Multilayer deformable liquid-metal circuits and interconnects with improved reliability
US-2026040462-A1 · Feb 5, 2026 · US
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Cook Benjamin patents
Cook Benjamin is listed as an inventor on 65 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cook Benjamin |
| Total patents | 65 |
| First publication | Feb 19, 2015 |
| Latest publication | Feb 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Conductive and corrosive-resistant liquid metal compositions and electronic devices using same
US-2026040438-A1 · Feb 5, 2026 · US
Antenna in package for wearable system in flexible component applications
US-2026016856-A1 · Jan 15, 2026 · US
Ladders and ladder bracing
US-12523095-B2 · Jan 13, 2026 · US
Methods and processes for stretchable multi-layer circuits and systems and methods of use thereof
US-2025386439-A1 · Dec 18, 2025 · US
Systems and methods for entity resolution
US-12481660-B2 · Nov 25, 2025 · US
Ladders, rung assemblies for ladders and related methods
US-12215547-B2 · Feb 4, 2025 · US
Electronic sensors with sensor die in package structure cavity
US-12187601-B2 · Jan 7, 2025 · US
Systems and methods for entity resolution
US-2024427775-A1 · Dec 26, 2024 · US
Stress isolation using three-dimensional trenches
US-2024391758-A1 · Nov 28, 2024 · US
Recent patents
Latest publications not already listed above.
Stress isolation using three-dimensional trenches
US-12054385-B2 · Aug 6, 2024 · US
Implantable medical device including a tine housing
US-11992675-B2 · May 28, 2024 · US
Flexible electronic system for flexible wearable devices and other electronic devices
US-2024126217-A1 · Apr 18, 2024 · US
Shielding integrated inductors
US-2024006466-A1 · Jan 4, 2024 · US
Ladders and ladder bracing
US-2023399893-A1 · Dec 14, 2023 · US
Ladders and ladder bracing
US-11788354-B2 · Oct 17, 2023 · US
Passive component q factor enhancement with elevated resistance region of substrate
US-2022406649-A1 · Dec 22, 2022 · US
Integrated circuit with a galvanically-isolated commuincation channel using a back-side etched channel
US-2022406956-A1 · Dec 22, 2022 · US
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
US-11498831-B2 · Nov 15, 2022 · US
Stress isolation using three-dimensional trenches
US-2022242722-A1 · Aug 4, 2022 · US
Semiconductor devices and methods and apparatus to produce such semiconductor devices
US-11296016-B2 · Apr 5, 2022 · US
Solder printing
US-2022059439-A1 · Feb 24, 2022 · US
Implantable medical device including a tine housing
US-2021236814-A1 · Aug 5, 2021 · US
Microelectromechanical system (mems) device with backside pinhole release and re-seal
US-2021214212-A1 · Jul 15, 2021 · US
Circularly-polarized dielectric waveguide launch for millimeter-wave data communication
US-11011815-B2 · May 18, 2021 · US
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
US-2020354214-A1 · Nov 12, 2020 · US
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
US-10723616-B2 · Jul 28, 2020 · US
Ladders, rung assemblies for ladders and related methods
US-2020165868-A1 · May 28, 2020 · US
Zeeman splitting vector magnetometer apparatus and method
US-10634738-B2 · Apr 28, 2020 · US
Package for chip scale magnetometer or atomic clock
US-10539630-B2 · Jan 21, 2020 · US
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