Ic module, dual ic card, and method for manufacturing ic module

Patent metadata

Field	Value
Publication number	US-2016104064-A1
Application number	US-201514973457-A
Country	US
Kind code	A1
Filing date	Dec 17, 2015
Priority date	Jun 25, 2013
Publication date	Apr 14, 2016
Grant date	—

Abstract

An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.

First claim

What is claimed is:

1 . An IC module comprising:
a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having a first terminal and a second terminal formed thereon; a connecting coil formed on the first surface and having a first end and a second end; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first through hole and the second through hole as viewed in a thickness direction of the base, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.

2 . The IC module of claim 1 , wherein the IC chip and the contact terminal portion are connected via an auxiliary conductive wire inserted through an auxiliary through hole formed in the base.

3 . The IC module of claim 1 , further comprising a resin seal covering the IC chip, the first conductive wire, the second conductive wire, and the third conductive wire.

4 . A dual IC card comprising:
the IC module according to claim 1 ; and a plate-like card body provided with an antenna having a coupling coil electromagnetically coupled to the connecting coil of the IC module, and a main coil connected to the coupling coil to perform contactless communication with an external contactless machine, the card body having a recess formed therein to accommodate the IC module.

5 . A method for manufacturing an IC module, comprising:
preparing a sheet-like base having a first surface and a second surface; forming a connecting coil on the first surface; forming, in the base, a first through hole and a second through hole spaced apart from each other; forming, on the second surface, a contact terminal portion configured to contact an external contact machine; forming, on the second surface, bridge wiring electrically insulated from the contact terminal portion, the bridge wiring overlapping with the first through hole and the second through hole as viewed in a thickness direction of the base; mounting, on the first surface of the base, an IC chip having a contact communication function and a contactless communication function; connecting the first terminal of the IC chip to the bridge wiring via a first conductive wire inserted through the first through hole; connecting the bridge wiring to a first end of the connecting coil via a second conductive wire inserted through the second through hole; and connecting a second end of the connecting coil to the second terminal of the IC chip via a third conductive wire.

6 . The method for manufacturing an IC module of claim 5 , further comprising:
forming an auxiliary through hole in the base; and connecting the IC chip to the contact terminal portion via an auxiliary conductive wire inserted through the auxiliary through hole.

7 . The method for manufacturing an IC module of claim 5 , further comprising covering the IC chip, the first conductive wire, the second conductive wire, and the third conductive wire with a resin seal.

Assignees

• Toppan Printing Co Ltd

Inventors

• MIZOGUCHI Shonosuke
• Tsukada Tetsuya
• HATAKEYAMA Eriko

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title