Integrated circuit wave device and method

Patent metadata

Field	Value
Publication number	US-9929110-B1
Application number	US-201615395456-A
Country	US
Kind code	B1
Filing date	Dec 30, 2016
Priority date	Dec 30, 2016
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A method of forming, and a resulting, an integrated circuit wave device. The method (i) affixes an integrated circuit die relative to a substrate; (ii) creates a form relative to the integrated circuit die and the substrate; and (iii) forms a wave shaping member having a shape conforming at least in part to a shape of the form.

First claim

The invention claimed is:

1. A method of forming an integrated circuit wave device, comprising: affixing an integrated circuit die relative to a substrate;
creating a form relative to the integrated circuit die and the substrate, the form comprising a sublimatable material covering the integrated circuit die and at least a portion of the substrate;
forming a wave shaping member over the form so that an inner surface of the wave shaping member that faces the integrated circuit die has a shape conforming at least in part to a shape of the form, and so that the wave shaping member has an aperture, wherein the wave shaping member comprises a lens comprising integrated circuit packaging material; and
sublimating the sublimatable material so as to exhaust gas through the aperture.

2. The method of claim 1 :
wherein the wave shaping member is operable to shape a wave comprising a bandwidth; and wherein the step of creating a form comprises creating the form comprising a material with at most a negligible effect on the bandwidth.

3. The method of claim 1 wherein the step of forming a wave shaping member comprises forming a reflector.

4. The method of claim 1 wherein the step of forming a wave shaping member comprises forming the wave shaping member adjacent the form.

5. The method of claim 4 and further comprising forming an encapsulating integrated circuit packaging material adjacent the wave shaping member.

6. The method of claim 5 :
wherein the step of forming an encapsulating integrated circuit packaging material comprises forming the encapsulating integrated circuit packaging material having an aperture.

7. The method of claim 6 and further comprising sealing the aperture after the sublimating step.

8. The method of claim 1 : wherein the wave shaping member is operable to shape a wave comprising a bandwidth; and
wherein the substrate comprises a material with at most a negligible effect on the bandwidth.

9. The method of claim 1 :
wherein the step of forming a lens from integrated circuit packaging material comprises forming the integrated circuit packaging material having the aperture.

10. The method of claim 1 wherein the step of forming the wave shaping member comprises forming a path comprising the aperture, wherein the path is laterally displaced from a side edge of the sublimatable material.

11. The method of claim 1 wherein the step of creating a form comprises creating a form comprising a stair-step profile.

12. The method of claim 1 wherein the step of creating a form comprises 3D printing the form.

13. The method of claim 1 :
wherein the wave shaping member is operable to shape a wave comprising a bandwidth; and wherein the bandwidth comprises a radio frequency bandwidth.

14. The method of claim 1 :
wherein the wave shaping member is operable to shape a wave comprising a bandwidth; and wherein the bandwidth comprises an infrared bandwidth.

15. The method of claim 1 :
wherein the wave shaping member is operable to shape a wave comprising a bandwidth; and wherein the bandwidth comprises visible light bandwidth.

16. The method of claim 1 :
wherein the wave shaping member is operable to shape a wave comprising a bandwidth; and wherein the bandwidth comprises ultraviolet bandwidth.

17. The method of claim 1 wherein the integrated circuit comprises a transmitter or receiver.

18. The method of claim 1 , wherein the inner surface defines an interior cavity that is substantially filled by the form.

19. The method of claim 1 , wherein the inner surface is concave relative to the integrated circuit die.

20. An integrated circuit wave device, comprising:
an integrated circuit die affixed to a substrate; and
a wave shaping member disposed over the integrated circuit die and having an inner surface facing the integrated circuit die, the inner surface conforming at least in part to a shape of a form that was affixed to the substrate during manufacture of the integrated circuit wave device, wherein the inner surface defines an interior cavity formed by exhausting sublimated gas through an aperture of the wave shaping member, wherein the wave shaping member comprises a lens comprising integrated circuit packaging material, and the integrated circuit die is affixed to the substrate within the interior cavity.

21. The integrated circuit wave device of claim 20 , wherein the interior cavity separates the integrated circuit die from the inner surface.

Assignees

• Texas Instruments Inc

Inventors

• Male Barry Jon
• Cook Benjamin
• Neidorff Robert Alan
• Kummerl Steve

Classifications

• G02B19/0014 Primary

  at least one surface having optical power · CPC title

• G02B19/0023

  at least one surface having optical power · CPC title

• G02B19/0076

  for use with a detector (G02B19/009, G02B19/0095 take precedence) · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/01

  Manufacture or treatment · CPC title