Forming die and method of using the same

US9931684B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9931684-B2
Application numberUS-201514688219-A
CountryUS
Kind codeB2
Filing dateApr 16, 2015
Priority dateApr 18, 2014
Publication dateApr 3, 2018
Grant dateApr 3, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A draw die for use in a draw stage configured to process a work piece in a forming operation is provided. The draw die includes a first segment, a second segment positioned adjacent to the first segment, and an isolation material positioned between the first segment and the second segment and configured to substantially isolate the second segment from ultrasonic vibrations of the first segment.

First claim

Opening claim text (preview).

What is claimed is: 1. A draw die for use in a draw stage configured to process a work piece in a drawing operation, said draw die comprising: a first segment; a second segment positioned adjacent to said first segment, wherein at least one of said first segment and said second segment comprises an ultrasonic vibration generating system configured to receive power from a power supply; and a substantially non-compressible isolation material positioned between said first segment and said second segment and configured to substantially isolate said second segment from ultrasonic vibrations of said first segment. 2. The draw die in accordance with claim 1 , wherein said first segment and said second segment are included within an upper die of the draw stage. 3. The draw die in accordance with claim 1 , wherein said first segment and said second segment are included within a lower die of the draw stage. 4. The draw die in accordance with claim 1 , wherein the position of said first segment within the draw die corresponds to an area of the work piece under high stress relative to the rest of the work piece during the drawing operation. 5. The draw die in accordance with claim 1 , wherein the ultrasonic vibration generating system is configured to ultrasonically vibrate at least one of said first segment and said second segment during the drawing operation. 6. The draw die in accordance with claim 1 , wherein at least one of said first segment and said second segment is configured to be coupled to the ultrasonic vibration generating system. 7. The draw die in accordance with claim 1 , wherein at least one of said first segment and said second segment comprises a retaining feature configured to couple said first segment to said second segment while allowing movement of said first segment with respect to said second segment. 8. The draw die in accordance with claim 7 , wherein said retaining feature includes a channel defined within one of said first segment and said second segment and a guide extending from the other of said first segment and said second segment, wherein said guide fits within said channel and couples said first segment to said second segment. 9. A method of forming a drawn part from a work piece using a draw stage of a stamping operation, said method comprising: providing at least one segmented draw die on the draw stage, the at least one draw die including at least a first segment and a second segment substantially isolated from ultrasonic vibrations of the first segment by a substantially non-compressible isolation material between the first segment and the second segment; positioning the work piece within the draw stage; moving the segmented draw die toward the work piece; engaging the work piece with the segmented draw die; and ultrasonically vibrating at least one of the first segment and the second segment. 10. The method in accordance with claim 9 , wherein ultrasonically vibrating at least one of the first segment and the second segment comprises activating a vibration generating device. 11. The method in accordance with claim 9 , wherein ultrasonically vibrating at least one of the first segment and the second segment comprises selectively coupling a vibration generating device to at least one of the first segment and the second segment. 12. The method in accordance with claim 9 , wherein ultrasonically vibrating at least one of the first segment and the second segment comprises providing a vibration generating device included within the first segment with energy, causing the vibration generating device to vibrate the first segment. 13. The method in accordance with claim 9 , wherein ultrasonically vibrating at least one of the first segment and the second segment comprises controlling at least one of a direction of the vibration and an amplitude of the vibration. 14. An ultrasonic segmented die system, comprising: a segmented die that includes at least: a first die segment, a second die segment, and a substantially non-compressible isolation material positioned between the first and second die segments and configured to substantially isolate the second die segment from ultrasonic vibrations of the first die segment; a power supply; an ultrasonic vibration generating system operatively coupled to at least one of said first die segment and said second die segment, wherein said ultrasonic vibration generating system is configured to receive power from said power supply; and a system controller communicatively coupled to, and configured to control operation of, at least one of said power supply and said, ultrasonic vibration generating system. 15. The system of claim 14 , wherein said ultrasonic vibration generating system comprises an ultrasonic vibration generating device, an ultrasonic transmission apparatus, and an ultrasonic connecting member, wherein said ultrasonic transmission apparatus is coupled between said ultrasonic vibration generator and said ultrasonic connecting member and configured to transmit the mechanical motion to said ultrasonic connecting member which is coupled to at least one of said first die segment and said second die segment. 16. The system of claim 14 , wherein said ultrasonic vibration generating system is at least one of positioned at least partially within, and operatively coupled to, at least one of said first and second die segment. 17. The system of claim 14 , wherein controlling operation of said ultrasonic segmented die system comprises controlling when ultrasonic vibrations are generated, the direction of generated vibrations, and the amplitude of generated vibrations. 18. The system of claim 14 , wherein at least one of said first die segment and said die second segment comprises a retaining feature configured to couple said first die segment to said second die segment while allowing movement of said first die segment with respect to said second die segment.

Assignees

Inventors

Classifications

  • B21D35/008Primary

    involving vibration, e.g. ultrasonic · CPC title

  • with devices for holding the edge of the blanks (B21D22/24 - B21D22/30 take precedence; shaping over a die without external former B21D11/02) · CPC title

  • Deep-drawing (special deep-drawing arrangements in, or in connection with, presses B21D24/00) · CPC title

  • Die sets; Pillar guides · CPC title

  • Additional equipment in association with the tools, e.g. for shearing, for trimming · CPC title

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What does patent US9931684B2 cover?
A draw die for use in a draw stage configured to process a work piece in a forming operation is provided. The draw die includes a first segment, a second segment positioned adjacent to the first segment, and an isolation material positioned between the first segment and the second segment and configured to substantially isolate the second segment from ultrasonic vibrations of the first segment.
Who is the assignee on this patent?
Honda Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification B21D35/008. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 03 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).