Method for producing functional device and apparatus for producing functional device

Patent metadata

Field	Value
Publication number	US-9929188-B2
Application number	US-201214357138-A
Country	US
Kind code	B2
Filing date	Nov 7, 2012
Priority date	Nov 9, 2011
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

According to the present invention, a method of producing a functional device includes the imprinting step and the functional solid material layer formation step. In the imprinting step, a functional solid material precursor layer obtained from a functional solid material precursor solution as a start material is imprinted so that a first temperature of a heat source for supplying heat to the functional solid material precursor layer is higher than a second temperature of the functional solid material precursor layer in at least part of a time period while a mold for forming an imprinted structure is pressed against the functional solid material precursor layer. In the functional solid material layer formation step, after the imprinting step, the functional solid material precursor layer is heat treated at a third temperature higher than the first temperature in an atmosphere containing oxygen to form a functional solid material layer from the functional solid material precursor layer.

First claim

The invention claimed is:

1. A method of producing a functional device, the method comprising:
imprinting a functional solid material precursor layer obtained from a functional solid material precursor solution as a starting material, the functional solid material precursor layer obtained from the functional solid material precursor solution by baking the functional solid material precursor solution at a preliminary baking temperature in a range from 80° C. to 250° C., wherein a first temperature of a heat source for supplying heat to the functional solid material precursor layer is higher than a second temperature of the functional solid material precursor layer in at least part of a time period while a mold for forming an imprinted structure is pressed against the functional solid material precursor layer;
increasing the first temperature during at least a portion of the time period while the mold is pressed against the functional solid material precursor layer;
forming, after the imprinting step, a functional solid material layer from the functional solid material precursor layer by heat treating the functional solid material precursor layer at a third temperature higher than the first temperature in an atmosphere containing oxygen; and
causing a difference in temperature between the mold and a base upon which a substrate including the functional solid material precursor layer is mounted.

2. The method of producing a functional device according to claim 1 , wherein
the heat source includes a heater for heating the mold.

3. The method of producing a functional device according to claim 1 , wherein
the part of the time period corresponds to at least 20 when the mold is pressed for the time period corresponding to 100.

4. The method of producing a functional device according to claim 1 , wherein
the first temperature is higher than the preliminary baking temperature and is in a range from 90° C. to 300° C.

5. The method of producing a functional device according to claim 1 , wherein
the preliminary baking temperature in a preliminary baking step of forming the functional solid material precursor layer is lower than a boiling point of a solvent of the functional solid material precursor solution, and
the first temperature is higher than the boiling point of the solvent.

6. The method of producing a functional device according to claim 1 , wherein
the imprinting step is executed by applying a pressure in a range from 1 MPa to 20 MPa.

7. The method of producing a functional device according to claim 1 , wherein
the imprinting step includes at least one of a mold separation process from a surface of the functional solid material precursor layer and a mold separation process from an imprinting surface of the mold, and then imprinting the functional solid material precursor layer.

8. The method of producing a functional device according to claim 1 , further comprising:
between the imprinting step and the functional solid material layer formation step, a step of entirely etching the functional solid material precursor layer under a condition where the functional solid material precursor layer is removed in a thinnest region in the imprinted functional solid material precursor layer.

9. The method of producing a functional device according to claim 1 , wherein
the functional device is a thin film transistor, and
the functional solid material layer serves as at least one selected from the group consisting of a gate electrode layer, a gate insulating layer, a source layer, a drain layer, and a channel layer in the thin film transistor.

10. The method of producing a functional device according to claim 1 , wherein
the functional device is a memory transistor, and
the functional solid material layer serves as at least one selected from the group consisting of a gate electrode layer, a ferroelectric layer, a source layer, a drain layer, and a channel layer in the memory transistor.

11. The method of producing a functional device according to claim 1 , wherein
the functional device is a capacitor, and
the functional solid material layer serves as a dielectric layer and/or an electrode layer.

12. The method of producing a functional device according to claim 1 , wherein
the functional device is an actuator including a piezoelectric layer, and
the functional solid material layer serves as the piezoelectric layer.

13. The method of producing a functional device according to claim 1 , wherein
the functional device is an optical device including a base material provided thereon with a plurality of latticed layers, and
the functional solid material layer serves as the latticed layer.

14. The method of producing a functional device according to claim 1 , wherein
the heat source includes a heater for heating the base.

15. The method of producing a functional device according to claim 14 , wherein
the mold is higher in temperature than the base by at least 10° C.

16. The method of producing a functional device according to claim 1 , wherein
the functional solid material precursor solution includes at least one selected from the group consisting of:
a solution containing metal alkoxide;
a solution containing a metal organic acid salt;
a solution containing a metal inorganic acid salt;
a solution containing metal halide;
a solution including an inorganic compound containing metal, nitrogen, and hydrogen; and
a solution containing metal hydride.

17. The method of producing a functional device according to claim 16 , wherein
the functional solid material precursor solution includes at least one selected from the group consisting of the solution containing metal alkoxide, the solution containing a metal organic acid salt, and the solution containing a metal inorganic acid salt, and
in the imprinting step, the functional solid material precursor layer is transformed into the functional solid material layer at a volume shrinkage factor in a range from 20% to 80%.

18. The method of producing a functional device according to claim 16 , wherein
the functional solid material precursor solution includes at least one selected from the group consisting of:
the solution containing metal halide;
the solution including an inorganic compound containing metal, nitrogen, and hydrogen; and
the solution containing metal hydride; and
in the functional solid material layer formation step, the functional solid material precursor layer is transformed into the functional solid material layer at a volume shrinkage factor in a range from 1% to 30%.

Assignees

• Japan Science & Tech Agency

Inventors

• Shimoda Tatsuya
• Kaneda Toshihiko

Classifications

• H10P72/0431

  Apparatus for thermal treatment · CPC title

• H10D30/701

  IGFETs having ferroelectric gate insulators, e.g. ferroelectric FETs · CPC title

• H01L45/1206

  Electricity · mapped topic

• B41J2/1637

  molding · CPC title

• H01L27/10805

  Electricity · mapped topic