Low-resistance connection body for high-temperature superconducting wire material and connection method

US9941032B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9941032-B2
Application numberUS-201415116432-A
CountryUS
Kind codeB2
Filing dateOct 21, 2014
Priority dateFeb 4, 2014
Publication dateApr 10, 2018
Grant dateApr 10, 2018

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Provided is a low-resistance connection body for a high-temperature superconducting wire, in which a high-temperature superconducting bulk body and a high-temperature superconducting wire including a high-temperature superconducting layer are connected to each other, wherein a melting point of the high-temperature superconducting layer is higher than a melting point of the high-temperature superconducting bulk body; the high-temperature superconducting layer and the high-temperature superconducting bulk body are in contact at a connection site of the high-temperature superconducting wire and the high-temperature superconducting bulk body; and a surface of the high-temperature superconducting bulk body that is in contact with the high-temperature superconducting layer is crystallized due to crystal growth. Two high-temperature superconducting wires can be connected, with low resistance, through connection of the two high-temperature superconducting wires to one high-temperature superconducting bulk.

First claim

Opening claim text (preview).

The invention claimed is: 1. A low-resistance connection body for a high-temperature superconducting wire, in which a high-temperature superconducting bulk body and a high-temperature superconducting wire including a high-temperature superconducting layer are connected to each other, wherein a melting point of the high-temperature superconducting layer comprising REBa 2 Cu 3 O 7-δ is higher than a melting point of the high-temperature superconducting bulk body comprising RE′Ba 2 Cu 3 O 7-δ , each of RE and RE′ being one or a plurality of rare earth elements, and an element or composition of RE′ being different from that of RE; the high-temperature superconducting layer and the high-temperature superconducting bulk body are in contact at a connection site of the high-temperature superconducting wire and the high-temperature superconducting bulk body; and a surface of the high-temperature superconducting bulk body that is in contact with the high-temperature superconducting layer is crystallized into single crystal, and other portions of the high-temperature superconducting bulk body is crystallized into polycrystal due to crystal growth. 2. The low-resistance connection body for a high-temperature superconducting wire according to claim 1 , wherein the superconducting bulk body comprises RE′123 phase and RE′ 211 phase. 3. The low-resistance connection body for a high-temperature superconducting wire according to claim 1 , wherein the high-temperature superconducting wire comprises a stack of a substrate, the high-temperature superconducting layer, and a protection layer. 4. A low-resistance connection body for a high-temperature superconducting wire, in which a first high-temperature superconducting wire including a first high-temperature superconducting layer comprising RE 1 Ba 2 Cu 3 O 7-δ and a second high-temperature superconducting wire including a second high-temperature superconducting layer comprising RE 2 Ba 2 Cu 3 O 7-δ are connected to each other via a high-temperature superconducting bulk body comprising RE′Ba 2 Cu 3 O 7-δ , wherein each of RE 1 , RE 2 , and RE′ being one or a plurality of rare earth elements, and an element or composition of RE′ being different from that of RE 1 or RE 2 ; melting points of the first and second high-temperature superconducting layers are higher than a melting point of the high-temperature superconducting bulk body; the first and second high-temperature superconducting layers and the high-temperature superconducting bulk body are in contact at connection sites of the first high-temperature superconducting wire and the second high-temperature superconducting layer of the second high-temperature superconducting wire and the high-temperature superconducting bulk body; and surfaces of the high-temperature superconducting bulk body that are in contact with the first and second high-temperature superconducting layers are crystallized into single crystal, and other portions of the high-temperature superconducting bulk body is crystallized into polycrystal due to crystal growth. 