Cleaning composition and cleaning method

Patent metadata

Field	Value
Publication number	US-9920287-B2
Application number	US-201514714526-A
Country	US
Kind code	B2
Filing date	May 18, 2015
Priority date	May 20, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A cleaning composition includes (A) at least one compound selected from the group consisting of a fatty acid that includes a hydrocarbon group having 8 to 20 carbon atoms, a phosphonic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, a sulfuric acid ester that includes a hydrocarbon group having 3 to 20 carbon atoms, an alkenylsuccinic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, and salts thereof, (B) an organic acid, (C) a water-soluble amine, (D) a water-soluble polymer, and an aqueous medium, the cleaning composition having a pH of 9 or more.

First claim

What is claimed is:

1. A cleaning composition comprising:
(A) at least one compound selected from the group consisting of a fatty acid that includes a hydrocarbon group having 8 to 20 carbon atoms, an alkenylsuccinic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, and salts thereof;
(B) an organic acid;
(C) a water-soluble amine;
(D) a water-soluble polymer; and
an aqueous medium,
the cleaning composition having a pH of 9.2 or more,
wherein a content of component (A) in the cleaning composition is 0.0001 to 0.1 mass %, based on a total mass of the cleaning composition,
wherein a content of component (B) in the cleaning composition is 0.0001 to 0.1 mass %, based on a total mass of the cleaning composition,
wherein a content of component (C) in the cleaning composition is 0.0001 to 0.1 mass %, based on a total mass of the cleaning composition,
wherein a content of component (D) in the cleaning composition is 0.0001 to 1 mass %, based on a total mass of the cleaning composition, and
wherein the cleaning composition is suitable for cleaning a wiring board.

2. The cleaning composition according to claim 1 ,
wherein the component (B) is an amino acid.

3. The cleaning composition according to claim 2 ,
wherein the amino acid is at least one amino acid selected from the group consisting of tryptophan, phenylalanine, arginine, and histidine.

4. The cleaning composition according to claim 1 ,
wherein the component (C) is an alkanolamine.

5. The cleaning composition according to claim 1 ,
wherein the component (D) is at least one water-soluble polymer selected from the group consisting of poly(meth)acrylic acid and a polyalkylene glycol.

6. The cleaning composition according to claim 1 ,
wherein a cleaning target surface of the wiring board includes a wiring material and a barrier metal material, the wiring material being copper or tungsten, and the barrier metal material being at least one material selected from the group consisting of tantalum, titanium, cobalt, ruthenium, manganese, and compounds thereof.

7. The cleaning composition according to claim 6 ,
wherein the cleaning target surface includes a part in which the wiring material and the barrier metal material come in contact with each other.

8. The cleaning composition according to claim 1 ,
wherein an absolute value of a difference in corrosion potential between copper and cobalt when immersed in the cleaning composition is 0.1 V or less.

9. A cleaning method comprising contacting a wiring board with the cleaning composition according to claim 1 , the wiring board including a wiring material and a barrier metal material, the wiring material being copper or tungsten, and the barrier metal material being at least one material selected from the group consisting of tantalum, titanium, cobalt, ruthenium, manganese, and compounds thereof.

10. The cleaning composition according to claim 1 ,
wherein the component (A) comprises a fatty acid that includes a hydrocarbon group haying 8 to 20 carbon atoms, or a salt thereof.

11. The cleaning composition according to claim 1 ,
wherein the component (A) comprises an alkenylsuccinic acid that includes a hydrocarbon group haying 3 to 20 carbon atoms, or a salt thereof.

12. The cleaning composition according to claim 2 ,
wherein the amino acid comprises tryptophan.

13. The cleaning composition according to claim 2 ,
wherein the amino acid comprises phenylalanine.

14. The cleaning composition according to claim 2 ,
wherein the amino acid comprises arginine.

15. The cleaning composition according to claim 2 ,
wherein the amino acid comprises histidine.

16. The cleaning composition according to claim 1 ,
wherein the component (D) comprises poly(meth)acrylic acid.

17. The cleaning composition according to claim 1 ,
wherein the component (D) comprises a polyalkylene glycol.

Assignees

• Jsr Corp

Inventors

• Hayama Takahiro
• Arakawa Megumi
• Kushida Yuki
• Mitsumoto Kiyotaka
• Kamei Yasutaka
• Noda Masahiro
• Yamanaka Tatsuya

Classifications

• C11D1/37 Primary

  Mixtures of compounds all of which are anionic · CPC title

• C11D7/3209

  Amines or imines with one to four nitrogen atoms; Quaternized amines · CPC title

• C11D3/3757

  (Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions · CPC title

• C11D3/3707

  Polyethers, e.g. polyalkyleneoxides · CPC title

• C11D3/361

  Phosphonates, phosphinates or phosphonites · CPC title