Auto-alignment of backer plate for direct docking test boards

Patent metadata

Field	Value
Publication number	US-9921268-B2
Application number	US-201514945011-A
Country	US
Kind code	B2
Filing date	Nov 18, 2015
Priority date	Nov 18, 2015
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A test probe aligner for aligning a test probe card with devices under test of a wafer is provided. The test probe aligner includes a backer plate arranged with its bottom side to the test probe card, and a stiffener mounted to the test probe card outside a horizontal dimension of the backer plate. The stiffener and a top side of the backer plate end in a same plane above the test probe card. The alignment further includes a bridge beam locked to a top side of the stiffener. Furthermore, the test probe aligner also includes at least two actuators and at least two corresponding force measurement sensors below a top surface of the bridge beam, arranged such that forces are applicable to the test probe card.

First claim

What is claimed is:

1. A method of aligning a test probe card with devices under test of a wafer, said method comprising:
arranging a backer plate with its bottom side to said test probe card;
mounting a stiffener to said test probe card outside a horizontal dimension of said backer plate, the stiffener being contained vertically within a perimeter of the test probe card, wherein said stiffener and a top side of said backer plate end in a same plane above said test probe card;
locking to a top side of said stiffener a bridge beam above said stiffener; and
positioning at least two actuators and at least two corresponding force measurement sensors below a top surface of said bridge beam such that forces are applicable to said test probe card, the at least two actuators being disposed at least partially in the bridge beam adjacent to the backer plate to engage the backer plate and apply force to the backer plate.

2. The method according to claim 1 , further comprising measuring a force applied by each actuator of said at least two actuators using a corresponding force measurement sensor of said at least two corresponding force measurement sensors.

3. The method according to claim 2 , further comprising:
identifying an actuator of the at least two actuators applying a maximum force; and
applying a same force by the at least two actuators, wherein said same force is above a predefined threshold force value.

4. The method according to claim 3 , further comprising:
pre-aligning a wafer under test with pins of said test probe card; and
providing electrical contacts between the pins of the test probe card and said device under test.

5. The method according to claim 4 , further comprising determining whether said pins of said test probe card provide an electrical contact to said device under test.

6. The method according to claim 5 , further comprising:
based on said determination confirming that one or more of said pins of said test probe card does not have an electrical contact to said device under test, increasing a force on said test probe card using one actuator of said at least two actuators corresponding to a region above an area of said test probe card in which an electrical contact is not established.

7. The method of claim 1 , wherein the backer plate comprises backer plate material in vertical alignment with, and extending over, a pin field of the test probe card to a dimension wider than the pin field.

8. A test probe aligner for aligning a test probe card with devices under test of a wafer, said test probe aligner comprising:
a backer plate arranged with its bottom side to said test probe card;
a stiffener mounted to said test probe card outside a horizontal dimension of said backer plate, the stiffener being contained vertically within a perimeter of the test probe card, wherein said stiffener and a top side of said backer plate end in a same plane above said test probe card;
a bridge beam locked to a top side of said stiffener; and
at least two actuators and at least two corresponding force measurement sensors below a top surface of said bridge beam, arranged such that forces are applicable to said test probe card, the at least two actuators being disposed at least partially in the bridge beam adjacent to the backer plate to engage the backer plate and apply force to the backer plate.

9. The test probe aligner according to claim 8 , wherein said at least two actuators and said at least two corresponding force measurement sensors are positioned inside said bridge beam.

10. The test probe aligner according to claim 8 , wherein a lower side of said at least two actuators align with a lower side of said bridge beam.

11. The test probe aligner according to claim 8 , wherein said at least two actuators and said at least two corresponding force measurement sensors are positioned inside said backer plate.

12. The test probe aligner according to claim 8 , wherein one actuator of said at least two actuators and a corresponding one force measurement sensor of said at least two corresponding force measurement sensors are positioned within a predefined environment.

13. The test probe aligner according to claim 8 , wherein said wafer is fixed to a chuck which is movable vertically to a plane defined by said test probe card.

14. The test probe aligner according to claim 8 , wherein said forces applicable to said test probe card have a same vector direction as a chuck move direction.

15. The test probe aligner according to claim 8 , wherein said at least two actuators are piezo actuators.

16. The test probe aligner according to claim 8 , wherein said at least two actuators are hydraulic based.

17. The test probe aligner according to claim 8 , wherein said backer plate extends over edges of said devices under test.

18. A computer readable storage medium storing instructions for execution for performing a method, the method comprising:
measuring a force applied by each actuator of at least two actuators using a corresponding force measurement sensor of at least two corresponding force measurement sensors, the at least two actuators and the at least two corresponding force measurement sensors being positioned below a top surface of a bridge beam locked to a top side of a stiffener mounted to a test probe card such that forces are applicable to said test probe card, the test probe card to be aligned with devices under test, and wherein a backer plate is arranged with its bottom side to said test probe card and wherein the stiffener is mounted to said test probe card outside a horizontal dimension of said backer plate, the stiffener being contained vertically within a perimeter of the test probe card, wherein said stiffener and a top side of said backer plate end in a same plane above said test probe card, and wherein the at least two actuators are disposed at least partially in the bridge beam adjacent to the backer plate to engage the backer plate and apply force to the backer plate;
pre-aligning a wafer under test with pins of said test probe card;
providing electrical contacts between the pins of the test probe card and said device under test;
determining whether said pins of said test probe card provide an electrical contact to said device under test; and
based on said determination confirming that one or more of said pins of said test probe card does not have an electrical contact to said device under test, increasing a force on said test probe card.

19. The computer program product according to claim 18 , wherein the method further comprises:
identifying an actuator of the at least two actuators applying a maximum force; and
applying a same force by the at least two actuators, wherein said same force is above a predefined threshold force value.

20. The computer program product according to claim 19 , wherein based on said determination confirming that one or more of said pins of said test probe card does not have an electrical contact to said device under test, increasing the force on said test probe card using one actuator of said at least two actuators corresponding to a region above an area of said test probe card in which an electrical contact is not established.

Assignees

• IBM

Inventors

• DENGLER Eberhard
• Kuczera Gabriele
• Kunigkeit Eckhard
• TOMASCHKO Siegfried
• Trianni Quintino Lorenzo

Classifications

• G01R31/2887

  involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392) · CPC title

• G01R31/2891 Primary

  related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05) · CPC title

• G01R1/06794

  Devices for sensing when probes are in contact, or in position to contact, with measured object · CPC title