Methods for preventing plasma un-confinement events in a plasma processing chamber

Patent metadata

Field	Value
Publication number	US-9928995-B2
Application number	US-82002010-A
Country	US
Kind code	B2
Filing date	Jun 21, 2010
Priority date	Jun 8, 2006
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A method for configuring a plasma processing chamber for preventing a plasma un-confinement event during processing of a substrate from occurring outside of a confined plasma sustaining region is provided. The confined plasma sustaining region is defined by a set of confinement rings surrounding a bottom portion of an electrode is provided. The method includes determining a worst-case Debye length for a plasma generated in the plasma processing chamber during the processing. The method also includes performing at least one of adjusting gaps between any pair of adjacent confinement rings and adding at least one additional confinement ring to ensure that a gap between the any pair of adjacent confinement rings is less than the worst-case Debye length.

First claim

What is claimed is:

1. A method for configuring a plasma processing chamber for preventing a plasma un-confinement event, during processing of a substrate, from occurring outside of a confined plasma sustaining region, wherein said confined plasma sustaining region is defined by a set of confinement rings disposed at a chamber gap that surrounds a bottom portion of an electrode, said method comprising:
determining a worst case Debye length for a plasma generated in said plasma processing chamber during said processing; and
performing at least one of adjusting gaps between any pair of adjacent confinement rings and adding at least one additional confinement ring, the performing includes,
determining that a gap provided between any pair of said adjacent confinement rings is less than the worst-case Debye length that was determined for plasma generated in said processing chamber so as to substantially prevent the plasma un-confinement event from occurring, and
adjusting the gap such that the gap provides a path for exhaustion of byproduct gases from the plasma sustaining region, and the gap does not allow sealing the path for exhaustion of the byproduct gases,

wherein said worst-case Debye length is determined empirically.

2. The method of claim 1 wherein said performing represents both of said adjusting said gaps and said adding said at least one additional confinement ring.

3. The method of claim 1 wherein said performing represents said adjusting said gaps without said adding said at least one additional confinement ring.

4. The method of claim 1 wherein said performing represents said adding at least one additional confinement ring without said adjusting said gaps.

5. The method of claim 1 further comprising:
identifying a condition conducive for igniting a plasma outside said confined plasma sustain region, wherein said condition occurs along a radio frequency (RF) current path; and
employing a dielectric shielding structure for shielding at least a portion of said condition from surrounding gas spaces.

6. A method for configuring a plasma processing chamber for preventing a plasma un-confinement event, during processing of a substrate, from occurring outside of a confined plasma sustaining region, wherein said confined plasma sustaining region is defined by a set of confinement rings disposed at a chamber gap that surrounds a bottom portion of an electrode, said method comprising:
determining a worst case Debye length for a plasma generated in said plasma processing chamber during said processing; and
performing at least one of adjusting gaps between any pair of adjacent confinement rings and adding at least one additional confinement ring, the performing includes,
determining that a gap provided between any pair of said adjacent confinement rings is less than the worst-case Debye length that was determined for the plasma generated in said plasma processing chamber so as to substantially prevent the plasma un-confinement event from occurring,
adjusting the gap such that the gap provides a path for exhaustion of byproduct gases from the plasma sustaining region, and the gap does not allow sealing the path for exhaustion of the byproduct gases;

identifying a gap between mating surfaces of adjacent chamber components, said gap being disposed along a radio frequency (RF) current path; and
employing a dielectric shielding structure for shielding at least a portion of said gap from surrounding gas spaces in said plasma processing chamber during said processing.

7. A method for configuring a plasma processing chamber for preventing a plasma un-confinement event during processing of a substrate from occurring outside of a confined plasma sustaining region, wherein said confined plasma sustaining region is defined by a set of confinement rings disposed at a chamber gap that surrounds a bottom portion of an electrode, said method comprising:
determining a worst case Debye length for a plasma generated in said plasma processing chamber during said processing; and
performing at least one of adjusting gaps between any pair of adjacent confinement rings and adding at least one additional confinement ring, the performing includes,
determining that a gap provided between any pair of said adjacent confinement rings is less than the worst-case Debye length that was determined for the plasma generated in said plasma processing chamber so as to substantially prevent the plasma un-confinement event from occurring, and
adjusting the gap such that the gap provides a path for exhaustion of byproduct gases from the plasma sustaining region, and the gap does not allow sealing the path for exhaustion of the byproduct gases;

identifying a chamber component with a sharp component structure along a radio frequency (RF) current path; and
employing a dielectric shielding structure for shielding at least a portion of said sharp component structure from surrounding gas spaces in said plasma processing chamber during said processing.

Assignees

• Fischer Andreas
• Dhindsa Rajinder
• Lam Res Corp

Inventors

• Fischer Andreas
• Dhindsa Rajinder

Classifications

• Y10T29/49718

  Repairing · CPC title

• H01J37/32082

  Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title

• H01J37/32623

  Mechanical discharge control means · CPC title

• H01J37/32495 Primary

  Means for protecting the vessel against plasma · CPC title

• C23C16/00 Primary

  Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C14/00) · CPC title