Encapsulated filtered feedthrough for implantable medical devices

Patent metadata

Field	Value
Publication number	US-9937354-B2
Application number	US-201615080122-A
Country	US
Kind code	B2
Filing date	Mar 24, 2016
Priority date	Mar 31, 2015
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

First claim

What is claimed is:

1. A feedthrough assembly for an implantable medical device, comprising:
a ferrule configured to be attached to a device container of the implantable medical device;
an electrical insulator coupled to the ferrule by a first connection element;
a printed circuit board having a first side and a second side including a component attachment surface pad;
a feedthrough conductor extending through the electrical insulator and the printed circuit board, the feedthrough conductor coupled to the insulator by a second connection element;
a capacitor electrically coupled to the second side of the printed circuit board via a third attachment element, wherein the third attachment element is positioned between at least a portion of the capacitor and the component attachment surface pad, wherein a gap is formed between the capacitor and the second side of the printed circuit board;
a first non-conductive material disposed at least partially within the gap;
a mold defining an opening and located with respect to the second side of the printed circuit board such that at least a portion of the capacitor is positioned within the opening; and
a second non-conductive material disposed within the mold, the second non-conductive material encapsulating at least a portion of the capacitor.

2. The feedthrough assembly of claim 1 , further including:
a plurality of feedthrough conductors extending through the printed circuit board; and
a plurality of capacitors each associated with one of the plurality of feedthrough conductors, wherein the mold includes a plurality of openings such that at least one capacitor is positioned at least partially within a corresponding opening.

3. The feedthrough assembly of claim 1 , wherein at least two layers of the second non-conducting material and a portion of the mold are positioned between two adjacent capacitors.

4. The feedthrough assembly of claim 1 , wherein a height of the mold extends beyond a height of the capacitor.

5. The feedthrough assembly of claim 1 , wherein the first non-conductive material and the second non-conductive material are a different type of material from the mold.

6. The feedthrough assembly of claim 1 , wherein the first non-conductive material and the second non-conductive material include a curable epoxy resin and the mold includes silicone.

7. The feedthrough assembly of claim 1 , wherein the printed circuit board is a multi-layer circuit board.

8. An implantable medical device, including:
a device container including an electronic module within the device container;
a header including a header core and a header shell disposed around the header core, wherein at least one electrical contact is positioned within the header core; and
a feedthrough assembly configured to electrically couple the electronic module within the device container to the at least one electrical contact, the feedthrough assembly including:
a capacitor electrically coupled to a printed circuit board via an attachment element, wherein the attachment element is positioned between at least a portion of the capacitor and a component attachment surface pad of the printed circuit board, wherein a gap is formed between the capacitor and the printed circuit board;
a first non-conductive material disposed at least partially within the gap;
a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening; and
a second non-conductive material disposed within the mold, the second non-conductive material encapsulating at least a portion of the capacitor.

9. The implantable medical device of claim 8 , wherein the feedthrough assembly further includes:
a ferrule configured to be attached to the device container;
an electrical insulator coupled to the ferrule by an electrically conductive connection element;
a plurality of feedthrough conductors extending through the printed circuit board and the electrical insulator, the plurality of feedthrough conductors coupled to the electrical insulator by a second connection element; and
a plurality of capacitors each associated with one of the plurality of feedthrough conductors, wherein the mold includes a plurality of openings such that at least one capacitor is positioned at least partially within a corresponding opening.

10. The implantable medical device of claim 8 , wherein at least two layers of the second non-conducting material and a portion of the mold are positioned between two adjacent capacitors.

11. The implantable medical device of claim 8 , wherein the first non-conductive material and the second non-conductive material are a different type of material from the mold.

12. The implantable medical device of claim 8 , wherein the first non-conductive material and the second non-conductive material include a curable epoxy resin and the mold includes silicone.

Assignees

• Cardiac Pacemakers Inc

Inventors

• Barry Patrick J
• White Randy
• Kubow Steven A
• Spadgenske Scott A
• Chizek David A
• Sauber Jerald

Classifications

• H05K2201/10189

  Non-printed connector · CPC title

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title