Connection structure of high-temperature superconducting wire piece, high-temperature superconducting wire using connection structure, and high-temperature superconducting coil using connection structure

US2016240284A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016240284-A1
Application numberUS-201615042449-A
CountryUS
Kind codeA1
Filing dateFeb 12, 2016
Priority dateFeb 13, 2015
Publication dateAug 18, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate. The tape-type laminated body including at least the substrate and the high-temperature superconducting layer. The conductor layer covering an outer periphery of the tape-type laminated body. The passage forming body serving as a flowing path of a superconducting current generated in the high-temperature superconducting wire piece. The passage forming body is bonded by a bonding material is arranged on a side surface of the conductor layer, the side surface being located on an opposite side to the high-temperature superconducting layer with respect to the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1 . A connection structure of a high-temperature superconducting wire piece, comprising: a substrate; a high-temperature superconducting layer formed on one surface of the substrate; a tape-type laminated body including at least the substrate and the high-temperature superconducting layer; a conductor layer covering an outer periphery of the tape-type laminated body; and a passage forming body serving as a flowing path of a superconducting current generated in the high-temperature superconducting wire piece, wherein the passage forming body is bonded by a bonding material arranged on a side surface of the conductor layer, the side surface being located on an opposite side to the high-temperature superconducting layer with respect to the substrate. 2 . The connection structure of the high-temperature superconducting wire piece according to claim 1 , wherein the passage forming body is a second high-temperature superconducting wire piece, the second high-temperature superconducting wire piece includes a second substrate, a second high-temperature superconducting layer formed on one surface of the second substrate, a second tape-type laminated body including at least the second substrate and the second high-temperature superconducting layer, and a second conductor layer covering an outer periphery of the second tape-type laminated body, and the bonding material is arranged on a side surface of the second conductor layer, the side surface being located on an opposite side to the second high-temperature superconducting layer with respect to the second substrate. 3 . The connection structure of the high-temperature superconducting wire piece according to claim 1 , wherein the passage forming body is a lead-out electrode which is connected to an end portion of the high-temperature superconducting wire pieces wound into a coil to allow the superconducting current to flow to the outside of the coil. 4 . The connection structure of the high-temperature superconducting wire piece according to one of claim 1 , wherein the passage forming body is a connection conductor which electrically connects two coils, each coil being formed by winding the high-temperature superconducting wire piece. 5 . The connection structure of the high-temperature superconducting wire piece according to claim 1 , wherein the passage forming body is a high-temperature superconductivity silver sheathed wire. 6 . The connection structure of the high-temperature superconducting wire piece according to claim 5 , wherein the passage forming body is a wire piece whose length along a tape longitudinal direction of the high-temperature superconducting wire piece is 50 times or less than a length in a direction perpendicular to the tape longitudinal direction. 7 . The high-temperature superconducting wire according to claim 6 , comprising a connection structure in which the side surfaces of two or more of the high-temperature superconducting wire pieces are arranged in a same direction and are connected to each other by the wire piece. 8 . A high-temperature superconducting wire using the connection structure of the high-temperature superconducting wire piece according to claim 1 . 9 . A high-temperature superconducting coil using the connection structure of the high-temperature superconducting wire piece according to claim 1 .

Assignees

Inventors

Classifications

  • H01B12/06Primary

    Films or wires on bases or cores · CPC title

  • Coils, e.g. winding, insulating, terminating or casing arrangements therefor · CPC title

  • Constructional details · CPC title

  • Cable fittings for cryogenic cables {(superconductive cables per se H01B12/00)} · CPC title

  • Connections to or between superconductive connectors · CPC title

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Frequently asked questions

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What does patent US2016240284A1 cover?
A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate. The tape-type laminated body including at least the substrate and the high-temperature superconducting layer. The cond…
Who is the assignee on this patent?
Toshiba Kk
What technology area does this patent fall under?
Primary CPC classification H01B12/06. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Aug 18 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).