Ultrasonic excitation of segmented dies

US9539632B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9539632-B2
Application numberUS-201514802386-A
CountryUS
Kind codeB2
Filing dateJul 17, 2015
Priority dateJul 17, 2014
Publication dateJan 10, 2017
Grant dateJan 10, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for reducing areas of friction within a forming die that includes identifying at least one region of interest in the forming die, wherein the at least one region of interest further includes a problematic aspect of a predetermined nature; designing a die segment corresponding to the at least one region of interest, wherein the die segment further includes at least one ultrasonic transducer embedded therein; modifying the forming die to receive the die segment; installing the die segment in the forming die and acoustically isolating the die segment from the remainder of the forming die; and energizing the ultrasonic transducer to provide ultrasonic energy to the die segment, wherein providing ultrasonic energy to the die segment addresses the problematic aspect of the at least one region of interest in the forming die.

First claim

Opening claim text (preview).

What is claimed: 1. A method for reducing areas of friction within a forming die, comprising: (a) providing a forming die, wherein the forming die is adapted for use in sheet metal forming processes, and wherein the forming die includes surfaces that contact sheet metal being formed by the forming die; (b) identifying at least one region of friction between the surfaces of the forming die and the sheet metal being formed by the forming die; (c) designing a die segment corresponding to the at least one region of friction, wherein the designed die segment includes at least one ultrasonic transducer embedded completely within the die segment, and wherein the at least one ultrasonic transducer is surrounded on all sides by the material of the designed die segment; (d) modifying the forming die to receive the designed die segment that includes the at least one ultrasonic transducer embedded completely within the designed die segment; (e) installing the designed die segment in the forming die and acoustically isolating the designed die segment from the remainder of the forming die; and (f) creating a three-dimensional, ultrasonically vibrating, acoustically resonating die segment by energizing the at least one ultrasonic transducer to provide ultrasonic energy to the installed designed die segment, wherein providing ultrasonic energy to the installed designed die segment reduces friction between the surfaces of the forming die and the sheet metal being formed by the forming die. 2. The method of claim 1 , wherein the sheet metal is used for manufacturing automobile parts. 3. The method of claim 1 , wherein acoustically isolating the designed die segment from the remainder of the forming die further includes placing low friction pads between the designed die segment and the forming die. 4. A forming die for use with sheet metal processes, comprising: (a) a forming die body, wherein the forming die body includes: (i) surfaces that contact sheet metal being formed by the forming die; and (ii) at least one opening created in the forming die body at a region of friction between the surfaces of the forming die body that contact the sheet metal and the sheet metal itself; (b) a designed die segment, wherein the designed die segment is inserted into the opening in forming die body, and wherein the designed die segment includes: (i) at least one ultrasonic transducer embedded completely within the die segment, (ii) wherein the at least one ultrasonic transducer is surrounded on all sides by the material of the designed die segment for creating a three-dimensional, ultrasonically vibrating, acoustically resonating die segment and directing ultrasonic vibrations into the die segment; and (c) at least one vibration-isolating device positioned between the designed die segment and the forming die body, wherein the at least one vibration isolating device prevents ultrasonic vibrations from the designed die segment from entering the forming die body. 5. The forming die of claim 4 , wherein the at least one vibration-isolating device is a low friction pad. 6. The forming die of claim 4 , wherein the sheet metal is used for manufacturing automobile parts. 7. The forming die of claim 4 , wherein the at least one ultrasonic transducer includes piezoceramics, and wherein the piezoceramics have been pre-compressed prior to the at least one ultrasonic transducer being embedded in the designed die segment. 8. The forming die of claim 7 , wherein the piezoceramics have been pre-compressed with a compression bolt. 9. The forming die of claim 7 , wherein the piezoceramics have been pre-compressed with tapered shims.

Assignees

Inventors

Classifications

  • Making tools by operations not covered by a single other subclass · CPC title

  • involving vibration, e.g. ultrasonic · CPC title

  • B21D22/02Primary

    Stamping using rigid devices or tools · CPC title

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Frequently asked questions

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What does patent US9539632B2 cover?
A method for reducing areas of friction within a forming die that includes identifying at least one region of interest in the forming die, wherein the at least one region of interest further includes a problematic aspect of a predetermined nature; designing a die segment corresponding to the at least one region of interest, wherein the die segment further includes at least one ultrasonic transd…
Who is the assignee on this patent?
Graff Karl, Edison Welding Inst Inc
What technology area does this patent fall under?
Primary CPC classification B21D22/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 10 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).