Vertical inline CVD system

Patent metadata

Field	Value
Publication number	US-9922854-B2
Application number	US-201113098253-A
Country	US
Kind code	B2
Filing date	Apr 29, 2011
Priority date	Apr 30, 2010
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.

First claim

The invention claimed is:

1. An apparatus, comprising:
a substrate loading station having a center wall, the substrate loading station having two substrate loading locations that are disposed on opposite sides of the center wall;
a robot disposed directly adjacent to the substrate loading locations and operable to retrieve a horizontally oriented substrate from a substrate stacking module and to place the substrate into the substrate loading locations in a vertical orientation relative to the horizontal orientation;
a load lock chamber coupled to the substrate loading station, the load lock chamber having two substrate locations that are disposed on opposite sides of the center wall;
a processing chamber capable of high temperature processing coupled to the load lock chamber, the processing chamber having two substrate loading locations that are disposed on opposite sides of one or more processing sources;
a substrate carrier service station coupled to the processing chamber; and
a substrate carrier moveable between the substrate loading station, the load lock chamber, the processing chamber, and the substrate carrier service station, wherein in order to compensate for thermal expansion due to high temperature processing, each of the load lock chamber and the processing chamber comprises a fixed point and a foot portion slidable along a piece of low friction material and each of the loading station and the substrate carrier service station comprise a foot portion movable along a piece of low friction material, and wherein the foot portions of the loading station and the load lock chamber allow for movement of the loading station and the load lock chamber in a first direction and the foot portions of the processing chamber and the substrate carrier service station allow for movement of the processing chamber and the substrate carrier service station in a second direction opposite the first direction.

2. The apparatus of claim 1 , wherein the one or more processing sources comprises a plurality of microwave sources.

3. The apparatus of claim 1 , wherein the processing chamber has two lids, one corresponding to each opposite side of the center wall, and each lid is coupled to a vacuum source at four separate locations.

4. The apparatus of claim 3 , wherein the two lids are each movable away from the center wall to expose the inside of the processing chamber and wherein tubes that couple the processing chamber to the vacuum source are movable with the lids.

5. The apparatus of claim 1 , wherein the substrate loading station is an atmospheric station and wherein the load lock chamber and the processing chamber are vacuum chambers.

6. An apparatus, comprising:
two substrate loading stations, each station having a center wall, wherein each substrate loading station has two substrate loading locations that are disposed on opposite sides of the center wall;
two robots, wherein each robot is disposed directly adjacent the two substrate loading locations of each respective substrate loading station, each robot being operable to retrieve a horizontally oriented substrate from a substrate stacking module and place a substrate into each substrate loading location in a vertical orientation relative to the horizontal orientation;
two load lock chambers, each load lock chamber coupled to a corresponding substrate loading station, each load lock chamber having two substrate locations that are disposed on opposite sides of the center wall;
two processing chambers, each processing chamber coupled to a corresponding load lock chamber, each processing chamber having two substrate loading locations that are disposed on opposite sides of one or more processing sources;
two substrate carrier service stations, each substrate carrier service station coupled to a corresponding processing chamber; and
a plurality of substrate carriers moveable between the substrate loading stations, the load lock chambers, the processing chambers, and the substrate carrier service stations, wherein in order to compensate for thermal expansion due to high temperature processing, each of the load lock chambers and the processing chambers comprise a fixed point and a foot portion slidable along a piece of low friction material and each of the loading stations and the substrate carrier service stations comprise a foot portion movable along a piece of low friction material, and wherein the foot portions of the loading stations and the load lock chambers allow for movement of the loading stations and the load lock chambers in a first direction and the foot portions of the processing chambers and the substrate carrier service stations allow for movement of the processing chambers and the substrate carrier service stations in a second direction opposite the first direction.

7. The apparatus of claim 6 , wherein the one or more processing sources comprises a plurality of microwave sources.

8. The apparatus of claim 6 , wherein each processing chamber has two lids, one corresponding to each opposite side of the center wall, and each lid is coupled to a vacuum source at four separate locations.

9. The apparatus of claim 8 , wherein the two lids are each movable away from the center wall to expose the inside of the processing chamber and wherein tubes that couple the processing chamber to the vacuum source are movable with the lids.

10. The apparatus of claim 6 , wherein each substrate loading station is an atmospheric station and wherein each load lock chamber and each processing chamber are vacuum chambers.

Assignees

• Kurita Shinichi
• Kudela Jozef
• Anwar Suhail
• White John M
• Yim Dong Kil
• Wolf Hans Georg
• Zvalo Dennis
• Inagawa Makoto
• Mori Ikuo
• Applied Materials Inc

Inventors

• Kurita Shinichi
• Kudela Jozef
• Anwar Suhail
• White John M
• Yim Dong-Kil
• Wolf Hans Georg
• Zvalo Dennis
• Inagawa Makoto
• Mori Ikuo

Classifications

• H10P72/0431

  Apparatus for thermal treatment · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0456

  in-line arrangement · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title