Substrate for light emitting devices and light emitting device

Patent metadata

Field	Value
Publication number	US-9947850-B2
Application number	US-201515124724-A
Country	US
Kind code	B2
Filing date	Feb 27, 2015
Priority date	Apr 4, 2014
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate ( 5 ) includes an intermediate layer ( 11 ) containing ceramic which is formed on the surface of the aluminum base ( 10 ) by using an aerosol deposition method.

First claim

The invention claimed is:

1. A substrate for light emitting devices, comprising:
a base containing a metal material;
a first insulating layer which is formed on one surface of the base; and
a wiring pattern which is formed on the first insulating layer, wherein
the first insulating layer is formed of ceramic which is formed by using an aerosol deposition method,
a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer, and
the first insulating layer has thermal conductivity and contains an additive of an inorganic material for improving brightness.

2. A substrate for light emitting devices, comprising:
a base containing a metal material;
a first insulating layer which is formed on one surface of the base;
a wiring pattern which is formed on the first insulating layer,
a second insulating layer having thermal conductivity and light reflectivity which is formed between the first insulating layer and the wiring pattern, wherein
the first insulating layer is formed of ceramic which is formed by using an aerosol deposition method,
a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer,
the first insulating layer has thermal conductivity,
the second insulating layer contains ceramic which is formed by using the aerosol deposition method, and
the second insulating layer further contains an additive of an inorganic material for improving brightness which is formed by using the aerosol deposition method and which is contained in the second insulating layer and is entirely ceramic having high brightness.

3. A substrate for light emitting devices, comprising:
a base containing a metal material;
a first insulating layer which is formed on one surface of the base; and
a wiring pattern which is formed on the first insulating layer,
a second insulating layer having light reflectivity which is formed between the first insulating layer and the wiring pattern, wherein
the first insulating layer is formed of ceramic which is formed by using an aerosol deposition method,
a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer,
the first insulating layer has thermal conductivity and reinforces dielectric strength voltage properties of the second insulating layer, and
the thermal conductivity of the first insulating layer is higher than the thermal conductivity of the second insulating layer, and
the second insulating layer is a mixed layer of ceramic and a vitreous matter or a mixed layer of ceramic and a resin.

4. A substrate for light emitting devices, comprising:
a base containing a metal material;
a first insulating layer having light reflectivity which is formed on one surface of the base;
a second insulating layer having thermal conductivity which is formed on the other surface of the base; and
a wiring pattern which is formed on the first insulating layer, wherein
the second insulating layer is formed of ceramic which is formed by using an aerosol deposition method and reinforces dielectric strength voltage properties of the first insulating layer,
a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer,
the thermal conductivity of the first insulating layer is higher than the thermal conductivity of the second insulating layer, and
the second insulating layer is a mixed layer of ceramic and a vitreous matter or a mixed layer of ceramic and a resin.

Assignees

• Sharp Kk

Inventors

• Konishi Masahiro
• Itoh Shin
• Nokubo Hiroyuki
• Itakura Yoshiaki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H05K3/44

  Manufacturing insulated metal core circuits {or other insulated electrically conductive core circuits (H05K3/0058, H05K3/4608, and H05K3/4641 take precedence)} · CPC title

• F21K9/00

  Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title

• H01L2933/005

  Electricity · mapped topic