Polishing pad and polishing method

US2016016292A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016016292-A1
Application numberUS-201414774681-A
CountryUS
Kind codeA1
Filing dateFeb 27, 2014
Priority dateMar 12, 2013
Publication dateJan 21, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.

First claim

Opening claim text (preview).

1 . A polishing pad comprising a polishing member having a polishing surface, wherein the polishing member comprises a material having dilatancy characteristics. 2 . The polishing pad according to claim 1 , wherein the material having the dilatancy characteristics comprises a resin having dilatancy characteristics, or an inorganic particle composition having dilatancy characteristics which comprises inorganic particles and medium liquid. 3 . The polishing pad according to claim 2 , wherein the material having the dilatancy characteristics which comprises the resin having the dilatancy characteristics further comprises inorganic particles. 4 . The polishing pad according to claim 2 , wherein the resin having the dilatancy characteristics comprises a silicone resin having dilatancy characteristics. 5 . The polishing pad according to claim 1 , wherein the polishing member comprises a sheet-like fiber base material, and the material having the dilatancy characteristics with which the fiber base material is impregnated. 6 . The polishing pad according to claim 1 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics with which an interior of the recess part is filled. 7 . A polishing method comprising a step of polishing an object to be polished using the polishing pad according to claim 1 . 8 . The polishing pad according to claim 3 , wherein the resin having the dilatancy characteristics comprises a silicone resin having dilatancy characteristics. 9 . The polishing pad according to claim 2 , wherein the polishing member comprises a sheet-like fiber base material, and the material having the dilatancy characteristics with which the fiber base material is impregnated. 10 . The polishing pad according to claim 3 , wherein the polishing member comprises a sheet-like fiber base material, and the material having the dilatancy characteristics with which the fiber base material is impregnated. 11 . The polishing pad according to claim 4 , wherein the polishing member comprises a sheet-like fiber base material, and the material having the dilatancy characteristics with which the fiber base material is impregnated. 12 . The polishing pad according to claim 2 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics with which an interior of the recess part is filled. 13 . The polishing pad according to claim 3 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics with which an interior of the recess part is filled. 14 . The polishing pad according to claim 4 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics with which an interior of the recess part is filled. 15 . The polishing pad according to claim 5 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics with which an interior of the recess part is filled. 16 . A polishing method comprising a step of polishing an object to be polished using the polishing pad according to claim 2 . 17 . A polishing method comprising a step of polishing an object to be polished using the polishing pad according to claim 3 . 18 . A polishing method comprising a step of polishing an object to be polished using the polishing pad according to claim 4 . 19 . A polishing method comprising a step of polishing an object to be polished using the polishing pad according to claim 5 . 20 . A polishing method comprising a step of polishing an object to be polished using the polishing pad according to claim 6 .

Assignees

Inventors

Classifications

  • B24D13/00Primary

    Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor · CPC title

  • Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title

  • characterised by the composition or properties of the pad materials · CPC title

  • characterised by a multi-layered structure · CPC title

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What does patent US2016016292A1 cover?
The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
Who is the assignee on this patent?
Univ Kyushu Nat Univ Corp, Fujibo Holdings Inc
What technology area does this patent fall under?
Primary CPC classification B24D13/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jan 21 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).