Known good die testing for high frequency applications

Patent metadata

Field	Value
Publication number	US-9933455-B2
Application number	US-201514703677-A
Country	US
Kind code	B2
Filing date	May 4, 2015
Priority date	May 4, 2015
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

Embodiments contained in the disclosure provide a method and apparatus for testing an electronic device. An electronic device is installed in a test socket guide. A pusher tip applies a load to the guided coaxial spring probes and forces contact with pads on the device. Test and ground signals are routed through the device and test socket. The apparatus includes a socket having at least one guided coaxial spring probe pin. A socket guide shim is positioned between the receptacle for the electronic device and the socket. A socket guide aids positioning. A pusher tip is placed on the side opposite that of the guided coaxial spring probe pins. The pusher tip mates with a pusher shim and the pusher spring. A top is then placed on the assembly and acts to compress the pusher spring and engage the guided coaxial spring probe pins with the pads on the device.

First claim

What is claimed is:

1. An apparatus for testing an electronic device, comprising:
a socket with at least one guided coaxial spring probe pin, the guided coaxial spring probe pin having a microtube with an inner surface signal net and an outer surface ground net;
a socket guide shim positioned between a receptacle for an electronic device and the socket with at least one guided coaxial spring probe pin;
a socket guide mating with the socket guide shim and the socket with at least one guided coaxial spring probe pin;
a pusher tip mounted opposite to the socket with at least one guided coaxial spring probe pin and mating with the socket guide and an insert;
a pusher shim placed between the pusher tip and a pusher spring; and
a top compressing the pusher spring.

2. The apparatus of claim 1 , wherein the guided coaxial spring probe pin comprises:
a solder ball;
a probe head attached to the solder ball;
a barrel;
a spring disposed within the barrel; and
a probe bottom attached to a socket.

3. The apparatus of claim 2 , further comprising:
a conductor disposed within the barrel; and
the microtube disposed around the conductor.

4. The apparatus of claim 3 , wherein the microtube is disposed within the barrel.

5. The apparatus of claim 3 , wherein the microtube is formed of dielectric material.

6. The apparatus of claim 3 , wherein the spring routes a ground signal.

Assignees

• Qualcomm Inc

Inventors

• Song Young Kyu
• Hwang Kyu-Pyung

Classifications

• G01R31/2822

  of microwave or radiofrequency circuits (of attenuation, gain, e.g. using network analyzers G01R27/28) · CPC title

• G01R1/07314

  the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support (on an elastic support, e.g. a film, G01R1/0735) · CPC title

• G01R29/08

  Measuring electromagnetic field characteristics · CPC title

• G01R1/06722

  Spring-loaded · CPC title

• G01R1/045 Primary

  Sockets or component fixtures for RF or HF testing · CPC title