Flexible printed circuit board and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9949379-B2
Application number	US-201414897214-A
Country	US
Kind code	B2
Filing date	Apr 30, 2014
Priority date	Apr 30, 2013
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.

First claim

What is claimed is:

1. A method for manufacturing a flexible printed circuit board, comprising:
forming a circuit pattern on a substrate;
polishing the circuit pattern; and
forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate;
wherein forming the circuit pattern comprises:
printing a conductive paste; and
firing the conductive paste,

wherein polishing the circuit pattern includes polishing a surface of the circuit pattern after firing to remove a hydrophobic portion,
wherein forming the protective coating layer includes directly applying the coating solution on the polished surface of the circuit pattern.

2. The method of claim 1 , wherein the conductive paste is a silver paste comprising a silver powder, a polymer resin, and a solvent, and the silver paste comprises 73 to 88 wt % of a silver powder, 5.9 to 9.5 wt % of a polymer resin, and 5.7 to 18.0 wt % of a solvent, and the firing is performed at 200 to 450° C.

3. The method of claim 1 , wherein forming the protective coating layer comprises applying the coating solution, excluding a portion in which a via hole is formed.

4. The method of claim 1 , wherein the coating solution is a PAI solution or a PI solution.

5. The method of claim 1 , wherein the coating solution further comprises an anti-curling agent.

6. The method of claim 1 , wherein the coating solution is a PI solution including 2 to 5 wt % of silica or a PAI solution including 2 to 5 wt % of silica.

7. The method of claim 1 , wherein forming the protective coating layer comprises applying the coating solution on the substrate through screen printing using a waterproof mesh screen.

8. The method of claim 1 , further comprising forming a via hole in the substrate and filling the via hole with a conductor before forming the circuit pattern,
forming the circuit pattern comprising forming a first circuit pattern on a first surface of the substrate and forming a second circuit pattern on a second surface of the substrate, and
forming the protective coating layer comprising applying, drying and curing a coating solution on the first surface of the substrate and the second surface of the substrate, thus forming a first protective coating layer for covering and protecting the first circuit pattern and a second protective coating layer for covering and protecting the second circuit pattern on the first surface of the substrate and the second surface of the substrate, respectively.

9. The method of claim 1 , further comprising baking the substrate through heating to remove water therefrom before forming the circuit pattern.

Assignees

• Amogreentech Co Ltd

Inventors

• Kim Jongsoo
• Yu Jeong-Sang
• Kwon O-Chung
• Kim Jae-Sic

Classifications

• H05K2201/0154

  Polyimide · CPC title

• H05K3/4676

  Single layer compositions · CPC title

• H05K3/46

  Manufacturing multilayer circuits · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K3/285 Primary

  Permanent coating compositions · CPC title