Copper foil composite, formed product and method of producing the same

Patent metadata

Field	Value
Publication number	US-9955574-B2
Application number	US-201214369909-A
Country	US
Kind code	B2
Filing date	Jan 13, 2012
Priority date	Jan 13, 2012
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 ×t 3 )/(f 2 ×t 2 )=>1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f 1 /(F×T) wherein f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 μg/dm 2 . is formed on a surface of the copper foil on which the resin layer is not laminated.

First claim

What is claimed is:

1. A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 ×t 3 )/(f 2 ×t 2 )≥1 wherein t 2 is a thickness of the copper foil measured in mm, f 2 is a stress of the copper foil measured in MPa under tensile strain of 4%, t 3 is a thickness of the resin layer measured in mm, f 3 is a stress of the resin layer measured in MPa under tensile strain of 4% measure and an equation 2: 1≤33f 1 /(F×T) wherein f 1 is 180° peeling strength between the copper foil and the resin layer measured in N/mm, F is strength of the copper foil composite measured in MPa under tensile strain of 30%, and T is a thickness of the copper foil composite measured in mm, wherein a Cr oxide layer is formed at a coating amount of 5 to 100 μg/dm 2 on a surface of the copper foil on which the resin layer is not laminated, and further wherein the 180° peeling strength is measured by conducting a 180° peel test as the surface of the copper foil in a composite test specimen is fixed on a SUS plate and the resin layer is peeled in a direction at an angle of 180° in accordance with JIS-05016.

2. The copper foil composite according to claim 1 , wherein a Ni layer or a Ni alloy layer having a thickness of 0.001 to 5.0 μm is formed between the Cr oxide layer and the copper foil.

3. The copper foil composite according to claim 2 , wherein the thickness of the Ni layer or the Ni alloy layer is 0.001 to 0.10 μm.

4. The copper foil composite according to claim 3 , wherein the equations 1 and 2 are true at the temperature lower than the glass transition temperature of the resin layer.

5. The copper foil composite according to claim 3 , wherein a ratio I/L of fracture strain I of the copper foil composite to fracture strain L of the resin layer alone is 0.7 to 1.

6. A formed product obtained by working the copper foil composite according to claim 3 .

7. A method of producing a formed product comprising working the copper foil composite according to claim 3 .

8. The copper foil composite according to claim 2 , wherein the equations 1 and 2 are true at the temperature lower than the glass transition temperature of the resin layer.

9. The copper foil composite according to claim 2 , wherein a ratio I/L of fracture strain I of the copper foil composite to fracture strain L of the resin layer alone is 0.7 to 1.

10. A formed product obtained by working the copper foil composite according to claim 2 .

11. A method of producing a formed product comprising working the copper foil composite according to claim 2 .

12. The copper foil composite according to claim 1 , wherein the equations 1 and 2 are true at the temperature lower than the glass transition temperature of the resin layer.

13. The copper foil composite according to claim 12 , wherein a ratio I/L of fracture strain I of the copper foil composite to fracture strain L of the resin layer alone is 0.7 to 1.

14. A formed product obtained by working the copper foil composite according to claim 12 .

15. A method of producing a formed product comprising working the copper foil composite according to claim 12 .

16. The copper foil composite according to claim 1 , wherein a ratio I/L of fracture strain I of the copper foil composite to fracture strain L of the resin layer alone is 0.7 to 1.

17. A formed product obtained by working the copper foil composite according to claim 16 .

18. A method of producing a formed product comprising working the copper foil composite according to claim 16 .

19. A formed product obtained by working the copper foil composite according to claim 1 .

20. A method of producing a formed product comprising working the copper foil composite according to claim 1 .

Assignees

• Tanaka Koichiro
• Kammuri Kazuki
• Jx Nippon Mining & Metals Corp

Inventors

• Tanaka Koichiro
• Kammuri Kazuki

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/0358

  Resin coated copper [RCC] · CPC title

• B32B15/08

  of synthetic resin · CPC title

• B32B2307/712

  Weather resistant · CPC title