Three-dimensional semiconductor memory device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9947683-B2
Application number	US-201615013153-A
Country	US
Kind code	B2
Filing date	Feb 2, 2016
Priority date	Sep 11, 2015
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

According to one embodiment, a semiconductor memory device includes a structural body, first to fourth pillars, a first interconnection, a second interconnection, a third interconnection, and a fourth interconnection. The first to fourth pillars are provided within the structural body extending along the first direction. A first distance between the first pillar and the first interconnection is greater than a second distance between the third pillar and the third interconnection. The first distance is greater than a third distance between the fourth pillar and the fourth interconnection. A fourth distance between the second pillar and the second interconnection is greater than the second distance. The fourth distance is greater than the third distance.

First claim

What is claimed is:

1. A semiconductor memory device comprising:
a structural body including a plurality of electrode layers arranged in a first direction;
a first pillar, a second pillar, a third pillar, and a fourth pillar provided in the structural body, the first to fourth pillars extending along the first direction in the structural body;
a plurality of charge storage films provided between the first pillar and the electrode layers, between the second pillar and the electrode layers, between the third pillar and the electrode layers, and between the fourth pillar and the electrode layers;
a first interconnection extending in a second direction and electrically connected to the first pillar, the second direction crossing the first direction, a length of the first interconnection in the second direction being greater than a length of the first interconnection in the first direction;
a second interconnection extending in the second direction and electrically connected to the second pillar, a length of the second interconnection in the second direction being greater than a length of the second interconnection in the first direction;
a third interconnection extending in the second direction and electrically connected to the third pillar, a length of the third interconnection in the second direction being greater than a length of the third interconnection in the first direction; and
a fourth interconnection extending in the second direction and electrically connected to the fourth pillar, a length of the fourth interconnection in the second direction being greater than a length of the fourth interconnection in the first direction,
a first distance between the first pillar and the first interconnection in the first direction being greater than a second distance between the third pillar and the third interconnection in the first direction, and the first distance being greater than a third distance between the fourth pillar and the fourth interconnection in the first direction, and
a fourth distance between the second pillar and the second interconnection in the first direction being greater than the second distance, the fourth distance being greater than the third distance.

2. The device according to claim 1 , wherein
the second interconnection is disposed between the first interconnection and the fourth interconnection upon viewed from the first direction, and
the third interconnection is disposed between the first interconnection and the second interconnection upon viewed from the first direction.

3. The device according to claim 1 , wherein
at least a portion of the first interconnection overlaps at least a portion of the second interconnection in a third direction, the third direction crossing the first direction and the second direction, and
at least a portion of the third interconnection overlaps with at least a portion of the fourth interconnection in the third direction.

4. The device according to claim 1 , further comprising:
a first conductive member provided between the first pillar and the first interconnection, the first conductive member electrically connecting the first pillar to the first interconnection;
a second conductive member provided between the second pillar and the second interconnection, the second conductive member electrically connecting the second pillar to the second interconnection;
a third conductive member provided between the third pillar and the third interconnection, the third conductive member electrically connecting the third pillar to the third interconnection; and
a fourth conductive member provided between the fourth pillar and the fourth interconnection, the fourth conductive member electrically connecting the fourth pillar to the fourth interconnection;
wherein a length of the first conductive member in the first direction is longer than a length of the third conductive member in the first direction,
the length of the first conductive member is longer than a length of the fourth conductive member in the first direction,
a length of the second conductive member in the first direction is longer than the length of the third conductive member in the first direction, and
the length of the second conductive member is longer than the length of the fourth conductive member in the first direction.

5. The device according to claim 2 , wherein
the second pillar is disposed between the first pillar and the fourth pillar upon being viewed from the first direction, and
the third pillar is disposed between the second pillar and the fourth pillar upon being viewed from the first direction.

6. The device according to claim 2 , wherein
the first pillar is disposed between the third pillar and the fourth pillar upon being viewed from the first direction, and
the second pillar is disposed between the first pillar and the third pillar upon being viewed from the first direction.

7. The device according to claim 2 , wherein
the second pillar is disposed between the first pillar and the fourth pillar upon being viewed from the first direction, and
the third pillar is disposed between the first pillar and the second pillar upon being viewed from the first direction.

8. The device according to claim 4 , wherein the first conductive member includes:
a first portion;
a second portion provided on the first portion; and
a step portion provided between the first portion and the second portion, wherein
a first length of the first portion in the second direction is greater than a second length of the first portion in a third direction crossing the first direction and the second direction,
a third length of the second portion in the second direction is greater than a fourth length of the second portion in the third direction, and
a second length of the first portion in the third direction is greater than the fourth length of the second portion in the third direction.

9. The device according to claim 8 , wherein at least a portion of the second portion overlaps with at least a portion of the third interconnection and at least a portion of the fourth interconnection in the third direction.

10. The device according to claim 8 , wherein the step portion is provided between the third interconnection and the fourth interconnection in the first direction.

11. The device according to claim 8 , wherein the step portion is provided on the third interconnection and on the fourth interconnection.

12. The device according to claim 8 , wherein in the third direction crossing the first direction and the second direction, the second portion does not overlap the third interconnection and the fourth interconnection.

13. A method for manufacturing a semiconductor memory device, the method comprising:
forming a structural body that includes a plurality of first layers disposed in a first direction;
forming a first memory hole, a second memory hole, a third memory hole, and a fourth memory hole in the structural body, the first to fourth memory holes extending along the first direction;
forming a plurality of charge storage films on side walls of the first to fourth memory holes;
forming first to fourth pillars in the first to fourth memory holes respectively;
forming a first insulating film on the structural body;
forming a third conductive member in a region of the first insulating film above the third pillar, and forming a fourth conductive member in a region of the first insulating film above the fourth pillar;
forming a second insulating film on the first insulating film, the third conductive member, and the fourth conductive member;
forming in the second insulating film, a first groove extending in a second di

Assignees

• Toshiba Memory Corp

Inventors

• Shimojo Yoshiro

Classifications

• H10W20/0693

  by forming self-aligned vias · CPC title

• H10W20/081

  by forming openings in the dielectric parts · CPC title

• H10W20/076

  in via holes or trenches · CPC title

• H10W20/069

  by forming self-aligned vias or self-aligned contact plugs · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title