Imaging device for electromagnetic radiation

Patent metadata

Field	Value
Publication number	US-9966409-B2
Application number	US-201514792715-A
Country	US
Kind code	B2
Filing date	Jul 7, 2015
Priority date	Jul 15, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

An imaging device for electromagnetic radiation, especially for x-ray and/or gamma radiation, is disclosed. In an embodiment, the imaging device includes a layering including a number of detection elements, a number of read-out boards and a base board. Each of the detection elements is electrically contacted with a respective read-out board via a plurality of first solder contacts. Each read-out board includes a plurality of through-contacts and is electrically contacted with the base board via a plurality of second solder contacts.

First claim

What is claimed is:

1. An imaging device for electromagnetic radiation, the imaging device comprising:
a layered structure including
a plurality of individual detection elements,
a plurality of read-out boards, and
a base board; wherein
each respective detection element among the plurality of individual detection elements corresponds to a respective read-out board among the plurality of read-out boards,
each respective read-out board includes read-out electronics on an external surface thereof, the external surface being a surface of the respective read-out board most proximate to a surface of the respective detection element corresponding to the respective read-out board, the read-out electronics configured to read out signals generated by the respective detection element corresponding to the respective read-out board,
each respective detection element includes at least one contact pin physically contacting a corresponding one of a plurality of first solder contacts, the corresponding one of the plurality of first solder contacts also physically contacting the read-out electronics of the respective read-out board corresponding to the respective detection element,
each respective read-out board further includes a plurality of through-contacts carrying data signals, the plurality of through-contacts passing entirely through the respective read-out board, the plurality of through-contacts being centrally located relative to an array of the plurality of first solder contacts on the respective read-out board, and the plurality of through-contacts being spaced evenly across the entire respective read-out board, and
each respective read-out board is electrically connected with the base board via a plurality of second solder contacts.

2. The imaging device of claim 1 , wherein
an inner wall of each of the plurality of through-contacts is clad with a conductive material.

3. The imaging device of claim 2 , wherein
each respective detection element includes a conversion layer;
a plurality of contact pins are attached to a side of the conversion layer; and
each respective detection element is connected with the corresponding respective read-out board via the array of the plurality of first solder contacts and the plurality of contact pins.

4. The imaging device of claim 3 , wherein
each respective conversion layer includes at least one semiconductor material; and
the at least one semiconductor material includes at least one of cadmium telluride, zinc telluride, cadmium selenide, zinc selenide, manganese telluride, indium phosphide, mercury(II)-iodide and thallium(I,III)-bromide.

5. The imaging device of claim 2 , wherein the plurality of first solder contacts include at least one of tin-bismuth, tin-bismuth-silver, tin-bismuth-lead, tin-indium, indium-silver and indium.

6. The imaging device of claim 2 , wherein the plurality of second solder contacts include at least one of tin-bismuth, tin-bismuth-silver, tin-bismuth-lead, tin-indium, indium-silver and indium.

7. The imaging device of claim 2 , wherein
each respective detection element includes a plate having a polygonal shape; and
each respective detection element covers substantially the same area as the corresponding respective read-out board.

8. The imaging device of claim 7 , wherein at least a portion of the base board is substantially covered by the plurality of individual detection elements or corresponding ones of the plurality of read-out boards.

9. The imaging device of claim 8 , wherein each of the plurality of individual detection elements has a rectangular shape.

10. The imaging device of claim 1 , wherein
each respective detection element includes a conversion layer;
a plurality of contact pins are attached to a side of the conversion layer; and
each respective detection element is connected with the corresponding respective read-out board via the array of the plurality of first solder contacts and the plurality of contact pins.

11. The imaging device of claim 10 , wherein
each respective conversion layer includes at least one semiconductor material; and
the at least one semiconductor material includes at least one of cadmium telluride, zinc telluride, cadmium selenide, zinc selenide, manganese telluride, indium phosphide, mercury(II)-iodide and thallium(I,III)-bromide.

12. The imaging device of claim 1 , wherein the plurality of first solder contacts include at least one of tin-bismuth, tin-bismuth-silver, tin-bismuth-lead, tin-indium, indium-silver and indium.

13. The imaging device of claim 12 , wherein the plurality of second solder contacts include at least one of tin-bismuth, tin-bismuth-silver, tin-bismuth-lead, tin-indium, indium-silver and indium.

14. The imaging device claim 1 , wherein the plurality of second solder contacts include at least one of tin-bismuth, tin-bismuth-silver, tin-bismuth-lead, tin-indium, indium-silver and indium.

15. The imaging device of claim 1 , wherein
each respective detection element includes a plate having a polygonal shape; and
each respective detection element covers substantially the same area as the corresponding respective read-out board.

16. The imaging device of claim 15 , wherein at least a portion of an area of the base board is substantially covered by the plurality of individual detection elements or corresponding ones of the plurality of read-out boards.

17. The imaging device of claim 16 , wherein each of the plurality of individual detection elements has a rectangular shape.

18. An x-ray detector, including at least one imaging device of claim 1 .

19. The x-ray detector of claim 18 , wherein the x-ray detector is a photon-counting x-ray detector.

20. The imaging device of claim 1 , wherein the electromagnetic radiation is at least one of x-ray and gamma radiation.

21. The imaging device of claim 1 , wherein the plurality of first solder contacts have a higher melting point than the plurality of second solder contacts.

Assignees

• Siemens Ag

Inventors

• Danzer Ludwig
• Labayen De Inza Miguel
• Wrege Jan

Classifications

• A61B6/4241

  using energy resolving detectors, e.g. photon counting · CPC title

• H01L27/14661 Primary

  Electricity · mapped topic

• H10F39/1895 Primary

  of the hybrid type · CPC title