Methods of forming photonic device structures

Patent metadata

Field	Value
Publication number	US-9921471-B2
Application number	US-201414495278-A
Country	US
Kind code	B2
Filing date	Sep 24, 2014
Priority date	Sep 24, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A method of forming a photonic device structure comprises forming a photoresist over a photonic material over a substrate. The photoresist is exposed to radiation through a gray-tone mask to form at least one photoexposed region and at least one non-photoexposed region of the photoresist. The at least one photoexposed region of the photoresist or the at least one non-photoexposed region of the photoresist is removed to form photoresist features. The photoresist features and unprotected portions of the photonic material are removed to form photonic features. Other methods of forming a photonic device structure, and a method of forming an electronic device are also described.

First claim

What is claimed is:

1. A method of forming a photonic device structure, comprising:
forming a photoresist over a photonic material over a substrate;
exposing the photoresist to radiation through a gray-tone mask to form at least one photoexposed region and at least one non-photoexposed region of the photoresist;
removing the at least one photoexposed region of the photoresist or the at least one non-photoexposed region of the photoresist to form photoresist features; and
removing the photoresist features and substantially all portions of the photonic material unprotected by the photoresist features to form photonic features exhibiting substantially the same dimensions exhibited by at least one of the photoresist features prior to the removal thereof, the photonic features exhibiting one or more of an at least partially stepped cross-sectional shape, an at least partially negatively sloped cross-sectional shape, an at least partially positively sloped cross-sectional shape, and an at least partially arcuate cross-sectional shape.

2. The method of claim 1 , wherein the photonic material comprises a silicon-containing material.

3. The method of claim 1 , wherein the photonic material comprises at least one of polysilicon, single-crystal silicon, silicon nitride, silicon-germanium, germanium, gallium arsenide, gallium nitride, or indium phosphide.

4. The method of claim 1 , wherein exposing the photoresist to radiation through a gray-tone mask to form photoexposed regions and non-photoexposed regions comprises forming different portions of the at least one photoexposed region to extend to different depths within the photoresist.

5. The method of claim 1 , wherein exposing the photoresist to radiation through a gray-tone mask comprises forming at least one of the at least one photoexposed region or the at least one non-photoexposed region to exhibit a substantially symmetric shape.

6. The method of claim 1 , wherein exposing the photoresist to radiation through a gray-tone mask comprises forming at least one of the at least one photoexposed region or the at least one non-photoexposed region to exhibit a substantially asymmetric shape.

7. The method of claim 1 , wherein removing the photoresist features and unprotected portions of the photonic material comprises simultaneously removing the photoresist features and the unprotected portions of the photonic material.

8. The method of claim 1 , wherein removing the photoresist features and substantially all portions of the photonic material unprotected by the photoresist features comprises exposing the photoresist features and substantially all portions of the photonic material unprotected by the photoresist features to an anisotropic etching process.

9. The method of claim 1 , wherein forming a photoresist over a photonic material over a substrate comprises forming the photonic material from a material comprising a higher refractive index than the material of the substrate.

10. The method of claim 1 , wherein forming a photoresist over a photonic material over a substrate comprises forming the photoresist over the photonic material, the photonic material comprising a thickness of greater than or equal to about 20 nanometers.

11. The method of claim 1 , wherein forming a photoresist over a photonic material over a substrate comprises forming the photoresist over the photonic material, the photonic material comprising a thickness of from about 150 nanometers to about 300 nanometers.

12. The method of claim 1 , wherein forming a photoresist over a photonic material over a substrate comprises forming the photoresist over the photonic material, the photonic material comprising a thickness of from about 100 nanometers to about 400 nanometers.

13. A method of forming a photonic device structure, comprising:
forming a photoresist on a photonic material overlying a substrate, the photonic material comprising at least one of polysilicon, single-crystal silicon, silicon nitride, silicon-germanium, germanium, gallium arsenide, gallium nitride, or indium phosphide;
exposing the photoresist to radiation through a gray-tone mask to form at least one photoexposed region and at least one non-photoexposed region of the photoresist;
removing the at least one photoexposed region of the photoresist or the at least one non-photoexposed region of the photoresist to form at least one photoresist feature exhibiting an at least partially stepped cross-sectional shape; and
substantially completely removing the at least one photoresist feature and portions of the photonic material unprotected by at least a portion of the at least one photoresist feature to form at least one photonic feature exhibiting substantially the same shape and substantially the same dimensions that were exhibited by the at least one photoresist feature prior to the substantially complete removal of the at least one photoresist feature.

14. A method of forming a photonic device structure, comprising:
forming a photoresist over a photonic material over a substrate;
exposing the photoresist to radiation through a gray-tone mask to form at least one photoexposed region of the photoresist and at least one non-photoexposed region of the photoresist, the at least one non-photoexposed region of the photoresist exhibiting one or more of an at least partially stepped cross-sectional shape, an at least partially negatively sloped cross-sectional shape, an at least partially positively sloped cross-sectional shape, and an at least partially arcuate cross-sectional shape;
removing the at least one photoexposed region of the photoresist to form at least one photoresist feature exhibiting substantially the same cross-sectional shape and substantially the same dimensions as the at least one non-photoexposed region of the photoresist; and
removing the at least one photoresist feature and all portions of the photonic material laterally adjacent the at least one photoresist feature to form at least one photonic feature exhibiting substantially the same cross-sectional shape and substantially the same dimensions that were exhibited by the at least one photoresist feature prior to the removal of the at least one photoresist feature.

Assignees

• Micron Technology Inc

Inventors

• Meade Roy E
• Sandhu Gurtej S

Classifications

• G03F7/0005 Primary

  Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor · CPC title

• G02B6/00

  Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings · CPC title

• G03F7/70283

  Mask effects on the imaging process · CPC title

• G02B6/136

  by etching · CPC title