Pin fin compliant heat sink with enhanced flexibility

Patent metadata

Field	Value
Publication number	US-9939210-B2
Application number	US-201414500541-A
Country	US
Kind code	B2
Filing date	Sep 29, 2014
Priority date	Sep 29, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.

First claim

The invention claimed is:

1. A heat sink, comprising:
a top and bottom plate, at least one of which comprises a plurality of pin contacts flexibly connected to one another, wherein the plurality of pin contacts have vertical and lateral flexibility with respect to one another, wherein at least one of the top and bottom plates is a corrugated plate that includes interlocking protrusions on opposite sides of the plate and wherein the pin contacts are flexibly connected to one another by the top and bottom plates; and
a plurality of substantially vertical pins, each formed from a plurality of pin slice layers and each comprising a plurality of pin slices arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.

2. The heat sink of claim 1 , wherein the corrugated plate includes open space around each of said protrusions to allow flexibility.

3. The heat sink of claim 1 , wherein the plurality of pin slices layers each further comprises a plurality of curved links between pin slices.

4. The heat sink of claim 3 , wherein the curved links of adjacent pin slice layers are arranged vertically to block coolant to regions of lower coolant needs.

5. The heat sink of claim 3 , wherein the curved links of respective pin slice layers are omitted to increase coolant to regions of higher coolant needs.

6. The heat sink of claim 1 , further comprising a compressible layer disposed over the top plate, configured to distribute a load force to the top plate when the top plate is deformed.

7. The heat sink of claim 1 , wherein the bottom plate is disposed on a non-flat surface and conforms to the shape of the non-flat surface under load and wherein the vertically arranged pin slice layers communicate the shape of the non-flat surface to the top plate, which deforms vertically and laterally to conform to the non-flat surface.

8. A linked pin fin compliant heat sink, comprising:
a top and bottom plate, each comprising a plurality of pin contacts, wherein at least one of the top and bottom plates is a corrugated plate that includes interlocking protrusions on opposite sides of the plate and wherein the pin contacts are flexibly connected to one another by the top and bottom plates;
a plurality of pin slice layers, each comprising a plurality of pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates; and
a plurality of curved links connecting laterally adjacent pin slices in at least a pin slice layer.

9. The linked pin fin compliant heat sink of claim 8 , wherein the corrugated plate includes open space around each of said protrusions to allow flexibility.

10. The linked pin fin compliant heat sink of claim 8 , wherein the curved links between vertically adjacent pin slice layers are arranged to align vertically to block coolant to regions of lower coolant needs.

11. The linked pin fin compliant heat sink of claim 8 , wherein one or more curved links of at least a respective pin slice layer are omitted to increase coolant to regions of higher coolant needs.

12. The linked pin fin compliant heat sink of claim 8 , wherein curved links between corresponding pin slices on at least two adjacent layers curve in different directions with respect to one another.

13. The linked pin fin compliant heat sink of claim 8 , wherein the curved links have a thinner vertical cross-section than the pin slice layers.

14. The linked pin fin compliant heat sink of claim 8 , wherein the plurality of curved links are arranged to create regions of higher coolant flow and regions of lower coolant flow, such that coolant through the heat sink follows a specified path.

15. A heat sink, comprising:
a top and bottom plate, at least one of which comprises a plurality of pin contacts flexibly connected to one another, wherein the plurality of pin contacts have vertical and lateral flexibility with respect to one another, wherein at least one of the top and bottom plates is a corrugated plate that includes interlocking protrusions on opposite sides of the plate and wherein the pin contacts are flexibly connected to one another by the top and bottom plates;
a plurality of substantially vertical pins connecting the top and bottom plates; and
a compressible layer disposed over the top plate, configured to distribute a load force to the top plate when the top plate is deformed.

16. The heat sink of claim 15 , wherein the vertical pins comprise a plurality of pin slice layers, each comprising a plurality of pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.

17. The heat sink of claim 16 , wherein the bottom plate is disposed on a non-flat surface and conforms to the shape of the non-flat surface under load and wherein the vertically arranged pin slice layers communicate the shape of the non-flat surface to the top plate, which deforms vertically and laterally to conform to the non-flat surface.

18. The heat sink of claim 16 , wherein the plurality of pin slices layers each further comprises a plurality of curved links between pin slices.

19. The heat sink of claim 18 , wherein the curved links of adjacent pin slice layers are arranged vertically to block coolant to regions of lower coolant needs.

20. The heat sink of claim 18 , wherein the curved links of respective pin slice layers are omitted to increase coolant to regions of higher coolant needs.

Assignees

• IBM

Inventors

• Schultz Mark D

Classifications

• F28F3/022 Primary

  the means being wires or pins · CPC title

• B23P15/26

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title