Vehicle vision system with camera having molded interconnect device

Patent metadata

Field	Value
Publication number	US-9961241-B2
Application number	US-201514814883-A
Country	US
Kind code	B2
Filing date	Jul 31, 2015
Priority date	Aug 4, 2014
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A camera for a vision system of a vehicle includes a housing having a front housing portion and a rear housing portion. The camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle. The front housing portion houses a lens assembly. The rear housing portion has a connector portion for electrically connecting circuitry of the camera to an electrical connector of the vehicle when the camera is disposed at the vehicle. The circuitry of the camera includes an imager comprising an imaging array having a plurality of photosensing elements. The rear housing portion has circuitry and electrically connecting elements established via molded interconnect device (MID) technology.

First claim

The invention claimed is:

1. A camera for a vision system of a vehicle, said camera comprising:
a housing comprising a front housing portion and a rear housing portion;
wherein said camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle;
wherein said front housing portion houses a lens assembly;
wherein said rear housing portion has a connector portion for electrically connecting circuitry of said camera to an electrical connector of the vehicle when said camera is disposed at the vehicle;
wherein said rear housing portion comprises a first printed circuit board at a first structure and a second printed circuit board at a second structure;
wherein said front housing portion is mated with said rear housing portion to house said first and second printed circuit boards;
wherein said first printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said first printed circuit board contacting said first structure of said rear housing portion;
wherein said second printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said second printed circuit board contacting said second structure of said rear housing portion;
wherein said second printed circuit board has an imager disposed at said first surface of said second printed circuit board, and wherein said imager comprises an imaging array having a plurality of photosensing elements;
wherein said rear housing portion comprises electrically connecting elements established at and between said first structure and said second structure via molded interconnect device (MID) technology;
wherein said electrically connecting elements electrically connect between electrical contacts at said first structure and electrical contacts at said second structure;
wherein said imager is electrically connected to connecting pads at said second surface of said second printed circuit board, and wherein said connecting pads at said second surface of said second printed circuit board electrically connect at said electrical contacts at said second structure; and
wherein said first printed circuit board has first circuitry disposed at said first surface of said first printed circuit board, and wherein said first circuitry is electrically connected to connecting pads at said second surface of said first printed circuit board, and wherein said connecting pads at said second surface of said first printed circuit board electrically connect at said electrical contacts at said first structure.

2. The camera of claim 1 , wherein said electrically connecting elements are applied by MID technology at an inner surface of said rear housing portion.

3. The camera of claim 1 , wherein a core pin portion of said connector portion of said rear housing portion is configured to connect to a pin portion of a coaxial connector of the vehicle and has its conductive connecting surface applied by MID technology.

4. The camera of claim 1 , wherein said rear housing portion has a first cross dimension at said first structure and a second cross dimension at said second structure, and wherein said first cross dimension is less than said second cross dimension.

5. The camera of claim 4 , wherein said rear housing portion has an open end at its end that is mated with said front housing portion, and wherein said first and second printed circuit boards are received in said rear housing portion at said open end before said front housing portion is mated with said rear housing portion.

6. The camera of claim 5 , wherein said first printed circuit board is spaced from said second printed circuit board along a longitudinal axis of said rear housing portion.

7. The camera of claim 1 , wherein said front housing portion has electrically connecting elements established via molded interconnect device (MID) technology.

8. The camera of claim 7 , wherein said electrically connecting elements of said front housing portion electrically connect to said electrically connecting elements of said rear housing portion when said front and rear housing portions are mated together.

9. The camera of claim 7 , wherein said electrically connecting elements of said front housing portion comprise electrically conductive traces that generate heat when powered so as to defrost or defog at least one optic of said lens assembly.

10. The camera of claim 7 , wherein said electrically connecting elements of said front housing portion comprise an actuator for adjusting said lens assembly.

11. The camera of claim 1 , wherein said camera is configured to be disposed at the vehicle so as to have a field of view exterior of the vehicle.

12. The camera of claim 11 , wherein said camera is part of a surround view system for a vehicle.

13. A camera for a vision system of a vehicle, said camera comprising:
a housing comprising a front housing portion and a rear housing portion;
wherein said camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle;
wherein said front housing portion houses a lens assembly;
wherein said rear housing portion has a connector portion for electrically connecting circuitry of said camera to an electrical connector of the vehicle when said camera is disposed at the vehicle;
wherein said rear housing portion comprises a first printed circuit board at a first structure and a second printed circuit board at a second structure;
wherein said front housing portion is mated with said rear housing portion to house said first and second printed circuit boards;
wherein said first printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said first printed circuit board contacting said first structure of said rear housing portion;
wherein said second printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said second printed circuit board contacting said second structure of said rear housing portion;
wherein said second printed circuit board has an imager disposed at said first surface of said second printed circuit board, and wherein said imager comprises an imaging array having a plurality of photosensing elements;
wherein said rear housing portion comprises electrically connecting elements established at and between said first structure and said second structure via molded interconnect device (MID) technology;
wherein said electrically connecting elements electrically connect between electrical contacts at said first structure and electrical contacts at said second structure;
wherein said imager is electrically connected to connecting pads at said second surface of said second printed circuit board, and wherein said connecting pads at said second surface of said second printed circuit board electrically connect at said electrical contacts at said second structure; and
wherein said first printed circuit board has first circuitry disposed at said first surface of said first printed circuit board, and wherein said first circuitry is electrically connected to connecting pads at said second surface of said first printed circuit board, and wherein said connecting pads at said second surface of said first printed circuit board electrically connect at said electrical contacts at said first structure;
wherein said electrically connecting elements are applied by MID technology at an inner surface of said rear housing portion;
wherein said front housing portion has electrically connecting elements established via molded interconnect device (

Assignees

• Magna Electroncs Inc
• Magna Electronics Inc

Inventors

• Biemer Michael

Classifications

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/51 Primary

  Housings · CPC title

• H04N5/2252 Primary

  Electricity · mapped topic

• H04N5/2253

  Electricity · mapped topic