Integrated circuit package, and methods and tools for fabricating the same

Patent metadata

Field	Value
Publication number	US-9947560-B1
Application number	US-201615358513-A
Country	US
Kind code	B1
Filing date	Nov 22, 2016
Priority date	Nov 22, 2016
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

An integrated circuit (IC) package, assembly tool and method for assembling an IC package are described herein. In a first example, an IC package is provided that includes a package substrate, at least a first integrated circuit (IC) die and a cover. The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections. The cover is bonded to the package substrate. The cover encloses the first IC die and is laterally offset from a peripheral edge of the package substrate.

First claim

What is claimed is:

1. An assembly tool for assembling an integrated circuit (IC) package, the tool comprising:
a base assembly;
a clamp removably disposed on the base assembly, the clamp comprising:
sidewalls having a top surface and a bottom surface, the bottom surface configured to be disposed on the base assembly;
a first aperture formed between the sidewalls, the first aperture extending between the top surface and the bottom surface; and
a first notch formed in the bottom surface of the sidewalls and open to the first aperture; and

a cover plate having a first boss configured to extend into the first aperture.

2. The assembly tool of claim 1 , wherein the base assembly further comprises:
a heater.

3. The assembly tool of claim 1 further comprising:
resilient force generating objects disposed between the clamp and the cover plate.

4. The assembly tool of claim 1 , wherein the first notch is configured to receive a perimeter edge of a package substrate.

5. The assembly tool of claim 1 , wherein clamp further comprises:
a plurality of apertures that includes the first aperture, each of the plurality of apertures open to the base assembly configured to accept a portion of a package substrate.

6. The assembly tool of claim 5 , wherein cover plate further comprises:
a plurality of bosses that includes the first boss, each of the plurality of bosses configured extend into a respective one of the plurality of apertures.

7. The assembly tool of claim 5 , wherein clamp further comprises:
a plurality of notches that includes the first notch, each of the plurality of notches opening into a respective one of the plurality of apertures.

Assignees

• Xilinx Inc

Inventors

• Mardi Mohsen H
• Tan David
• Refai-Ahmed Gamal

Classifications

• H10W76/10

  Containers or parts thereof · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title