Methods of forming semiconductor devices
US-2024387699-A1 · Nov 21, 2024 · US
US9947534B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9947534-B2 |
| Application number | US-201514813820-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2015 |
| Priority date | Apr 26, 2011 |
| Publication date | Apr 17, 2018 |
| Grant date | Apr 17, 2018 |
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A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.
Opening claim text (preview).
What is claimed is: 1. A coating treatment method of supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate, said method comprising: a first step of controlling a supply of the coating solution to the front surface of the substrate with the substrate being rotated at a first rotation speed that diffuses the coating solution toward the outer periphery side of the substrate; a second step of controlling, after said first step, to stop the supply of the coating solution at a point in time before an outer periphery of the coating solution reaches the outer periphery side of the substrate, with the substrate being decelerated to a second rotation speed lower than the first rotation speed or with the substrate being rotated at the second rotation speed that increases a thickness at the outer periphery of the coating solution; and a third step of controlling, after said second step, to rotate the substrate at a third rotation speed higher than the second rotation speed that diffuses the coating solution to reach the outer periphery side of the substrate, wherein an airflow above the rotated substrate is locally changed by moving an airflow control plate provided to be movable to a predetermined position above the substrate, to the predetermined position by a drive part after stop of the supply of the coating solution to the front surface of the substrate. 2. The coating treatment method as set forth in claim 1 , wherein said third step comprises: a fourth step of rotating the substrate at the third rotation speed; and a fifth step of rotating, after said fourth step, the substrate at a fourth rotation speed lower than the third rotation speed, wherein in said fifth step, the airflow above the rotated substrate is locally changed by placing the airflow control plate at the predetermined position by the drive part while the substrate is being rotated at the fourth rotation speed. 3. The coating treatment method as set forth in claim 2 , wherein a rotation speed of the substrate when the airflow control plate is placed at the predetermined position is 50 to 100 rpm. 4. A non-transitory computer-readable recording medium having a program recorded thereon for causing a computer to execute a coating treatment method of supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate, wherein said coating treatment method comprises: a first step of controlling a supply of the coating solution to the front surface of the substrate with the substrate being rotated at a first rotation speed that diffuses the coating solution toward the outer periphery side of the substrate; a second step of controlling, after said first step, to stop the supply of the coating solution at a point in time before an outer periphery of the coating solution reaches the outer periphery side of the substrate, with the substrate being decelerated to a second rotation speed lower than the first rotation speed or with the substrate being rotated at the second rotation speed that increases a thickness at the outer periphery of the coating solution; and a third step of controlling, after said second step, to rotate the substrate at a third rotation speed higher than the second rotation speed that diffuses the coating solution to reach the outer periphery side of the substrate, wherein an airflow above the rotated substrate is locally changed by moving an airflow control plate provided to be movable to a predetermined position above the substrate, to the predetermined position by a drive part after stop of the supply of the coating solution to the front surface of the substrate.
of masks comprising organic materials · CPC title
Apparatus for applying a liquid, a resin, an ink or the like · CPC title
in liquid form, e.g. spin coating, spray coating or immersion coating · CPC title
characterised by the processes involved to create the masks · CPC title
Electricity · mapped topic
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