Polishing pad with grooved foundation layer and polishing surface layer

Patent metadata

Field	Value
Publication number	US-9931729-B2
Application number	US-201514727586-A
Country	US
Kind code	B2
Filing date	Jun 1, 2015
Priority date	Nov 29, 2011
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.

First claim

What is claimed is:

1. A polishing pad for polishing a substrate, the polishing pad comprising:
a foundation layer with a surface having a pattern of protrusions disposed thereon, each protrusion having a top surface and sidewalls; and
a non-continuous polishing surface layer attached to the foundation layer and comprising discrete portions, each discrete portion attached to the top surface of a corresponding one of the protrusions of the foundation layer, wherein the foundation layer has an energy loss factor of less than approximately 100 KEL at 1/Pa at 40° C., wherein the non-continuous polishing surface layer has an energy loss factor of greater than approximately 1000 KEL at 1/Pa at 40° C., and wherein the foundation layer and the non-continuous polishing surface layer together have an energy loss factor of less than approximately 100 KEL at 1/Pa at 40° C.

2. The polishing pad of claim 1 , wherein each discrete portion is further attached to a portion of the sidewalls of the corresponding one of the protrusions of the foundation layer.

3. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer is bonded directly to the foundation layer.

4. The polishing pad of claim 3 , wherein the non-continuous polishing surface layer is covalently bonded to the foundation layer.

5. The polishing pad of claim 1 , wherein the foundation layer has a compressibility of less than approximately 1% under a central pressure of 5 PSI.

6. The polishing pad of claim 1 , wherein the foundation layer has a hardness greater than approximately 75 Shore D.

7. The polishing pad of claim 1 , wherein the foundation layer comprises a polycarbonate material.

8. The polishing pad of claim 1 , wherein the foundation layer comprises a material selected from the group consisting of an epoxy board material and a metal sheet.

9. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer has a compressibility of greater than approximately 0.1% under a central pressure of 5 PSI.

10. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer has a hardness less than approximately 70 Shore D.

11. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer is a homogeneous polishing surface layer.

12. The polishing pad of claim 11 , wherein the homogeneous polishing surface layer comprises a thermoset polyurethane material.

13. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer has a pore density of closed cell pores approximately in the range of 6%-50% total void volume.

14. The polishing pad of claim 1 , wherein the foundation layer has a hardness approximately in the range of 70-90 Shore D, and the non-continuous polishing surface layer has a hardness approximately in the range of 50-60 Shore D.

15. The polishing pad of claim 1 , wherein the foundation layer has a hardness approximately in the range of 70-90 Shore D, and the non-continuous polishing surface layer has a hardness approximately in the range of 20-50 Shore D.

16. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer has a first modulus of elasticity, and the foundation layer has a second modulus of elasticity greater than approximately 10 times the first modulus of elasticity.

17. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer has a first modulus of elasticity, and the foundation layer has a second modulus of elasticity greater than approximately 100 times the first modulus of elasticity.

18. The polishing pad of claim 1 , wherein the non-continuous polishing surface layer has a thickness approximately in the range of 2-50 mils, and the foundation layer has a thickness of greater than approximately 20 mils.

19. The polishing pad of claim 1 , further comprising:
a detection region disposed in the foundation layer.

20. The polishing pad of claim 1 , further comprising:
an aperture disposed in the polishing pad, through the non-continuous polishing surface layer and the foundation layer; and
an adhesive sheet disposed on a back surface of the foundation layer but not in the aperture, the adhesive sheet providing an impermeable seal for the aperture at the back surface of the foundation layer.

21. The polishing pad of claim 1 , further comprising:
a sub pad, wherein the foundation layer is disposed proximate to the sub pad.

22. The polishing pad of claim 21 , wherein the foundation layer has a hardness approximately in the range of 70-90 Shore D, the non-continuous polishing surface layer has a hardness approximately in the range of 20-60 Shore D, and the sub pad has a hardness less than approximately 90 Shore A.

23. The polishing pad of claim 1 , wherein the foundation layer comprises a stack of sub layers.

Assignees

• Nexplanar Corp
• Cabot Microelectronics Corp

Inventors

• Lefevre Paul Andre
• Allison William C
• Scott Diane
• Lacasse James P

Classifications

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B24B37/22

  characterised by a multi-layered structure · CPC title

• B24B37/16

  characterised by the shape of the lapping plate surface, e.g. grooved · CPC title

• B24B37/24

  characterised by the composition or properties of the pad materials · CPC title

• B24B37/205

  provided with a window for inspecting the surface of the work being lapped · CPC title