Single-unit reactor design for combined oxidative, initiated, and plasma-enhanced chemical vapor deposition

US9957618B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9957618-B2
Application numberUS-201213407075-A
CountryUS
Kind codeB2
Filing dateFeb 28, 2012
Priority dateFeb 28, 2012
Publication dateMay 1, 2018
Grant dateMay 1, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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Described herein are reactors capable of sequentially or simultaneously depositing thin-film polymers onto a substrate by oxidative chemical vapor deposition (oCVD), initiated chemical vapor deposition (iCVD), and plasma-enhanced chemical vapor deposition (PECVD). The single-unit CVD reactors allow for the use of more than one CVD process on the same substrate without the risk of inadvertently exposing the substrate to ambient conditions when switching processes. Furthermore, the ability to deposit simultaneously polymers made by two different CVD processes allows for the exploration of new materials. In addition to assisting in the deposition of polymer films, plasma processes may be used to pretreat substrate surfaces before polymer deposition, or to clean the internal surfaces of the reactor between experiments.

First claim

Opening claim text (preview).

We claim: 1. A single-unit CVD reactor, comprising a chamber, wherein: the chamber comprises a substrate stage, a radiofrequency electrode, a filament, a monomer inlet, an oxidant crucible, and optionally a oxidant inlet; the oxidant crucible is operably connected to a heat source; the substrate stage is oriented above the filament; the substrate stage is operably connected to a heat source or a cooling source; the chamber is operably connected to a vacuum source; the monomer inlet is operably connected to a source of a monomer gas; and the oxidant inlet, if present, is operably connected to a source of oxidant gas. 2. The single-unit CVD reactor of claim 1 , wherein the single-unit CVD reactor further comprises a window, a door, or a lid on the chamber. 3. The single-unit CVD reactor of claim 1 , wherein the chamber is substantially cylindrical in shape. 4. The single-unit CVD reactor of claim 1 , wherein the chamber comprises glass or stainless steel. 5. The single-unit CVD reactor of claim 1 , wherein the substrate stage is operably connected to a DC power supply. 6. The single-unit CVD reactor of claim 1 , wherein the radiofrequency electrode comprises a metal. 7. The single-unit CVD reactor of claim 1 , wherein the chamber comprises a plurality of filaments. 8. The single-unit CVD reactor of claim 7 , wherein the filaments are spaced from about 1 mm apart to about 30 mm apart. 9. The single-unit CVD reactor of claim 1 , wherein the filament is from about 0.1 cm to about 20 cm from the substrate stage. 10. The single-unit CVD reactor of claim 1 , wherein the filament comprises a metal. 11. The single-unit CVD reactor of claim 1 , wherein the filament is from about 0.01 cm to about 0.1 cm in diameter. 12. The single-unit CVD reactor of claim 1 , wherein a pressure inside the chamber is from about 5 mtorr to about 760 torr. 13. A single-unit CVD reactor, comprising a chamber, wherein: the chamber comprises a substrate stage, an oxidant crucible, a radiofrequency electrode, a filament, and an inlet, wherein the substrate stage is oriented above the filament; the substrate stage is operably connected to a heat source or a cooling source; the chamber is operably connected to a vacuum source; and the inlet is operably connected to a source of a monomer gas. 14. The single-unit CVD reactor of claim 13 , wherein the single-unit CVD reactor further comprises a window, a door, or a lid on the chamber. 15. The single-unit CVD reactor of claim 13 , wherein the chamber comprises glass or stainless steel. 16. The single-unit CVD reactor of claim 13 , wherein the substrate stage is operably connected to a DC power supply. 17. The single-unit CVD reactor of claim 13 , wherein the radiofrequency electrode comprises a metal. 18. The single-unit CVD reactor of claim 13 , wherein the chamber comprises a plurality of filaments. 19. The single-unit CVD reactor of claim 18 , wherein the filaments are spaced from about 1 mm apart to about 30 mm apart. 20. The single-unit CVD reactor of claim 13 , wherein the filament comprises a metal.

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Classifications

  • C23C16/509Primary

    using internal electrodes · CPC title

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What does patent US9957618B2 cover?
Described herein are reactors capable of sequentially or simultaneously depositing thin-film polymers onto a substrate by oxidative chemical vapor deposition (oCVD), initiated chemical vapor deposition (iCVD), and plasma-enhanced chemical vapor deposition (PECVD). The single-unit CVD reactors allow for the use of more than one CVD process on the same substrate without the risk of inadvertently …
Who is the assignee on this patent?
Bhattacharyya Dhiman, Gleason Karen K, Barr Miles C, and 1 more
What technology area does this patent fall under?
Primary CPC classification C23C16/509. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).