Detector unit for detector array of radiation imaging modality

Patent metadata

Field	Value
Publication number	US-2016154124-A1
Application number	US-201314907611-A
Country	US
Kind code	A1
Filing date	Jul 26, 2013
Priority date	Jul 26, 2013
Publication date	Jun 2, 2016
Grant date	—

Abstract

Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

First claim

1 . A detector unit for a detector array of a radiation imaging modality, the detector unit fabricated at least in part using a semiconductor fabrication technique and comprising:
an analog-to-digital (A/D) converter configured to convert an analog signal generated in response to detected radiation into a digital signal; a molding compound configured to surround at least a portion of the A/D converter; and an electrically conductive trace configured to electrically couple the A/D converter to at least one of a radiation detection sub-assembly or a digital processing component.

2 . The detector unit of claim 1 , comprising a via configured to extend through at least a portion of the molding compound.

3 . The detector unit of claim 2 , the via comprising at least one of copper, nickel, or silicon.

4 . The detector unit of claim 1 , comprising an insulator element configured to at least one of:
electrically isolate the A/D converter from the radiation detection sub-assembly, or electrically isolate a first electrically conductive trace from a second electrically conductive trace.

5 . The detector unit of claim 1 , comprising a radiation shielding element configured to mitigate exposure of the A/D converter to radiation.

6 . The detector unit of claim 1 , the molding compound comprising a polymer.

7 . The detector unit of claim 1 , comprising a fiducial for aligning the detector unit on the detector array.

8 . The detector unit of claim 7 , the fiducial comprising an optical fiducial for optically aligning the detector unit on the detector array.

9 . The detector unit of claim 7 , the fiducial comprising a physical fiducial for physically aligning the detector unit on the detector array.

10 . The detector unit of claim 1 , comprising a thermal conduction element configured to dissipate heat generated by the A/D converter.

11 . The detector unit of claim 1 , the radiation detection sub-assembly comprising a photodetector.

12 . A detector unit for a detector array of a radiation imaging modality, comprising:
a radiation detection sub-assembly configured to detect radiation; and an electronics sub-assembly, comprising:
an analog-to-digital (A/D) converter configured to convert an analog signal generated by the radiation detection sub-assembly into a digital signal;
an insulator element situated between the radiation detection sub-assembly and the A/D converter; and
a molding compound in which the A/D converter is embedded.

13 . The detector unit of claim 12 , the radiation detection sub-assembly comprising:
a scintillator configured to convert radiation energy into light energy; and a photodetector configured to convert the light energy into the analog signal.

14 . The detector unit of claim 12 , the electronics sub-assembly comprising:
an electrically conductive trace coupled to ground and configured to provide for electrical shielding.

15 . The detector unit of claim 12 , the radiation detection sub-assembly
comprising: a photodetector configured to generate the analog signal.

16 . The detector unit of claim 12 , the electronics sub-assembly comprising:
a radiation shielding element situated between the A/D converter and the radiation detection sub-assembly and configured to mitigate exposure of the A/D converter to radiation.

17 . The detector unit of claim 12 , the electronics sub-assembly comprising:
a thermal conduction element positioned substantially diametrically opposite the A/D converter relative to the radiation detection sub-assembly and configured to dissipate heat generated by the A/D converter.

18 . The detector unit of claim 12 , comprising a via configured to extend through at least a portion of the molding compound.

19 . The detector unit of claim 12 , comprising an electrically conductive trace configured to electrically couple the A/D converter to the radiation detection sub-assembly.

20 . A radiation imaging modality, comprising:
an ionizing radiation source; and a detector array configured to detect radiation generated by the ionizing radiation source, the detector array comprising a detector unit fabricated at least in part using a semiconductor fabrication technique, the detector unit comprising:
an analog-to-digital (A/D) converter configured to convert an analog signal generated in response to detected radiation into a digital signal;
a molding compound configured to surround at least a portion of the A/D converter; and
an electrically conductive trace configured to electrically couple the A/D converter to at least one of a radiation detection sub-assembly or a digital processing component.

21 . (canceled)

22 . (canceled)

Assignees

• Analogic Corp

Inventors

• Luhta Randy
• Abenaim Daniel
• Choquette Martin
• Deych Ruvin
• Vrettos Chris

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• G01T1/244 Primary

  Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like · CPC title

• H10F39/1895

  of the hybrid type · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• G01T1/2018

  Scintillation-photodiode combinations · CPC title