5. The low-resistance connection body for a high-temperature superconducting wire according to claim 4 , wherein the first high-temperature superconducting layer of the first high-temperature superconducting wire and the second high-temperature superconducting layer of the second high-temperature superconducting wire are connected at a same surface of the high-temperature superconducting bulk body. 6. The low-resistance connection body for a high-temperature superconducting wire according to claim 4 , wherein the first high-temperature superconducting layer of the first high-temperature superconducting wire and the second high-temperature superconducting layer of the second high-temperature superconducting wire are connected at different surfaces of the high-temperature superconducting bulk body. 7. The low-resistance connection body for a high-temperature superconducting wire according to claim 4 , wherein the first high-temperature superconducting layer of the first high-temperature superconducting wire and the second high-temperature superconducting layer of the second high-temperature superconducting wire are connected at the same surface of the high-temperature superconducting bulk body. 8. The low-resistance connection body for a high-temperature superconducting wire according to claim 4 , wherein the first high-temperature superconducting layer of the first high-temperature superconducting wire and the second high-temperature superconducting layer of the second high-temperature superconducting wire are connected at different surfaces of the high-temperature superconducting bulk body. 9. The low-resistance connection body for a high-temperature superconducting wire according to claim 4 , wherein the superconducting bulk body comprises RE′123 phase and RE′ 211 phase. 10. The low-resistance connection body for a high-temperature superconducting wire according to claim 4 , wherein each of the first high-temperature superconducting wire and the second high-temperature superconducting wire comprises a stack of a substrate, a high-temperature superconducting layer, and a protection layer. 11. A low-resistance connection method for a high-temperature superconducting wire, for connecting a high-temperature superconducting wire including a high-temperature superconducting layer with a high-temperature superconducting bulk body, the melting point of which is lower than that of the high-temperature superconducting layer, the method comprising: a temperature rise step of heating the high-temperature superconducting bulk body comprising REBa 2 Cu 3 O 7-δ up to a temperature that is equal to or higher than a melting point of the high-temperature superconducting bulk body and lower than a melting point of the high-temperature superconducting layer comprising RE′Ba 2 Cu 3 O 7-δ , each of RE and RE′ being one or a plurality of rare earth elements, and an element or composition of RE′ being different from that of RE; and a crystal growth step of performing crystal growth on the high-temperature superconducting bulk body in a state where a liquid phase portion of the high-temperature superconducting bulk body and the high-temperature superconducting layer are in contact with each other, the crystal growth leading to a formation of a single crystal at a contact surface of the high-temperature superconducting bulk body and a polycrystal at other portions of the high-temperature superconducting bulk body. 12. A low-resistance connection method for a high-temperature superconducting wire, for connecting a first high-temperature superconducting wire including a first high-temperature superconducting layer comprising RE 1 Ba 2 Cu 3 O 7-δ and a second high-temperature superconducting wire including a second high-temperature superconducting layer comprising RE 2 Ba 2 Cu 3 O 7-δ with a high-temperature superconducting bulk body comprising RE′Ba 2 Cu 3 O 7-δ , the melting point of which is lower than those of the first high-temperature superconducting layer and the second high-temperature superconducting layer, each of RE 1 , RE 2 , and RE′ being one or a plurality of rare earth elements, and an element or composition of RE′ being different from that of RE 1 or RE 2 ; the method comprising: a temperature rise step of heating the high-temperature superconducting bulk body up to a temperature that is equal to or higher than a melting point of the high-temperature superconducting bulk body and lower than melting points of the first and second high-temperature superconducting layers; and a crystal growth step of performing crystal growth on the high-temperature superconducting bulk

Assignees

Inventors

Classifications

  • for soldered or welded connections · CPC title

  • H01R4/68Primary

    Connections to or between superconductive connectors · CPC title

  • Coils, e.g. winding, insulating, terminating or casing arrangements therefor · CPC title

  • H01B12/04Primary

    Single wire · CPC title

  • Electricity · mapped topic

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What does patent US9941032B2 cover?
Provided is a low-resistance connection body for a high-temperature superconducting wire, in which a high-temperature superconducting bulk body and a high-temperature superconducting wire including a high-temperature superconducting layer are connected to each other, wherein a melting point of the high-temperature superconducting layer is higher than a melting point of the high-temperature supe…
Who is the assignee on this patent?
Riken
What technology area does this patent fall under?
Primary CPC classification H01R4/68. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).