camera system, particularly for a vehicle, and a method for the manufacture thereof

Patent metadata

Field	Value
Publication number	US-2016280150-A1
Application number	US-201414777896-A
Country	US
Kind code	A1
Filing date	Feb 24, 2014
Priority date	Mar 22, 2013
Publication date	Sep 29, 2016
Grant date	—

Abstract

A camera system for a vehicle includes: an imager module having a carrier device; a lens system accommodated on the carrier device; an image sensor mounted on the carrier device, for generating image signals, the image sensor being in contact with conductor tracks which run on or upon the carrier device; and a planar circuit carrier which is in contact with the conductor tracks of the carrier device for recording image signals, the conductor tracks not running in parallel to the circuit carrier. The carrier device includes (i) a first contact pad connected to one of the conductor tracks, and (ii) a second contact surface which is in contact with the first contact pad via a bond connection formed between the second contact surface and a contact area of the first contact pad, the contact area running in parallel to the second contact surface.

First claim

1 - 19 . (canceled)

20 . A camera system for a vehicle, comprising:
an imager module having a carrier device; a lens system accommodated on the carrier device; an image sensor mounted on the carrier device for generating image signals, the image sensor contacting conductor tracks which extend one of on or upon the carrier device; and a circuit carrier for recording the image signals, the circuit carrier contacting the conductor tracks of the carrier device; wherein:
the conductor tracks do not extend in parallel to the circuit carrier;
the carrier device includes at least one first contact pad connected to one of the conductor tracks;
the circuit carrier includes at least one second contact surface;
the first contact pad and the second contact surface are connected to one another via a bond connection; and
the bond connection is formed between the contact surface and a contact area of the first contact pad extending in parallel to the second contact surface.

21 . The camera system as recited in claim 20 , wherein multiple first contact pads are situated side by side, and multiple second contact surfaces are situated side by side, and wherein the first contact pads and multiple second contact surfaces are contacted by multiple bond connections.

22 . The camera system as recited in claim 20 , wherein the carrier device has a three-dimensional contour and is an injection-molded part having the conductor tracks extending on the surface of the injection-molded part.

23 . The camera system as recited in claim 22 , wherein the three-dimensionally contoured carrier device has a lens system mounting area in which (i) the lens system is accommodated, and (ii) the image sensor is mounted and has a conduction area including the conductor tracks, the conduction area extending from the lens system mounting area to the circuit carrier, and wherein the at least one first contact pad is formed on an end section of the conduction area.

24 . The camera system as recited in claim 23 , wherein:
the circuit carrier has a recess; the end section of the carrier device is one of set in or through the recess from a top side of the circuit carrier; the end section of the carrier device including the at least one first contact pad is one of situated in the recess or protrudes through the recess; and the at least one contact surface is formed on a bottom side of the circuit carrier.

25 . The camera system as recited in claim 23 , wherein the end section has a lower edge on which the at least one first contact pad is formed.

26 . The camera system as recited in claim 25 , wherein:
the at least one first contact pad extends over one of a non-planar or curved area of the lower edge; and the contact area of the first contact pad has one of a tangent or tangential plane which extends in parallel to the second contact surface of the circuit carrier.

27 . The camera system as recited in claim 26 , wherein one of the lower edge or a section of the lower edge on which the first contact pad is formed has a convex curvature.

28 . The camera system as recited in claim 20 , wherein the at least one second contact surface is a second contact pad formed by metallization on one of a top side or bottom side of the circuit carrier.

29 . The camera system as recited in claim 20 , wherein:
a support surface of a bond contact part made of a conductive material is fastened conductively to at least one of a second contact pad of the circuit carrier and the first contact pad of the carrier device; and the second contact surface is formed by a top side of the bond contact part which is inclined relative to the support surface of the bond contract part; and at least one of the first and second contact pads accommodates the support surface of the bond contract part in such a way that the bond connection connects to parallel contact surfaces.

30 . The camera system as recited in claim 29 , wherein:
the bond contact part is conductively attached to at least one of a bottom side of the circuit carrier; and an end section of the carrier device is one of situated in a recess of the circuit carrier or protrudes through the recess; the bond contact part is formed in a wedge shape and has the support surface in contact with the bottom side of the circuit carrier and has a contact surface extending at an installation angle relative to the support surface; and the end section of the carrier device extends at the installation angle relative to the bottom side of the circuit carrier plate.

31 . The camera system as recited in claim 20 , wherein at least one of the top side and the bottom side of the flat circuit carrier extends at an oblique installation angle relative to the conduction area, the oblique installation angle being more than 0° and less than 90°.

32 . The camera system as recited in claim 20 , wherein the first contact surface and the second contact surface are offset in height relative to one another perpendicularly to the plane of the surface.

33 . The camera system as recited in claim 20 , further comprising:
a camera housing in which the imager module and the planar circuit carrier are accommodated and fastened in the camera housing.

34 . The camera system as recited in claim 20 , wherein the circuit carrier is planar and electronic components are mounted on the circuit carrier for at least one of recording the image signals and connection in the vehicle.

35 . A method for manufacturing a camera system, comprising:
forming an imager module which includes: a carrier device made of a plastic material having a three-dimensional contouring, which has a lens system mounting area and a conduction area; a lens system inserted into the lens system mounting area; and an image sensor which is fastened to the carrier device, wherein conductor tracks and first contact pads are formed one of in or on the conduction area, the image sensor being contacted with the conductor tracks, and the conductor tracks leading to the first contact pads; and contacting the first contact pads with contact surfaces of a circuit carrier with the aid of bond connections, the circuit carrier extending at an oblique installation angle between 0° and 90° relative to the conduction area of the carrier device, wherein the bond connections are formed between the second contact surfaces of the circuit carrier and the first contact areas of the first contact pads extending in parallel to the second contact surfaces.

36 . The method as recited in claim 35 , wherein the conduction area of the carrier device is placed one of in or through a recess of the circuit carrier in such a way that, on an end section of the conduction area, the first contact pads are formed on a non-planar area, the bond connection being placed in a contact area of the first contact pad having one of a tangent or tangential plane which extends in parallel to the second contact area of the circuit carrier.

37 . The method as recited in claim 36 , wherein to form a camera module, an installation angle of the circuit carrier relative to one of the conduction area, a normal of the conduction area, or the optical axis of the lens system mounting area of the carrier device is initially ascertained, and the contact area of the non-planar first contact pad is selected in such a way that one of a tangent or tangential plane of the non-planar first contact pad extends in parallel to the circuit carrier.

38 . The method as recited in claim 35 , wherein multiple bond connections are placed sid

Assignees

• Bosch Gmbh Robert

Inventors

• Steinberger Werner
• Timmermann Stefan

Classifications

• H04N23/50

  Constructional details · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• B60R2011/0026

  Windows, e.g. windscreen · CPC title