or a pathogen parameter of the gas.

3 . The MEMS device package of claim 1 , wherein the MEMS acoustic sensing element is disposed on the IC.

4 . The MEMS device package of claim 1 , wherein the MEMS acoustic sensing element is disposed on the package substrate.

5 . The MEMS device package of claim 1 , wherein the IC comprising the environmental sensor is disposed on the package substrate.

6 . The MEMS device package of claim 1 , wherein the gas sensor comprises an environmental sensing material in a configuration sensitive to a change in the composition parameter.

7 . The MEMS device package of claim 6 , wherein the environmental sensing material is configured in a plurality of segments interspersed between and in direct contact with a plurality of metal electrodes.

8 . The MEMS device package of claim 7 , wherein the plurality of metal electrodes are arranged such that a variable electrical characteristic results from a change in the composition parameter at the environmental sensing material.

9 . The MEMS device package of claim 7 , wherein at least one of the plurality of metal electrodes comprises a heating element of the gas sensor.

10 . A method for fabricating a microelectromechanical systems (MEMS) device package comprising:
forming a package substrate; forming a MEMS acoustic sensor element comprising a diaphragm in the MEMS device package; forming, in the MEMS device package, a gas sensor comprising an environmental sensing material in a configuration sensitive to a change in an environmental characteristic associated with a gas composition parameter of a gas at the environmental sensing material, wherein the forming the gas sensor includes depositing a plurality of segments of the environmental sensing material interspersed between a plurality of metal electrodes in direct contact with the environmental sensing material; forming electrical connections between an application specific integrated circuit (ASIC) disposed in the MEMS device package and the MEMS acoustic sensor element and between the ASIC and the gas sensor; forming a cover attached to the package substrate to encompass the MEMS acoustic sensor element, the ASIC, and the gas sensor; and forming an opening in the MEMS device package, wherein the opening is configured to receive sound waves and the gas.

11 . The method of claim 10 , further comprising:
forming the gas sensor comprising the environmental sensing material in the configuration sensitive to the change in the environmental characteristic associated with the gas composition parameter comprising at least one of a humidity parameter, a chemical parameter, a biological parameter, a nanoparticle parameter, a spore parameter, or a pathogen parameter of the gas.

12 . The method of claim 10 , wherein the forming the gas sensor comprises fabricating a gas sensor arrangement that enables providing a variable electrical characteristic in response to the change in the environmental characteristic at the environmental sensing material.

13 . The method of claim 10 , wherein the forming the gas sensor comprises configuring at least one of the plurality of metal electrodes as a heating element of the gas sensor.

14 . The method of claim 10 , further comprising:
forming the MEMS acoustic sensor element on the ASIC.

15 . The method of claim 14 , wherein the forming the gas sensor comprises at least one of forming the gas sensor on the ASIC or forming the gas sensor on the package substrate adjacent to the ASIC.

16 . A microelectromechanical systems (MEMS) device package, comprising:
a package comprising a package substrate and a lid; a gas sensor disposed on the package substrate and configured to sense a composition parameter of a gas comprising at least one of a humidity parameter, a chemical parameter, a biological parameter, a nanoparticle parameter, a spore parameter, or a pathogen parameter of the gas; a MEMS acoustic sensing element comprising a diaphragm and disposed in the package; and an integrated circuit (IC) disposed in the package and configured to process data generated by the MEMS acoustic sensing element and the gas sensor; a port disposed in the package configured to receive acoustic waves for the MEMS acoustic sensing element and air for the gas sensor, wherein the package includes an acoustically sealed back cavity that encompasses the MEMS acoustic sensing element and the IC.

17 . The MEMS device package of claim 16 , wherein the MEMS acoustic sensing element is disposed on the IC, or wherein the IC comprising the gas sensor is disposed on the package substrate.

18 . The MEMS device package of claim 16 , wherein the gas sensor comprises an environmental sensing material in a configuration sensitive to a change in the composition parameter, wherein the environmental sensing material is configured in a plurality of segments interspersed between and in direct contact with a plurality of metal electrodes, and wherein the plurality of metal electrodes are arranged such that a variable electrical characteristic results from a change in the composition parameter at the environmental sensing material.

19 . The MEMS device package of claim 18 , wherein at least one of the plurality of metal electrodes comprises a heating element of the gas sensor.

Assignees

• Invensense Inc

Inventors

• Tsai Julius Ming-Lin
• Cagdaser Baris
• Lim Martin
• Khenkin Aleksey S

Classifications

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• B81C2203/0792

  Forming interconnections between the electronic processing unit and the micromechanical structure · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title