Modular, high density, low inductance, media cooled resistor

Patent metadata

Field	Value
Publication number	US-9941036-B2
Application number	US-201615013768-A
Country	US
Kind code	B2
Filing date	Feb 2, 2016
Priority date	Feb 2, 2016
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

A resistor includes a first resistor element. The first resistor element is connected to at least a first electrical terminal and a second electrical terminal. The first resistor element is configured to directly contact cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element. The resistor may also include a second resistor element connected to at least the first electrical terminal and the second electrical terminal, where the second resistor element is configured to directly contact the cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.

First claim

What is claimed is:

1. A resistor comprising:
first and second electrical terminals that are spaced apart from each other, each electrical terminal comprising a plurality of connection points;
a first substantially planar resistor element having a first end connected to a first one of the connection points of the first electrical terminal and a second end connected to a first one of the connection points of the second electrical terminal, the first resistor element configured to directly contact one or more cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element; and
a second substantially planar resistor element having a first end connected to a second one of the connection points of the first electrical terminal and a second end connected to a second one of the connection points of the second electrical terminal, the second resistor element configured to directly contact the one or more cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.

2. The resistor of claim 1 , wherein at least the first electrical terminal and the second electrical terminal form a media channel configured to communicate the one or more cooling media across the first and second resistor elements.

3. The resistor of claim 1 , wherein:
the at least two surfaces of the first resistor element are disposed on opposing sides of the first resistor element; and
the at least two surfaces of the second resistor element are disposed on opposing sides of the second resistor element.

4. The resistor of claim 1 , wherein:
when a voltage drop occurs across the first resistor element, the first resistor element is configured to transfer heat to the one or more cooling media via the at least two surfaces of the first resistor element; and
when a voltage drop occurs across the second resistor element, the second resistor element is configured to transfer heat to the one or more cooling media via the at least two surfaces of the second resistor element.

5. The resistor of claim 1 , wherein:
an area of each of the at least two surfaces of the first resistor element is greater than an area of each remaining surface of the first resistor element; and
an area of each of the at least two surfaces of the second resistor element is greater than an area of each remaining surface of the second resistor element.

6. The resistor of claim 1 , wherein each of the at least two surfaces of the first resistor element and each of the at least two surfaces of the second resistor element comprises a ruthenium (IV) oxide (RuO 2 ) film.

7. The resistor of claim 1 , wherein:
the at least two surfaces of the first resistor element are separated by a first substrate; and
the at least two surfaces of the second resistor element are separated by a second substrate.

8. A resistor system comprising:
a resistor; and
a manifold configured to house the resistor and provide one or more cooling media for communication through the resistor,
wherein the resistor comprises:
first and second electrical terminals that are spaced apart from each other, each electrical terminal comprising a plurality of connection points;
a first substantially planar resistor element having a first end connected to a first one of the connection points of the first electrical terminal and a second end connected to a first one of the connection points of the second electrical terminal, the first resistor element configured to directly contact the one or more cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element; and
a second substantially planar resistor element having a first end connected to a second one of the connection points of the first electrical terminal and a second end connected to a second one of the connection points of the second electrical terminal, the second resistor element configured to directly contact the one or more cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.

9. The resistor system of claim 8 , wherein the manifold comprises:
a first cavity configured to receive the one or more cooling media from an inlet port; and
a second cavity configured to transfer the one or more cooling media to an outlet port.

10. The resistor system of claim 9 , wherein at least the first electrical terminal and the second electrical terminal form a media channel configured to receive the one or more cooling media from the first cavity, permit communication of the one or more cooling media across the first and second resistor elements, and provide the one or more cooling media to the second cavity.

11. The resistor system of claim 8 , wherein:
the at least two surfaces of the first resistor element are disposed on opposing sides of the first resistor element; and
the at least two surfaces of the second resistor element are disposed on opposing sides of the second resistor element.

12. The resistor system of claim 8 , wherein:
when a voltage drop occurs across the first resistor element, the first resistor element is configured to transfer heat to the one or more cooling media via the at least two surfaces of the first resistor element; and
when a voltage drop occurs across the second resistor element, the second resistor element is configured to transfer heat to the one or more cooling media via the at least two surfaces of the second resistor element.

13. The resistor system of claim 8 , wherein:
an area of each of the at least two surfaces of the first resistor element is greater than an area of each remaining surface of the first resistor element; and
an area of each of the at least two surfaces of the second resistor element is greater than an area of each remaining surface of the second resistor element.

14. The resistor system of claim 8 , wherein each of the at least two surfaces of the first resistor element and each of the at least two surfaces of the second resistor element comprises a ruthenium (IV) oxide (RuO 2 ) film.

15. The resistor system of claim 8 , wherein:
the at least two surfaces of the first resistor element are separated by a first substrate; and
the at least two surfaces of the second resistor element are separated by a second substrate.

16. A method comprising:
receiving one or more cooling media by an inlet of a channel of a resistor, the channel between a first electrical terminal and a second electrical terminal of the resistor, the first and second electrical terminals spaced apart from each other, each electrical terminal comprising a plurality of connection points;
permitting direct contact between the one or more cooling media and at least a first surface and a second surface of a first substantially planar resistor element of the resistor, the first resistor element having a first end connected to a first one of the connection points of the first electrical terminal and a second end connected to a first one of the connection points of the second electrical terminal;
permitting direct contact between the one or more cooling media and at least a first surface and a second surface of a second substantially planar resistor element of the resistor, the second resistor element having a first end connected to a second one of the connection points of the first electrical terminal and a second end connected to a second one of the connection points of the second electrical terminal; and
communicating the one or more

Assignees

• Raytheon Co

Inventors

• Morico Peter D
• Jaworski Bradley S

Classifications

• H01C1/082 Primary

  using forced fluid flow · CPC title

• H01C13/02

  Structural combinations of resistors · CPC title

• H01C1/014

  the resistor being suspended between and being supported by two supporting sections (H01C1/016 takes precedence) · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C1/08

  Cooling, heating or ventilating arrangements · CPC title