Light-emitting diode module
US-2016126221-A1 · May 5, 2016 · US
System-in-package image sensor
US9935144B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9935144-B1 |
| Application number | US-201615362408-A |
| Country | US |
| Kind code | B1 |
| Filing date | Nov 28, 2016 |
| Priority date | Nov 28, 2016 |
| Publication date | Apr 3, 2018 |
| Grant date | Apr 3, 2018 |
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Abstract
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An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.
First claim
Opening claim text (preview).
What is claimed is: 1. An image sensor package, comprising: a ceramic substrate with a cavity disposed in the ceramic substrate; a glass layer adhered to the ceramic substrate and enclosing the cavity in the ceramic substrate; an image sensor disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor; an image sensor processor disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor; an application-specific integrated circuit disposed in the cavity in the ceramic substrate, and coupled to at least one of the image sensor or the image sensor processor; ledges disposed in the cavity of the ceramic substrate; and an interposer disposed on the ledges that spans a gap between the ledges, wherein the image sensor, the image sensor processor, and the application-specific integrated circuit are disposed on the interposer. 2. The image sensor package of claim 1 , wherein the glass layer is disposed proximate to an illuminated side of the image sensor, and wherein the glass layer is glued to elevated portions of the ceramic substrate. 3. The image sensor package of the claim 2 , wherein the image sensor includes a plurality of microlenses disposed on an illuminated surface of the image sensor and disposed between the glass layer and the image sensor. 4. The image sensor package of claim 1 , wherein the image sensor and the image sensor processor are disposed between the glass layer and the interposer, and wherein the application-specific integrated circuit is disposed between the ceramic substrate and the interposer. 5. The image sensor package of claim 4 , wherein the interposer includes electrical interconnects to couple the image sensor to the image sensor processor and the application-specific integrated circuit, and wherein the interposer is attached to the ledges. 6. The image sensor package of claim 1 , wherein the image sensor package is included in a car that is at least in part autonomous. 7. An image sensor package, comprising: a ceramic substrate with a cavity disposed in the ceramic substrate; a glass layer adhered to the ceramic substrate and enclosing the cavity in the ceramic substrate; an image sensor disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor; an image sensor processor disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor; and ledges disposed in the cavity of the ceramic substrate, wherein the image sensor is disposed on the ledges and spans a gap between the ledges, and wherein the image sensor processor is disposed on the ceramic substrate between the image sensor and the ceramic substrate, and wherein the image sensor is disposed between the image sensor processor and the glass layer. 8. The image sensor package of claim 7 , further comprising contact pads disposed on the ceramic substrate, wherein the image sensor and the image sensor processor are wire bonded to the contact pads.
Assignees
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between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Die-attach connectors and bond wires · CPC title
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9935144B1 cover?
- An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and elect…
- Who is the assignee on this patent?
- Omnivision Tech Inc
- What technology area does this patent fall under?
- Primary CPC classification H01L27/14618. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 03 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).