Device and method for treating substrate surfaces

Patent metadata

Field	Value
Publication number	US-9960058-B2
Application number	US-201114346109-A
Country	US
Kind code	B2
Filing date	Sep 22, 2011
Priority date	Sep 22, 2011
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A device and method for treatment of a substrate treatment surface of a substrate with a fluid by immersion of the substrate treatment surface into the fluid. The device includes:
receiving means for receiving the fluid with an immersion opening and immersion means for immersion of the substrate treatment surfaces through the immersion opening into the receiving means,

Rotation means are provided for rotation of the receiving means for at least predominant discharge of the fluid from the receiving means.

First claim

Having described the invention, the following is claimed:

1. A device to treat a substrate treatment surface of a substrate with a fluid when the substrate treatment surface is immersed into the fluid, said device being comprised of:
receiving means comprising an immersion area configured to receive the fluid into which the substrate treatment surface is immersed during treatment thereof;
a chuck to which a receiving surface of the substrate is fixed during said treatment, the receiving surface facing away from the substrate treatment surface;
a first hollow body on which the receiving means is fixed to rotate therewith;
a drive motor configured to rotate the first hollow body to effect discharge of the fluid from the receiving means and empty the fluid out of the receiving means;
heating means positioned underneath the receiving means in a heating area defined by the receiving means and the first hollow body, the heating means comprising a heating body and a heating plate held in the heating area by the heating body, the heating plate being configured to heat the fluid in the immersion area; and
flushing means disposed between the first hollow body and the chuck, the flushing means being configured to flush a flushing fluid along a flushing surface of the substrate, the flushing surface being provided outside the substrate treatment surface and outside the receiving surface, the flushing surface extending annularly around the receiving surface.

2. The device as claimed in claim 1 , wherein the immersion area is defined by a rotationally symmetrical trough, with one trough wall being angled in a radial direction.

3. The device as claimed in claim 2 , further comprising:
a ring-shaped fluid collection tank configured to receive the discharged fluid from the receiving means,
wherein the receiving means has a peripheral edge that is curved away from the trough wall and projects over the first hollow body.

4. The device as claimed in claim 3 , wherein a lowest point of the fluid collection tank is defined by a stator, and
wherein the fluid collection tank has at least one drain comprising a triggerable valve.

5. The device as claimed in claim 1 or 2 , wherein the receiving means is fixed on the first hollow body at a region of the peripheral edge of the receiving means, and
wherein the first hollow body is rotationally symmetrical.

6. The device as claimed in claim 5 , further comprising:
a stator defined by a second rotationally symmetrical hollow body, the stator being configured to hold the first rotationally symmetrical hollow body rotatably therein.

7. The device as claimed in claim 6 , wherein an inner periphery of the stator defines a first ring-shaped guide segment,
wherein the first rotationally symmetrical hollow body defines a second ring-shaped guide segment corresponding with the first ring-shaped guide segment,
wherein a ball bearing is positioned between the guide segments, and
wherein the ball bearing is configured to enable the first rotationally symmetrically hollow body to rotate along the first ring-shaped guide segment.

8. The device as claimed in claim 1 , wherein the heating means is configured to rotate the heating body during the treatment of the substrate treatment surface.

9. The device as claimed in claim 1 , wherein the flushing surface of the substrate is opposite the substrate treatment surface.

10. The device as claimed in claim 1 , wherein the flushing surface of the substrate and the receiving surface of the substrate are on the same plane.

11. The device as claimed in claim 1 , wherein the flushing surface of the substrate is not exposed to the fluid into which the substrate treatment surface is immersed.

12. A method for treatment of a substrate treatment surface of a substrate with a fluid when the substrate treatment surface is immersed in the fluid, the method comprising:
receiving the fluid in an immersion area of a receiving means into which the substrate treatment surface is to be immersed during treatment thereof;
fixing a receiving surface of the substrate that faces away from the substrate treatment surface to a chuck;
fixing the receiving means to a first hollow body to rotate therewith;
immersing the substrate treatment surface into the fluid for treatment therein;
flushing a flushing fluid along a flushing surface of the substrate using a flushing means disposed between the first hollow body and the chuck, the flushing surface being provided outside the substrate treatment surface and outside the receiving surface, the flushing surface extending annularly around the receiving surface;
heating the fluid in the immersion area during the treatment of the substrate treatment surface immersed in the fluid, the heating comprising activating heating means positioned underneath the receiving means in a heating area defined by the receiving means and the first hollow body;
withdrawing the substrate treatment surface from the fluid after the treatment thereof; and
discharging the fluid from the receiving means by rotating the first hollow body to empty the fluid out of the receiving means.

13. The method as claimed in claim 12 , wherein the first hollow body is rotated in a stator,
wherein an inner periphery of the stator defines a first ring-shaped guide segment,
wherein the first hollow body defines a second ring-shaped guide segment corresponding with the first ring-shaped guide segment,
wherein a ball bearing is positioned between the guide segments, and
wherein the ball bearing is configured to enable the first hollow body to rotate along the first ring-shaped guide segment.

14. The method as claimed in claim 12 or 13 , wherein the heating further comprises controlling a temperature of the fluid during the immersing of the substrate treatment surface.

15. The method as claimed in claim 12 or 13 , wherein the substrate treatment surface is rotated by the chuck at least during the immersing.

Assignees

• Glinsner Thomas
• Holzleitner Ronald
• Wieser Thomas
• Schmid Florian
• Ev Group E Thallner Gmbh

Inventors

• Glinsner Thomas
• Holzleitner Ronald
• Wieser Thomas
• Schmid Florian

Classifications

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0416 Primary

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H01L21/67057 Primary

  Electricity · mapped topic