Prepreg, metal-clad laminated board, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9944766-B2
Application number	US-201515502514-A
Country	US
Kind code	B2
Filing date	Aug 21, 2015
Priority date	Aug 27, 2014
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×10 4 or more and less than 45×10 4 . A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.

First claim

The invention claimed is:

1. A prepreg comprising:
a fiber base material; and
a thermosetting resin composition impregnated into the fiber base material,
the thermosetting resin composition containing:
a thermosetting resin including an epoxy resin;
a curing agent;
an inorganic filler; and
an acrylic acid ester copolymer having a weight average molecular weight of 10×10 4 or more and less than 45×10 4 ,

a content of the inorganic filler being 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent, and
a content of the acrylic acid ester copolymer being more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.

2. The prepreg according to claim 1 , wherein the acrylic acid ester copolymer has a functional group having reactivity with at least either one of the epoxy resin and the curing agent.

3. The prepreg according to claim 1 , wherein the inorganic filler contains 80% by mass or more of silica.

4. The prepreg according to claim 1 , wherein the curing agent is a bifunctional or polyfunctional phenol resin.

5. A metal-clad laminated board comprising:
an insulating layer being a cured product of the prepreg according to claim 1 ; and
a metal foil provided on the insulating layer.

6. A printed wiring board comprising:
an insulating layer being a cured product of the prepreg according to claim 1 ; and
a conductive pattern provided on the insulating layer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Matsumoto Masaaki
• Mito Takatoshi
• Yonemoto Tatuo

Classifications

• B32B5/024

  Woven fabric · CPC title

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

• B32B2262/0276

  Polyester fibres · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• B32B15/092

  comprising epoxy resins · CPC title