Transponder and booklet

Patent metadata

Field	Value
Publication number	US-9934459-B2
Application number	US-73558408-A
Country	US
Kind code	B2
Filing date	Oct 10, 2008
Priority date	Feb 22, 2008
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

A transponder includes an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet; a sealing material having electrical insulation is provided between the IC module and an inside face of the opening.

First claim

The invention claimed is:

1. A transponder comprising:
an IC inlet;
a first base material which is flexible;
an antenna sheet which is provided above one surface of the first base material, the antenna sheet comprising an antenna coil and having a first opening, the antenna sheet being included in the IC inlet;
an IC module provided on the one surface of the first base material, the IC module being connected to the antenna coil, at least a part of the IC module being provided in the first opening, the IC module being included in the IC inlet;
a second base material which has a second opening in which a part of the IC module is provided; and
a sealing resin having a first portion which fills a first space in the second opening, the first space not including a second space at which the part of the IC module is provided, wherein:
the sealing resin has a second portion which fills a third space vertically between a first area and a second area, the first area being not all, but part of one surface of the second base material, the first area surrounding a whole circumference of an open end of the second opening, and the second area being not all, but part of one surface of the antenna sheet,
the first and second portions of the sealing resin are formed in a single piece in which a first length of the sealing resin is larger than a second length of the sealing resin,
the sealing resin is provided surrounding a side surface of a sealing resin section which seals the IC chip,
the first length is, from the side surface, along a radial direction, and the first length being at a first height at which the sealing resin contacts the second area,
the second length is, from the side surface, along the radial direction, and the second length is at a second height which is a highest in the side surface,
the first area is the same as the second area when seen along an axis which is perpendicular to the one surface of the second base material, and
a third area is included in the first area when seen along the axis which is perpendicular to the one surface of the second base material, the third area being a part of the one surface of the first base material, the third area being an area on which the IC module is provided.

2. The transponder according to claim 1 , wherein the first portion of the sealing resin covers the outer surface of the IC module, and an outer surface of the second base material and an outer surface of the first portion of the sealing resin are continuous and roughly flat.

3. The transponder according to claim 2 , wherein a step between the outer surface of the second base material and the outer surface of the first portion of the sealing resin is no larger than 20 μm.

4. The transponder according to claim 1 , wherein the sealing resin covers a connection section between the antenna coil and the IC module, and a jumper line that connects the antenna coil to the IC module.

5. The transponder according to claim 1 , wherein the longitudinal elastic modulus of the sealing resin is less than the longitudinal elastic modulus of the sealing resin section, and
wherein the at least a part of the IC module is the sealing resin section.

6. The transponder according to claim 1 , wherein the sealing resin is a resin tape comprising a sticky material.

7. The transponder according to claim 6 , wherein the longitudinal elastic modulus of the sticky material is less than the longitudinal elastic modulus of a sealing resin section which seals the IC chip.

8. The transponder according to claim 1 , wherein the first base material is a cover material.

9. The transponder according to claim 1 , wherein a cover is joined to another surface of the first base material.

10. The transponder according to claim 1 , wherein the antenna sheet is made of the same material as the sealing resin.

11. The transponder according to claim 1 , further comprising a chloride ion-resistant layer which covers at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module.

12. The transponder according to claim 1 , further comprising a water-resistant layer which covers at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module.

13. The transponder according to claim 1 , wherein the first base material has a third opening provided at a region corresponding to an inside region where a lead frame of the IC module is provided.

14. The transponder according to claim 13 , wherein an area of the third opening is larger than an area of the second opening.

15. The transponder according to claim 1 , wherein the antenna sheet has a fourth opening provided at a region corresponding to an inside region where a loop of the antenna coil is provided.

16. The transponder according to claim 1 , wherein
the second opening is a through hole configured to penetrate the second base material, and
another base material is not provided on another surface of the second base material, the another surface of the second base material being an opposite surface of the one surface of the second base material.

17. The transponder according to claim 1 , wherein
the first base material does not have an opening in which the IC module is provided.

18. A booklet comprising a transponder, the transponder comprising:
an IC inlet;
a first base material which is flexible;
an antenna sheet which is provided above one surface of the first base material, the antenna sheet comprising an antenna coil and having a first opening, the antenna sheet being included in the IC inlet;
an IC module provided on the one surface of the first base material, the IC module being connected to the antenna coil, at least a part of the IC module being provided in the first opening, the IC module being included in the IC inlet;
a second base material which has a second opening in which a part of the IC module is provided; and
a sealing resin having a first portion which fills a first space in the second opening, the first space not including a second space at which the part of the IC module is provided, wherein:
the sealing resin has a second portion which fills a third space vertically between a first area and a second area, the first area being not all, but part of one surface of the second base material, the first area surrounding a whole circumference of an open end of the second opening, and the second area being not all, but part of one surface of the antenna sheet,
the first and second portions of the sealing resin are formed in a single piece in which a first length of the sealing resin is larger than a second length of the sealing resin,
the sealing resin is provided surrounding a side surface of a sealing resin section which seals the IC chip,
the first length is, from the side surface, along a radial direction, and the first length being at a first height at which the sealing resin contacts the second area,
the second length is, from the side surface, along the radial direction, and the second length is at a second height which is a highest in the side surface,
the first area is the same as the second area when seen along an axis which is perpendicular to the one surface of the second base material, and
a third area is included in the first area when seen along the axis which is perpendicular to the one surface of the second base material, the third area being a part of the one surface of the first base material, the third area being an area on which the IC module is provided.

Assignees

• Tanaka Junsuke
• Yamamoto Akihisa
• Maehira Makoto
• Mizuguchi Yoshiyuki
• Toppan Printing Co Ltd

Inventors

• Tanaka Junsuke
• Yamamoto Akihisa
• Maehira Makoto
• Mizuguchi Yoshiyuki

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H01L2924/00014

  Electricity · mapped topic

• H01L2924/01019

  Electricity · mapped topic

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title