Coating treatment method with airflow control, and non-transitory recording medium having program recorded thereon for executing coating treatment with airflow control

US9947534B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9947534-B2
Application numberUS-201514813820-A
CountryUS
Kind codeB2
Filing dateJul 30, 2015
Priority dateApr 26, 2011
Publication dateApr 17, 2018
Grant dateApr 17, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.

First claim

Opening claim text (preview).

What is claimed is: 1. A coating treatment method of supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate, said method comprising: a first step of controlling a supply of the coating solution to the front surface of the substrate with the substrate being rotated at a first rotation speed that diffuses the coating solution toward the outer periphery side of the substrate; a second step of controlling, after said first step, to stop the supply of the coating solution at a point in time before an outer periphery of the coating solution reaches the outer periphery side of the substrate, with the substrate being decelerated to a second rotation speed lower than the first rotation speed or with the substrate being rotated at the second rotation speed that increases a thickness at the outer periphery of the coating solution; and a third step of controlling, after said second step, to rotate the substrate at a third rotation speed higher than the second rotation speed that diffuses the coating solution to reach the outer periphery side of the substrate, wherein an airflow above the rotated substrate is locally changed by moving an airflow control plate provided to be movable to a predetermined position above the substrate, to the predetermined position by a drive part after stop of the supply of the coating solution to the front surface of the substrate. 2. The coating treatment method as set forth in claim 1 , wherein said third step comprises: a fourth step of rotating the substrate at the third rotation speed; and a fifth step of rotating, after said fourth step, the substrate at a fourth rotation speed lower than the third rotation speed, wherein in said fifth step, the airflow above the rotated substrate is locally changed by placing the airflow control plate at the predetermined position by the drive part while the substrate is being rotated at the fourth rotation speed. 3. The coating treatment method as set forth in claim 2 , wherein a rotation speed of the substrate when the airflow control plate is placed at the predetermined position is 50 to 100 rpm. 4. A non-transitory computer-readable recording medium having a program recorded thereon for causing a computer to execute a coating treatment method of supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate, wherein said coating treatment method comprises: a first step of controlling a supply of the coating solution to the front surface of the substrate with the substrate being rotated at a first rotation speed that diffuses the coating solution toward the outer periphery side of the substrate; a second step of controlling, after said first step, to stop the supply of the coating solution at a point in time before an outer periphery of the coating solution reaches the outer periphery side of the substrate, with the substrate being decelerated to a second rotation speed lower than the first rotation speed or with the substrate being rotated at the second rotation speed that increases a thickness at the outer periphery of the coating solution; and a third step of controlling, after said second step, to rotate the substrate at a third rotation speed higher than the second rotation speed that diffuses the coating solution to reach the outer periphery side of the substrate, wherein an airflow above the rotated substrate is locally changed by moving an airflow control plate provided to be movable to a predetermined position above the substrate, to the predetermined position by a drive part after stop of the supply of the coating solution to the front surface of the substrate.

Assignees

Inventors

Classifications

  • of masks comprising organic materials · CPC title

  • Apparatus for applying a liquid, a resin, an ink or the like · CPC title

  • in liquid form, e.g. spin coating, spray coating or immersion coating · CPC title

  • characterised by the processes involved to create the masks · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US9947534B2 cover?
A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P76/4085. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).