Semiconductor device chip manufacturing method

Patent metadata

Field	Value
Publication number	US-9935008-B2
Application number	US-201715633138-A
Country	US
Kind code	B2
Filing date	Jun 26, 2017
Priority date	Jul 6, 2016
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

Disclosed herein is a semiconductor device chip manufacturing method including a chipping prevention layer forming step of forming a chipping prevention layer at each intersection of a plurality of crossing division lines formed on the front side of a wafer, a modified layer forming step of applying a laser beam having a transmission wavelength to the wafer to the back side thereof along each division line in the condition where the focal point of the laser beam is set inside the wafer, thereby forming a modified layer inside the wafer along each division line, and a dividing step of grinding the back side of the wafer after performing the modified layer forming step, thereby reducing the thickness of the wafer and also dividing the wafer into individual semiconductor device chips along each division line where the modified layer is formed as a break start point.

First claim

What is claimed is:

1. A semiconductor device chip manufacturing method comprising:
a device forming step of forming a plurality of devices on a front side of a wafer formed of silicon, the front side of said wafer being partitioned by a plurality of crossing division lines to thereby define a plurality of separate regions where said respective devices are formed;
a chipping prevention layer forming step of forming a chipping prevention layer at each intersection of said crossing division lines formed on the front side of said wafer;
a protective tape attaching step of attaching a protective tape to the front side of said wafer after performing said device forming step and said chipping prevention layer forming step;
a modified layer forming step of applying a laser beam having a transmission wavelength to said wafer to the back side thereof along each division line in the condition where the focal point of said laser beam is set inside said wafer after performing said protective tape attaching step, thereby forming a modified layer inside said wafer along each division line; and
a dividing step of grinding the back side of said wafer after performing said modified layer forming step, thereby reducing the thickness of said wafer and also dividing said wafer into individual semiconductor device chips along each division line where said modified layer is formed as a break start point;
wherein said chipping prevention layer functions to prevent the occurrence of chipping due to rubbing of the corners of any adjacent ones of said semiconductor device chips.

2. The semiconductor device chip manufacturing method according to claim 1 , wherein said chipping prevention layer is selected from the group consisting of a metal film, nitride film, oxide film, diamond-like carbon film, and passivation film.

3. The semiconductor device chip manufacturing method according to claim 1 , wherein said crossing division lines extend so as to be inclined 45 degrees with respect to a notch or orientation flat formed on said wafer.

Assignees

• Disco Corp

Inventors

• Tateishi Toshiyuki

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H01L23/562

  Electricity · mapped topic

• H01L21/78 Primary

  Electricity · mapped topic